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ISTFA 2013

November 3–7, 2013

San Jose, California, USA

Conference Sponsors:

ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis

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2013 IPFA Best Paper
Package Level Failure Analysis
Failure Analysis Process
Circuit Edit
In-Line Metrology and Inspection
Advanced Techniques
Nanoprobing
Package Level Failure Analysis
Photon Based Techniques
Poster Session
Sample Preparation
Test, Diagnostics, and Yield Enhancement
Volume Information

ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis

2013 IPFA Best Paper

Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry

W. Qiu; M.S. Wei; J. Gaudestad; V.V. Talanov

ISTFA 2013; 1-6doi:https://doi.org/10.31399/asm.cp.istfa2013p0001

Package Level Failure Analysis

3D Void Imaging in Through Silicon Vias by X-Ray Nanotomography in an SEM

David Laloum; Frédéric Lorut; Pierre Bleuet; Guillaume Audoit; Celine Ribiere

ISTFA 2013; 7-11doi:https://doi.org/10.31399/asm.cp.istfa2013p0007

Challenges for Physical Failure Analysis of 3D-Integrated Devices—Sample Preparation and Analysis to Support Process Development of TSVs

Andreas Meyer; Gabriele Grimm; Michael Hecker; Martin Weisheit; Eckhard Langer

ISTFA 2013; 12-16doi:https://doi.org/10.31399/asm.cp.istfa2013p0012

Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices

Laurens Kwakman; Marcus Straw; Gaëlle Coustillier; Marc Sentis; Jens Beyersdorfer; Jan Schischka; Falk Naumann; Frank Altmann

ISTFA 2013; 17-26doi:https://doi.org/10.31399/asm.cp.istfa2013p0017

Fast and Precise 3D Tomography of TSV by Using Xe Plasma FIB

Tomáš Hrnčíř; Lukáš Hladík

ISTFA 2013; 27-32doi:https://doi.org/10.31399/asm.cp.istfa2013p0027

Electro Optical Terahertz Pulse Reflectometry—A Fast and Highly Accurate Non-Destructive Fault Isolation Technique for 3D Flip Chip Packages

Stephane Barbeau; Jesse Alton; Martin Igarashi

ISTFA 2013; 264-269doi:https://doi.org/10.31399/asm.cp.istfa2013p0264

Open Localization in Micro LeadFrame Package Using Space Domain Reflectometry

J. Gaudestad; V. Talanov; A. Orozco; M. Marchetti

ISTFA 2013; 270-273doi:https://doi.org/10.31399/asm.cp.istfa2013p0270

Nondestructive Analysis Solution Using Combination of Lock-In Thermography (LIT) and 3D Oblique X-Ray CT Technology

Naoki Seimiya; Takuhei Watanabe; Takashi Ichinomiya

ISTFA 2013; 274-276doi:https://doi.org/10.31399/asm.cp.istfa2013p0274

Sub-mohms Resistance Characterization of Conductive Interfaces on Automotive Power MOSFET to Determine the Origin of On-Resistance Drift

Yann Weber; Philippe Rousseille

ISTFA 2013; 277-282doi:https://doi.org/10.31399/asm.cp.istfa2013p0277

Analysis of Power MOSFET Active Temperature Cycling Failures

Ian Kearney

ISTFA 2013; 283-291doi:https://doi.org/10.31399/asm.cp.istfa2013p0283

Failure Analysis on Lifted Ball Bond and Micro Lateral Crack Using Fractography Approach

Yong Foo Khong; Michael Raj Marks

ISTFA 2013; 292-296doi:https://doi.org/10.31399/asm.cp.istfa2013p0292

Planar Analysis of Copper-Aluminium Intermetallics

G.M. O’Halloran; Arjan van Ijzerloo; Rene Rongen; Frank Zachariasse

ISTFA 2013; 297-300doi:https://doi.org/10.31399/asm.cp.istfa2013p0297

A Comprehensive Approach to Lifted Bond Balls Package Failure

Dat Nguyen; Sagar Karki

ISTFA 2013; 301-305doi:https://doi.org/10.31399/asm.cp.istfa2013p0301

Failure Analysis Process

22 nm BEOL TDDB Defect Localization and Root Cause Analysis

Terence Kane; Yun Yu Wang

ISTFA 2013; 33-39doi:https://doi.org/10.31399/asm.cp.istfa2013p0033

Open Failure Diagnosis Candidate Selection Based on Passive Voltage Contrast Potential and Processing Cost

Yan Pan; Oh Chong Khiam; Nyi Ohnmar; Chuan Zhang; Sekar Kannan; Atul Chittora; Goh Szu Huat; Ma Yinzhe; Don Nedeau; Lim Seng Keat; Jeffrey Lam

ISTFA 2013; 40-45doi:https://doi.org/10.31399/asm.cp.istfa2013p0040

Effective Defect Localization on Nanoscale Short Failures

Jiang Huang; Ryan Sweeney; Laurent Dumas; Mark Johnston; Pei-Yi Chen; Jeremy Russell

ISTFA 2013; 46-48doi:https://doi.org/10.31399/asm.cp.istfa2013p0046

Defect Isolation Tools Accelerate the Failure Analysis Process

Adam Winterstrom; Kevin Meehan; Ralph Sanchez; Rich Ackerman

ISTFA 2013; 49-58doi:https://doi.org/10.31399/asm.cp.istfa2013p0049

First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures

Simon Gousseau; Stéphane Moreau; David Bouchu; Alexis Farcy; Pierre Montmitonnet; Karim Inal; François Bay

ISTFA 2013; 59-68doi:https://doi.org/10.31399/asm.cp.istfa2013p0059

The Application of Magnetic Force Microscopy for Detection of Subsurface Anomalies in Semiconductor Device Wiring Levels

Phil Kaszuba; Frank Alwine; Leon Moszkowicz; Randy Wells

ISTFA 2013; 69-74doi:https://doi.org/10.31399/asm.cp.istfa2013p0069

Computed Tomography as Failure Analysis Insurance

Gerald M. Martinez

ISTFA 2013; 75-85doi:https://doi.org/10.31399/asm.cp.istfa2013p0075

Challenges of Small Defect Analysis in Large Analog Power FET Arrays

Eric Cattey

ISTFA 2013; 86-90doi:https://doi.org/10.31399/asm.cp.istfa2013p0086

Conversion of a D-Mode FET to an E-Mode FET via Electrostatic Discharge in a GaAs Power Amplifier Duplexer Module

Rose Emergo; Steve Brockett

ISTFA 2013; 91-94doi:https://doi.org/10.31399/asm.cp.istfa2013p0091

Marginal RF Gain Investigation and Root Cause Determination

Keith Harber; Steve Brockett

ISTFA 2013; 95-98doi:https://doi.org/10.31399/asm.cp.istfa2013p0095

Anamnesis in Failure Analysis—How a System-Related Approach Can Save Failure Analysis (FA) Time, Shorten Learning Loops and Reduce Cost

Peter Jacob

ISTFA 2013; 99-104doi:https://doi.org/10.31399/asm.cp.istfa2013p0099

Failure Analysis for SRAM Logic Type Failures

Zhigang Song; Felix Beaudoin; Stephen Lucarini; John Sylvestri; Laura Safran; Manuel Villallobos; Richard Oldrey

ISTFA 2013; 105-110doi:https://doi.org/10.31399/asm.cp.istfa2013p0105

Circuit Edit

Circuit Edit Geometric Trends

Michael DiBattista; Martin Parley; Don Lyons; Roddy Cruz; Alan Wu; Jamie Langley; Jonathan Lau; Ray Stevens

ISTFA 2013; 111-117doi:https://doi.org/10.31399/asm.cp.istfa2013p0111

Implications of Helium and Neon Ion Beam Chemistry for Advanced Circuit Editing

H. Wu; D. Ferranti; L.A. Stern; D. Xia; M.W. Phaneuf

ISTFA 2013; 118-122doi:https://doi.org/10.31399/asm.cp.istfa2013p0118

Silicon and Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing and General Packaging Failure Analysis

Steven B. Herschbein; Carmelo F. Scrudato; George K. Worth; Edward S. Hermann

ISTFA 2013; 123-133doi:https://doi.org/10.31399/asm.cp.istfa2013p0123

In-Line Metrology and Inspection

Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication

Younan Hua; Nistala Ramesh Rao; Yanjing Yang; Siping Zhao; Redkar Shailesh

ISTFA 2013; 134-137doi:https://doi.org/10.31399/asm.cp.istfa2013p0134

Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch

Wentao Qin; Dorai Iyer; Jim Morgan; Carroll Casteel; Robert Watkins; Rod Crowder; Mike Thomason

ISTFA 2013; 138-143doi:https://doi.org/10.31399/asm.cp.istfa2013p0138

Gate Leakage Characterization and Fail Mode Analysis on 20 nm Technology Parametric Test Structures

Satish Kodali; Wayne Zhao; Greg M. Johnson; Felix Beaudoin

ISTFA 2013; 144-148doi:https://doi.org/10.31399/asm.cp.istfa2013p0144

STEM EDX Mappings and Tomography for Process Characterization and Physical Failure Analysis of Advanced Devices

Kevin Lepinay; Frederic Lorut; Roland Pantel; Thierry Epicier

ISTFA 2013; 149-151doi:https://doi.org/10.31399/asm.cp.istfa2013p0149

Automatic Registering and Stitching of TEM/STEM Image Mosaics

Chung-Ching Lin; Franco Stellari; Lynne Gignac; Peilin Song; John Bruley

ISTFA 2013; 152-158doi:https://doi.org/10.31399/asm.cp.istfa2013p0152

AFM-Based Chemical and Mechanical Property Characterization of Interconnects and Defects

Michael Lo; Eoghan Dillon; Qichi Hu; Kevin Kjoller; Roshan Shetty; Craig Prater; Sean W. King

ISTFA 2013; 159-161doi:https://doi.org/10.31399/asm.cp.istfa2013p0159

Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding

B. Domengès; France T. Delaroque; Ch. Gautier; K. Danilo; E. Le Flao

ISTFA 2013; 162-167doi:https://doi.org/10.31399/asm.cp.istfa2013p0162

Advanced Techniques

Pump-Probe Imaging of Integrated Circuits

David Stoker; Michael Bruce; Eric Lavelle; Erik Matlin; James Potthast; Christopher Sakai; Neil Troy

ISTFA 2013; 168-172doi:https://doi.org/10.31399/asm.cp.istfa2013p0168

Two-Photon-Absorption-Enhanced Laser-Assisted Device Alteration and Single-Event Upsets in 28 nm Silicon Integrated Circuits

K.A. Serrels; N. Leslie; T.R. Lundquist; P. Vedagarbha; K. Erington; D. Bodoh; C. Farrell; D.T. Reid

ISTFA 2013; 173-181doi:https://doi.org/10.31399/asm.cp.istfa2013p0173

A Superconducting Nanowire Single-Photon Detector (SnSPD) System for Ultra Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuits

Franco Stellari; Alan J. Weger; Seongwon Kim; Dzmitry Maliuk; Peilin Song; Herschel A. Ainspan; Young Kwark; Christian W. Baks; Ulrike Kindereit; Vikas Anant; Ted Lundquist

ISTFA 2013; 182-188doi:https://doi.org/10.31399/asm.cp.istfa2013p0182

3D Magnetic Field Imaging for Non-Destructive Fault Isolation

A. Orozco; J. Gaudestad; N.E. Gagliolo; C. Rowlett; E. Wong; A. Jeffers; B. Cheng; F.C. Wellstood; A.B. Cawthorne; F. Infante

ISTFA 2013; 189-193doi:https://doi.org/10.31399/asm.cp.istfa2013p0189

Time-Resolved Thermoreflectance Imaging for Thermal Testing and Analysis

Kazuaki Yazawa; Dustin Kendig; Ali Shakouri

ISTFA 2013; 194-202doi:https://doi.org/10.31399/asm.cp.istfa2013p0194

Nanoprobing

Advantage of AFP Nanoprobing on the 28 nm Technology Failure Analysis

C.Q. Chen; G.B. Ang; S.P. Zhao; Q. Alfred; N. Dayanand; K. Dnyan; B.H. Liu

ISTFA 2013; 203-207doi:https://doi.org/10.31399/asm.cp.istfa2013p0203

Optical Nanoprobe Electrical Microscopy

Stephen Ippolito; Michael Tenney; Sweta Pendyala; Larry Fischer; John Sylvestri; Darrell Miles; Rich Oldrey; Manuel Villalobos; Scott Dinkel; Terry Kane; Bruce Redder; Pat McGinnis

ISTFA 2013; 208-212doi:https://doi.org/10.31399/asm.cp.istfa2013p0208

Device Characterization Using AFP Nanoprobing for the Localization of New Product Design Weakness

Ghim Boon Ang; Alfred Quah; Changqing Chen; Si Ping Zhao; Dayanand Nagalingam; Yan Li; Soh Ping Neo; Redkar Shailesh

ISTFA 2013; 213-216doi:https://doi.org/10.31399/asm.cp.istfa2013p0213

SEM-Based Nanoprobing on 40, 32 and 28 nm CMOS Devices Challenges for Semiconductor Failure Analysis

Erik Paul; Holger Herzog; Sören Jansen; Christian Hobert; Eckhard Langer

ISTFA 2013; 217-221doi:https://doi.org/10.31399/asm.cp.istfa2013p0217

The Unique and Completed Characteristics of Device Behaviors in the Nanoprobing Analysis and Application for Missing LDD

LiLung Lai

ISTFA 2013; 222-227doi:https://doi.org/10.31399/asm.cp.istfa2013p0222

A Study of Electron Beam Irradiation Influence on Device Contact Junction Characteristics of Advanced DRAM Using Atomic Force Probing

Wei-Chih Wang; Jian-Shing Luo

ISTFA 2013; 228-235doi:https://doi.org/10.31399/asm.cp.istfa2013p0228

In-situ Characterization of Switching Mechanism in Phase Change Random Access Memory (PRAM) Using Transmission Electron Microscopy (TEM)

Sungkyu Son; Seungjoon Jeon; Jangwon Oh; Won Kim; Hojoung Kim; Jonghak Lee; Seungho Woo; Sungjoo Hong; Gapsok Do; Seungyun Lee; Kyungjoon Baek; Sangho Oh

ISTFA 2013; 236-238doi:https://doi.org/10.31399/asm.cp.istfa2013p0236

Failure Analysis Due to Slightly Unetched Hard Mask Using Nano Probe

Jong Hak Lee; Jong Eun Kim; Chang Su Park; Nam Il Kim; Jang Won Moon; Jong Chae Kim; Soo Yong Son; Kyung Dong Yoo; Sung Joo Hong

ISTFA 2013; 239-242doi:https://doi.org/10.31399/asm.cp.istfa2013p0239

Physical and Electrical Performance Comparison of Identical 28 nm Qualcomm Telecommunication Die Produced by Samsung and TSMC

Anton Riley; Sean Zumwalt; Sinjin Dixon-Warren; Gary Tomkins

ISTFA 2013; 243-248doi:https://doi.org/10.31399/asm.cp.istfa2013p0243

Nanoprobing as an Essential and Fast Methodology in Identification of Failure’s Root Cause for Advanced Technology

Yinzhe Ma; Chong Khiam Oh; Ohnmar Nyi; Chuan Zhang; Donald Nedeau; Seng Keat Lim; Ming Chu King

ISTFA 2013; 249-254doi:https://doi.org/10.31399/asm.cp.istfa2013p0249

dC/dV and CV Characterization of Gate Resistance Defects in eDRAM Circuits

Sweta Pendyala; Dave Albert; Katherine Hawkins; Michael Tenney

ISTFA 2013; 255-259doi:https://doi.org/10.31399/asm.cp.istfa2013p0255

Applications of Nanoprobing for Localization of Design for Manufacturing Issues on Analogue-to-Digital Converter on Advanced Technology Node

A.C.T. Quah; C.Q. Chen; G.B. Ang; D. Nagalingam; Y. Li; J. Zhu; S.P. Neo; S.P. Zhao

ISTFA 2013; 260-263doi:https://doi.org/10.31399/asm.cp.istfa2013p0260

Photon Based Techniques

Laser Voltage Imaging and Its Derivatives—Efficient Techniques to Address Defect on 28 nm Technology

Thierry Parrassin; Guillaume Celi; Sylvain Dudit; Michel Vallet; Antoine Reverdy; Philippe Perdu; Dean Lewis

ISTFA 2013; 306-312doi:https://doi.org/10.31399/asm.cp.istfa2013p0306

Advanced Fault Localization through the Use of Tester Based Diagnostics with LVI, LVP, CPA, and PEM

Laura Safran; John Sylvestri; Dave Albert; Zhigang Song; Patrick McGinnis

ISTFA 2013; 313-321doi:https://doi.org/10.31399/asm.cp.istfa2013p0313

Scan-Shift Debug Using LVI Phase Mapping

Yin (Roy) S. Ng; Howard Marks; Christopher Nemirov; Chun-Cheng Tsao; Jim Vickers

ISTFA 2013; 322-328doi:https://doi.org/10.31399/asm.cp.istfa2013p0322

Comparison of C.W. Electro Optical Probing and Light Emission Techniques

K. Sanchez; P. Perdu; K. Melendez; T. Nakamura

ISTFA 2013; 329-335doi:https://doi.org/10.31399/asm.cp.istfa2013p0329

32 nm CMOS SOI Test Site for Emission Tool Evaluation

Alan J. Weger; Franco Stellari; Seongwon Kim; Herschel A. Ainspan; Young Kwark; Christian W. Baks; Dzmitry Maliuk; Peilin Song

ISTFA 2013; 336-340doi:https://doi.org/10.31399/asm.cp.istfa2013p0336

Tester-Based Methods to Enhance Spatial Resolvability and Interpretation of Time-Integrated and Time-Resolved Emission Measurements

Franco Stellari; Peilin Song; Alan J. Weger; Dzmitry Maliuk; Herschel A. Ainspan; Seongwon Kim; Young Kwark; Christian W. Baks

ISTFA 2013; 341-349doi:https://doi.org/10.31399/asm.cp.istfa2013p0341

Optimization of Soft Defect Localization Technique Scan Time Using Dummy Subroutine Test Vector Insertion

B.L. Yeoh; S.H. Goh; Y.H. Chan; G.F. You; Y.E. Koh; Jeffrey Lam

ISTFA 2013; 350-356doi:https://doi.org/10.31399/asm.cp.istfa2013p0350

Realizing Dynamic Thermal Laser Stimulation by Lock-in IR-OBIRCH Assisted with a Current Detection Probe Head

Chunlei Wu; Suying Yao

ISTFA 2013; 357-360doi:https://doi.org/10.31399/asm.cp.istfa2013p0357

Electrical Modeling of the Effect of Photoelectric Laser Fault Injection on Bulk CMOS Design

Laurent Hériveaux; Jessy Clédière; Stèphanie Anceau

ISTFA 2013; 361-368doi:https://doi.org/10.31399/asm.cp.istfa2013p0361

Comparison of Beam-Based Failure Analysis Techniques for Microsystems-Enabled Photovoltaics

Benjamin B. Yang; Jose L. Cruz-Campa; Gaddi S. Haase; Edward I. Cole, Jr.; Paiboon Tangyunyong; Murat Okandan; Gregory N. Nielson

ISTFA 2013; 369-375doi:https://doi.org/10.31399/asm.cp.istfa2013p0369

Dynamic Differential Thermal Measurements for Reliability and Failure Analysis

R. Aaron Falk; Tram Pham; Anthony Ruiz

ISTFA 2013; 376-385doi:https://doi.org/10.31399/asm.cp.istfa2013p0376

Thermal Laser Stimulation Technique for AlGaN/GaN HEMT Technologies Improvement

Dominique Carisetti; Nicolas Sarazin; Nathalie Labat; Nathalie Malbert; Arnaud Curutchet; Benoit Lambert; Laurent Brunel; Karine Rousseau; Eddy Romain Latu; Thomas Frank

ISTFA 2013; 386-391doi:https://doi.org/10.31399/asm.cp.istfa2013p0386

Novel Defect Detection Using Laser-Based Imaging and TIVA with a Visible Laser

Mary A. Miller; Paiboon Tangyunyong; Edward I. Cole, Jr.; Alejandro Pimentel; Darlene M. Udoni

ISTFA 2013; 392-397doi:https://doi.org/10.31399/asm.cp.istfa2013p0392

Fault Localization of Metal Defects with Si-CCD Camera in Analog Device Functional Failure

Stephane Alves; Philippe Rousseille; Thomas Zirilli

ISTFA 2013; 398-402doi:https://doi.org/10.31399/asm.cp.istfa2013p0398

Poster Session

A New Approach for Screening Retention Time Failure Bits in DRAM Device

Bonggu Sung; Daejung Kim; Yongjik Park; Joo-Sun Choi

ISTFA 2013; 403-406doi:https://doi.org/10.31399/asm.cp.istfa2013p0403

A Reduction of Off-Leakage Current of SWD (Sub-WordLine Driver) pMOSFET for NWL-Based Mobile DRAM

Sanghyeon Jeon; Taehong Ha; Youngwoo Kim; Hyuckchai Jung; Taewoo Lee; Kyupil Lee; Insoo Cho

ISTFA 2013; 407-411doi:https://doi.org/10.31399/asm.cp.istfa2013p0407

A Simple Polishing Technique for Removing the Entire Metallization Stack for Sub 100 nm Device Technologies

Randal Mulder; Robert Anderson

ISTFA 2013; 412-416doi:https://doi.org/10.31399/asm.cp.istfa2013p0412

Adaptive Optics Compensation of Aberrations Introduced by Sample Thickness Error in aSIL Confocal Scanning Microscopy

Y. Lu; T.G. Bifano; M.S. Ünlü; B.B. Goldberg

ISTFA 2013; 417-419doi:https://doi.org/10.31399/asm.cp.istfa2013p0417

Advanced CMOS Device Fault Isolation Using Frequency Mapping on Passive Structures

S.H. Goh; B.L. Yeoh; G.F. You; W.H. Hung; Jeffrey Lam; E. Ruttkowski; R. Kamaludeen; Henry Zhang

ISTFA 2013; 420-423doi:https://doi.org/10.31399/asm.cp.istfa2013p0420

Advanced FIB CE Combined with Static Analysis for Functional Failure Analysis

S.K. Loh; C.Q. Chen; K.H. Yip; A.C.T. Quah; X. Tao; P.T. Ng; G.B. Ang; S.P. Zhao

ISTFA 2013; 424-426doi:https://doi.org/10.31399/asm.cp.istfa2013p0424

An Effective SIMS Methodology for GOI Contamination Analysis

Yanhua Huang; Lei Zhu; Kenny Ong; Hanwei Teo; Younan Hua

ISTFA 2013; 427-429doi:https://doi.org/10.31399/asm.cp.istfa2013p0427

Application of AFP in Resolving Systematic Issue in Wafer Fabrication

Hui Peng Ng; Ghim Boon Ang; Chang Qing Chen; Alfred Quah; Angela Teo; Mern Tat Lee; Jony Indahwan; Si Ping Zhao

ISTFA 2013; 430-433doi:https://doi.org/10.31399/asm.cp.istfa2013p0430

Arsenic Segregation Induced Gate Leakage by TEM Failure Analysis

Binghai Liu; Si Ping Zhao; Eddie Er; Changqing Chen; Ghim Boon Ang; Zhiqiang Mo

ISTFA 2013; 434-437doi:https://doi.org/10.31399/asm.cp.istfa2013p0434

Data Center Equipment Reliability Concerns—Contamination Issues, Standards Actions, and Case Studies

Chris Muller; Chuck Arent; Henry Yu

ISTFA 2013; 438-444doi:https://doi.org/10.31399/asm.cp.istfa2013p0438

Die Level Defect Analysis Using Combined Techniques of AFP with Electron Microscopes

Lee Lan Yin; Bai Haonan; Chua Kok Keng; Chow Yew Meng; Grace Tan

ISTFA 2013; 445-447doi:https://doi.org/10.31399/asm.cp.istfa2013p0445

Enabling Scanning Acoustic Microscopy Inspection of Materials Underneath the Chamfer of the Package

Melanie S. Cajita; Marlyn C. Grancapal; Rudolf A. Sia

ISTFA 2013; 448-451doi:https://doi.org/10.31399/asm.cp.istfa2013p0448

Failure Localization of an Electrical Transient Behavior on a Mixed-Mode IC by Using Static Emission Microscopy Technique

Magdalena Sienkiewicz; Estelle Huynh; Alain Vidal

ISTFA 2013; 452-455doi:https://doi.org/10.31399/asm.cp.istfa2013p0452

Gate Bridge to Drain Contact Characteristic in Floating Gate Memory

Pei Wei Chiang; Yu Ting Ling; Bo Chih Chen; Hsiao Tien Chang

ISTFA 2013; 456-462doi:https://doi.org/10.31399/asm.cp.istfa2013p0456

Glass Interposer Reliability Improvement by Transient Thermal Modelling and Physical Analysis

A. Benali; A. El Amrani; Y. Bouissa; M. Bouya; M. Faqir; M. Ghogho; Y. Benlahoucine; Z. Sbiaa

ISTFA 2013; 463-467doi:https://doi.org/10.31399/asm.cp.istfa2013p0463

High Resolution C-Mode Scanning Acoustic Microscope Techniques for the Failure Analysis of Microelectronic Packages

Yan Li; Liang Hu; Gang Li; Rajen Dias; Deepak Goyal

ISTFA 2013; 468-470doi:https://doi.org/10.31399/asm.cp.istfa2013p0468

How to Interpret the Reflected Laser Probe Signal of Multiple Elementary Substructures in Very Deep Submicron Technologies

M.M. Rebaï; F. Darracq; D. Lewis; P. Perdu; K. Sanchez

ISTFA 2013; 471-481doi:https://doi.org/10.31399/asm.cp.istfa2013p0471

Localization of a Complex Failure by Combining ATPG and Customer-Oriented Application Testing

Kai Wang; Rhys Weaver; David Johnson

ISTFA 2013; 482-485doi:https://doi.org/10.31399/asm.cp.istfa2013p0482

Memory Scramble Verification by Frontside and Backside FIB Modification

Chun Ming Tsai; Yi Shiuan Huang; Ya Hui Lu; Jian Chang

ISTFA 2013; 486-489doi:https://doi.org/10.31399/asm.cp.istfa2013p0486

Micro-Abrasive Blasting—A Novel Approach to Local Silicon and Mold Compound Material Removal

Zhenzhou Sun; Alberto Bosio; Luigi Dilillo; Patrick Girard; Aida Todri; Matthew M. Mulholland; Hien Nguyen

ISTFA 2013; 490-493doi:https://doi.org/10.31399/asm.cp.istfa2013p0490

Rapid Failure Analysis of Low-Yielding Electrical Test Structures Using E-beam Physical and Voltage Contrast Inspection

Oliver D. Patterson; Deborah A. Ryan; Xiaohu Tang; Shuen Cheng Lei

ISTFA 2013; 494-497doi:https://doi.org/10.31399/asm.cp.istfa2013p0494

Silicon Junction Profile Delineation by Anodic Etching in HF/HNO₃/CH₃COOH Solution

Jeng-Han Lee; Y.M. Chen; C.M. Huang; F.Y. Tseng; C.J. Chen; K.M. Yin; Y.T. Lin; Y.S. Huan; David Su

ISTFA 2013; 498-500doi:https://doi.org/10.31399/asm.cp.istfa2013p0498

Simple and Effective Technique of Backside Deprocessing of Thin Flip Chip Package

Suk Ho Lee; Chan Hee Park; Seung Joon Cha; Eun Cheol Lee; Kyu Shik Hong

ISTFA 2013; 501-504doi:https://doi.org/10.31399/asm.cp.istfa2013p0501

Study of Static Noise Margin and Circuit Analysis on Advanced Technology Node SRAM Devices by Nanoprobing

M.K. Dawood; T.H. Ng; P.K. Tan; H. Tan; S. James; P.S. Limin; Y. Huang; J. Lam; Z.H. Mai

ISTFA 2013; 505-510doi:https://doi.org/10.31399/asm.cp.istfa2013p0505

Surface Treatment for 20 nm SRAM Devices to Overcome Tip Curvature Radius Limitation in Conductive AFM Analysis

Tsu Hau Ng; S. James; M.K. Dawood; P.S. Limin; H. Tan; P.K. Tan; J.C. Lam; Z.H. Mai

ISTFA 2013; 511-516doi:https://doi.org/10.31399/asm.cp.istfa2013p0511

UV-Raman Microscopy on the Analysis of Ultra-Low-k Dielectric Materials on Patterned Wafers

Maggie Y.M. Huang; Tsu Hau Ng; Hao Tan; Mohammed Khalid Bin Dawood; Pik Kee Tan; Jeffrey C.K. Lam; Zhihong Mai

ISTFA 2013; 517-522doi:https://doi.org/10.31399/asm.cp.istfa2013p0517

Validity-Study of Commercial Semiconductor with TO-18 Package for Space Application by PIND Test

Yusuke Nakatake; Makoto Okabe; Shota Sato

ISTFA 2013; 523-526doi:https://doi.org/10.31399/asm.cp.istfa2013p0523

Sample Preparation

Back-Side Deprocessing for Bulk Silicon Devices

M.S. Wei; Lauren Blair

ISTFA 2013; 527-531doi:https://doi.org/10.31399/asm.cp.istfa2013p0527

Advanced FIB Application—Automated, Precision Deprocessing for Failure Analysis

Dandan Wang; Hua Feng; Pik Kee Tan; Guorong Low; Khiam Oh Chong; Jeffrey Lam; Zhihong Mai

ISTFA 2013; 532-535doi:https://doi.org/10.31399/asm.cp.istfa2013p0532

Silicon Fringe Sample Metrology—A Thickness Measurement Technique

Mark Kimball

ISTFA 2013; 536-539doi:https://doi.org/10.31399/asm.cp.istfa2013p0536

A New Deprocess Flow of Failure Analysis for MEMS Motion Sensor

Chun-An Huang; Han-Yun Long; King-Ting Chiang; Li Chuang; Kevin Tsui

ISTFA 2013; 540-543doi:https://doi.org/10.31399/asm.cp.istfa2013p0540

TEM Sample Fabrication of Sub 22 nm Three-Dimensional Test Structures

James J. Demarest

ISTFA 2013; 544-548doi:https://doi.org/10.31399/asm.cp.istfa2013p0544

A Sample Preparation Methodology for Effective Failure Analysis of Trench Power MOSFET

Yan Li; S.K. Loh; C.Q. Chen; G.B. Ang; A.C.T. Quah; S.P. Neo; C.K. Oh; Y.J. Yao; S.P. Zhao

ISTFA 2013; 549-552doi:https://doi.org/10.31399/asm.cp.istfa2013p0549

Backside Sample Preparation Challenges for Fault Localization Analysis of Flip Chip Package

Lihong Cao; Donna Wallace; Lynda Tuttle; Kirk Martin

ISTFA 2013; 553-559doi:https://doi.org/10.31399/asm.cp.istfa2013p0553

Direct Plan View FIB Liftout for Near-Surface Defect Analysis in TEM

Max L. Lifson; Carla M. Chapman; D. Philip Pokrinchak; Phyllis J. Campbell; Greg S. Chrisman; Steven J. Boren; Renata A. Camillo-Castillo

ISTFA 2013; 560-562doi:https://doi.org/10.31399/asm.cp.istfa2013p0560

Application of Laser Deprocessing Techniques in Physical Failure Analysis

H.H. Yap; P.K. Tan; J. Lam; T.H. Ng; G.R. Low; R. He; H. Feng; Y.Z. Zhao; M.K. Dawood; H. Tan; Y.M. Huang; D.D. Wang; Z.H. Mai

ISTFA 2013; 563-568doi:https://doi.org/10.31399/asm.cp.istfa2013p0563

Top-Down Delayering with Planar Slicing Focus Ion Beam (TD-PS-XFIB)

G.R. Low; P.K. Tan; T.H. Ng; H.H. Yap; H. Feng; R. He; H. Tan; M.K. Dawood; Y.M. Huang; D.D. Wang; Y.Z. Zhao; Y. Zhou; J. Lam; Z.H. Mai

ISTFA 2013; 569-575doi:https://doi.org/10.31399/asm.cp.istfa2013p0569

Alternative Sample Preparation Technique for Die Level Parallel Lapping Analysis

Hoon Ye Gwee; Kiong Kay Ng

ISTFA 2013; 576-581doi:https://doi.org/10.31399/asm.cp.istfa2013p0576

Test, Diagnostics, and Yield Enhancement

Early Inline Detection of Systematic Defects Using ATPG and Commonality Analysis on Product-Like Logic Yield Learning Vehicle

Felix Beaudoin; Zhigang Song; Stephen Lucarini; Thomas F. Mechler; Stephen Wu; Todd L. Cohen; Mark Lagus; Dieter Wendel; Bruno Spruth; Kevin Stanley; David Bogdan

ISTFA 2013; 582-586doi:https://doi.org/10.31399/asm.cp.istfa2013p0582

Evolution of Wafer Level Tester-Based Diagnostic System—More Than Just a Dynamic Electrical Fault Isolation Tool

S.H. Goh; G.F. You; B.L. Yeoh; Y.H. Chan; C.P. Yap; Jeffrey Lam; C.M. Chua

ISTFA 2013; 587-593doi:https://doi.org/10.31399/asm.cp.istfa2013p0587

Improving Failure Analysis for Cell-Internal Defects through Cell-Aware Technology

F. Hapke; M. Keim; T. Herrmann; T. Heidel; M. Reese; J. Schloeffel; J. Rivers; W. Redemund; A. Over; A. Glowatz; A. Fast; B. Benware; J. Rajski

ISTFA 2013; 594-601doi:https://doi.org/10.31399/asm.cp.istfa2013p0594

Leveraging Root Cause Deconvolution Analysis for Logic Yield Ramping

Yan Pan; Atul Chittora; Kannan Sekar; Goh Szu Huat; You Guo Feng; Avinash Viswanatha; Jeffrey Lam

ISTFA 2013; 602-607doi:https://doi.org/10.31399/asm.cp.istfa2013p0602

Volume Information

Credits

ISTFA 2013; iii-vdoi:https://doi.org/10.31399/asm.cp.istfa2013fm01

User Groups

ISTFA 2013; vidoi:https://doi.org/10.31399/asm.cp.istfa2013fm02