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ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis

2012 IPFA Best Paper

Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI

V.K. Ravikumar; R. Wampler; M.Y. Ho; J. Christensen; S.L. Phoa

ISTFA 2012; 1-5https://doi.org/10.31399/asm.cp.istfa2012p0001

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Software Tools for Failure Analysis

Advanced Methods and Software for Enhancing Analytical Tools Capabilities during Chip Diagnostic and Characterization

Franco Stellari; Peilin Song

ISTFA 2012; 3-8https://doi.org/10.31399/asm.cp.istfa2012p0273

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Filtering and Emission Area Identification in the Time Resolved Imaging Data

S. Chef; S. Jacquir; S. Binczak; K. Sanchez; P. Perdu

ISTFA 2012; 264-272https://doi.org/10.31399/asm.cp.istfa2012p0264

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Improved Parasitic Fault Modeling for Automatic Analog Fault Simulation

Gerhard Borgmann; Christian Burmer; Sébastien Mézière

ISTFA 2012; 281-285https://doi.org/10.31399/asm.cp.istfa2012p0281

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Time Resolved Imaging Solving FPGA Logic Fault Localization by Pattern Matching Technique

G. Bascoul; P. Perdu; J. Di Battista

ISTFA 2012; 286-289https://doi.org/10.31399/asm.cp.istfa2012p0286

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Advanced Techniques

Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics

Y. Lu; E. Ramsay; C.R. Stockbridge; A. Yurt; F. H. Köklü; T. G. Bifano; M. S. Ünlü; B. B. Goldberg

ISTFA 2012; 6-10https://doi.org/10.31399/asm.cp.istfa2012p0006

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Fault Isolation of Open Defects Using Space Domain Reflectometry

Mayue Xie; Zhiguo Qian; Mario Pacheco; Zhiyong Wang; Rajen Dias; Vladimir Talanov

ISTFA 2012; 11-16https://doi.org/10.31399/asm.cp.istfa2012p0011

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Localization of Dead Open in a Solder Bump by Space Domain Reflectometry

David P. Vallett; Daniel A. Bader; Vladimir V. Talanov; Jan Gaudestad; Nicolas Gagliolo; Antonio Orozco

ISTFA 2012; 17-20https://doi.org/10.31399/asm.cp.istfa2012p0017

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Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package

Lihong Cao; Manasa Venkata; Meng Yeow Tay; Wen Qiu; J. Alton; P. Taday; M. Igarashi

ISTFA 2012; 21-25https://doi.org/10.31399/asm.cp.istfa2012p0021

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Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal

T. Hrnčíř; F. Lopour; M. Zadražil; A. Delobbe; O. Salord; P. Sudraud

ISTFA 2012; 26-29https://doi.org/10.31399/asm.cp.istfa2012p0026

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FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices

Jim Colvin

ISTFA 2012; 31-38https://doi.org/10.31399/asm.cp.istfa2012p0030

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Test, Diagnostics, and Yield Enhancement

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

Frank Altmann; Jens Beyersdorfer; Jan Schischka; Michael Krause; German Franz; Laurens Kwakman

ISTFA 2012; 39-43https://doi.org/10.31399/asm.cp.istfa2012p0039

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Microstructural Considerations on the Reliability of 3D Packaging

Zhiheng Huang; Zhiyong Wu; Hua Xiong; Yucheng Ma

ISTFA 2012; 44-49https://doi.org/10.31399/asm.cp.istfa2012p0044

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High-Frequency TSV Failure Detection Method with Z Parameter

Joohee Kim; Daniel H. Jung; Jonghyun Cho; Jun So Pak; Joungho Kim; Jong Min Yook; Jun Chul Kim

ISTFA 2012; 50-54https://doi.org/10.31399/asm.cp.istfa2012p0050

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Enhanced Failure Analysis on Open TSV Interconnects

F. Altmann; C. Schmidt; J. Beyersdorfer; M. Simon-Najasek; C. Große; F. Schrank; J. Kraft

ISTFA 2012; 55-60https://doi.org/10.31399/asm.cp.istfa2012p0055

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Enhanced Comparison of Lock-In Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages

Christian Schmidt; Frank Altmann; David P. Vallett

ISTFA 2012; 88-94https://doi.org/10.31399/asm.cp.istfa2012p0088

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Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-Ray Computed Tomography

Yan Li; Yongming Cai; Mario Pacheco; Rajen C. Dias; Deepak Goyal

ISTFA 2012; 95-99https://doi.org/10.31399/asm.cp.istfa2012p0095

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Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies

Peter Czurratis; Peter Hoffrogge; Sebastian Brand; Frank Altmann; Matthias Petzold

ISTFA 2012; 100-105https://doi.org/10.31399/asm.cp.istfa2012p0100

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Fault Localization Improvement through an Intra-Cell Diagnosis Approach

Zhenzhou Sun; Alberto Bosio; Luigi Dilillo; Patrick Girard; Aida Todri; Arnaud Virazel; Etienne Auvray

ISTFA 2012; 509-519https://doi.org/10.31399/asm.cp.istfa2012p0509

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Logic Yield Learning Vehicle Failure Analysis in Technology Development

Zhigang Song; Felix Beaudoin; Stephen Lucarini; Stephen Wu; Yunyu Wang; Lior Arie; Kobi Steiner

ISTFA 2012; 520-525https://doi.org/10.31399/asm.cp.istfa2012p0520

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A Novel Scan-Based Yield Enhancement Methodology for Faster Yield Ramp

S.H. Goh; H.C. Lee; T.Y. Lim; Fei Ting; Y.T. Ngow; J.H. Ng; F.L. Kong; W.Y. Lau; S.K. Lim; Jeffrey Lam; Pan Yan; Y.J. Liu

ISTFA 2012; 526-531https://doi.org/10.31399/asm.cp.istfa2012p0526

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Delay Fault Model Evaluation Using Tester Response Data

Cheng Xue; R. D. (Shawn) Blanton

ISTFA 2012; 532-537https://doi.org/10.31399/asm.cp.istfa2012p0532

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Nanoprobing

A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging

Michél Simon-Najasek; Jörg Jatzkowski; Christian Große; Frank Altmann

ISTFA 2012; 61-66https://doi.org/10.31399/asm.cp.istfa2012p0061

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Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing

P. Larré; H. Tupin; C. Charles; R.H. Newton; A. Reverdy

ISTFA 2012; 67-70https://doi.org/10.31399/asm.cp.istfa2012p0067

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In FAB 300mm Wafer Level Atomic Force Probe Characterization

Terence Kane

ISTFA 2012; 71-76https://doi.org/10.31399/asm.cp.istfa2012p0071

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Nanoelectronic Analog Circuit PFA – The Return of Circuit Level Probing

D. E. Albert; L. Fischer; S. Beck

ISTFA 2012; 77-87https://doi.org/10.31399/asm.cp.istfa2012p0077

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Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90nm Node CMOS Technology

Yuk L. Tsang; Xiang D. Wang; Reyhan Ricklefs; Jason Goertz

ISTFA 2012; 106-111https://doi.org/10.31399/asm.cp.istfa2012p0106

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Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes

T.H. Ng; M.K. Dawood; P.K. Tan; H. Tan; C.K. Oh; J. C. Lam; Z.H. Mai

ISTFA 2012; 112-117https://doi.org/10.31399/asm.cp.istfa2012p0112

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Leaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis

Wei-Chih Wang; Ching-Shan Sung; Ya-Hsiu Lin; Haw-Shan Chen; Jian-Shing Luo

ISTFA 2012; 118-122https://doi.org/10.31399/asm.cp.istfa2012p0118

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Photon Based Techniques

Photon Emission Spectra of FETs as Obtained by InGaAs Detector

Arkadiusz Glowacki; Christian Boit; Yoshiyuki Yokoyama; Philippe Perdu

ISTFA 2012; 123-127https://doi.org/10.31399/asm.cp.istfa2012p0123

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Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies

Ulrike Kindereit; Alan J. Weger; Franco Stellari; Peilin Song; Hervé Deslandes; Ted Lundquist; Prasad Sabbineni

ISTFA 2012; 128-134https://doi.org/10.31399/asm.cp.istfa2012p0128

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Characterization and TCAD Simulation of 90nm Technology PMOS Transistor under Continuous Photoelectric Laser Stimulation for Failure Analysis Improvement

R. Llido; A. Sarafianos; O. Gagliano; V. Serradeil; V. Goubier; M. Lisart; G. Haller; V. Pouget; D. Lewis; J.M. Dutertre; A. Tria

ISTFA 2012; 135-142https://doi.org/10.31399/asm.cp.istfa2012p0135

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Building the Electrical Model of the Photoelectric Laser Stimulation of an NMOS Transistor in 90 nm Technology

A. Sarafianos; R. Llido; O. Gagliano; V. Serradeil; M. Lisart; V. Goubier; J.M. Dutertre; A. Tria; V. Pouget; D. Lewis

ISTFA 2012; 143-150https://doi.org/10.31399/asm.cp.istfa2012p0143

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Dual-Phase Interferometric Confocal Imaging for Electrical Signal Modulation Mapping in ICs

A. Yurt; E. Ramsay; F. H. Köklü; C. R. Stockbridge; Y. Lu; M. S. Ünlü; B. B. Goldberg

ISTFA 2012; 172-175https://doi.org/10.31399/asm.cp.istfa2012p0172

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Laser Voltage Imaging: New Perspective Using Second Harmonic Detection on Submicron Technology

Guillaume Celi; Sylvain Dudit; Thierry Parrassin; Michel Vallet; Philippe Perdu; Antoine Reverdy; Dean Lewis

ISTFA 2012; 176-182https://doi.org/10.31399/asm.cp.istfa2012p0176

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Improving the DLS Workflow

Dan Bodoh; Kent Erington

ISTFA 2012; 183-189https://doi.org/10.31399/asm.cp.istfa2012p0183

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Differential Polarization Imaging and Probing [DPIP]: Seeing and Probing the “Invisible”

Baohua Niu; Martin von Haartman; Patrick Pardy; Mitch Sacks

ISTFA 2012; 190-196https://doi.org/10.31399/asm.cp.istfa2012p0190

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Lock-in Phase Mapping of Modulated Reflectance in Dynamically Operating Mixed-Signal IC Devices

Zhongling Qian; Christof Brillert; Christian Burmer

ISTFA 2012; 217-222https://doi.org/10.31399/asm.cp.istfa2012p0217

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Advanced Laser Probe Techniques Applied to FA of RF Integrated Circuits - A Case Study

Mark Kimball; Christopher Nemirow

ISTFA 2012; 223-227https://doi.org/10.31399/asm.cp.istfa2012p0223

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Case Study: Combined Dynamic Laser Stimulation and Static Emission Microscopy Techniques Applied to Scan Test Failure on Mixed Mode Device

Magdalena Sienkiewicz; Philippe Rousseille

ISTFA 2012; 228-231https://doi.org/10.31399/asm.cp.istfa2012p0228

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From EBT to LVP, from 130nm to 28nm Node, Internal Timing Characterization Evolution

Thierry Parrassin; Philippe Larre; Sylvain Dudit; Michel Vallet; Antoine Reverdy

ISTFA 2012; 232-238https://doi.org/10.31399/asm.cp.istfa2012p0232

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Failure Analysis Process

Words for the “Whys”

Richard J. Ross

ISTFA 2012; 151-155https://doi.org/10.31399/asm.cp.istfa2012p0151

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EOS (Electrical Overstress) – The Old, Unknown Phenomenon?

Peter Jacob

ISTFA 2012; 156-163https://doi.org/10.31399/asm.cp.istfa2012p0156

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DRAM Cell Fault Localization Using Passive Voltage Contrast

San Lin Liew; Yu Pei Wei; Bi Jen Chen; Hua Sheng Chen; Jian Shing Luo

ISTFA 2012; 164-169https://doi.org/10.31399/asm.cp.istfa2012p0164

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3D Tomography Analysis of Dark Voltage Contrast Failure in PCRAM Device

Jangwon Oh; Jonghyeop Kim; Taekwon Lee; Seungjoon Jeon; Won Kim; Hojoung Kim; Changreol Kim

ISTFA 2012; 170-171https://doi.org/10.31399/asm.cp.istfa2012p0170

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Case Studies

Advanced Physical Analysis Methodology for Yield and Reliability of 28-nm, Bulk-Si, Flip-Chip ICs Using SEM and Backside Deprocessing

Yuanjing (Jane) Li; Steven Scott; Howard Lee Marks

ISTFA 2012; 197-202https://doi.org/10.31399/asm.cp.istfa2012p0197

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A Comprehensive Failure Analysis Method and Mechanism Study on Ultra-Low-K Film Adhesion Failure

Chen Shuting; Zhu Lei; Teo Han Wei; Liu Binghai; Huang Yanhua; Ong Kenny; Mo Zhiqiang; Hua Younan; Yuan Zhaoxin; Heng Yong Seng; Li Chao Yong

ISTFA 2012; 203-206https://doi.org/10.31399/asm.cp.istfa2012p0203

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Systematic Approach for the Gate Oxide Failure Caused by Arsenic Cross Contamination

Lei Zhu; Huipeng Ng; Yanhua Huang; Hanwei Teo; Kenny Ong; Shuting Chen; Changqing Chen; Ghimboon Ang; Younan Hua; Zheng Li

ISTFA 2012; 207-210https://doi.org/10.31399/asm.cp.istfa2012p0207

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Failure Analysis on Integrated Power Devices

Arthur Chiang; David Le; Huixian Wu

ISTFA 2012; 211-216https://doi.org/10.31399/asm.cp.istfa2012p0211

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Analysis of Fractures of Printed Circuit Board Traces

Carl Nail; Larry Rice

ISTFA 2012; 365-369https://doi.org/10.31399/asm.cp.istfa2012p0365

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Failure Analysis Methodology on Systematic Defect in N+ poly/NWELL Varactor in RF Analog_PLL due to Implanter Charging Issue

Ang Ghim Boon; Chen Changqing; Ng Hui Peng; Neo Soh Ping; Magdeliza G; Indahwan Jony; Lee Mern Tat

ISTFA 2012; 370-374https://doi.org/10.31399/asm.cp.istfa2012p0370

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Study on ATPG Failure with Butterfly Pattern

C.Q. Chen; G.B. Ang; S.P. Zhao; S.P. Neo; A. Quah; Angela Teo; B.H. Liu

ISTFA 2012; 375-379https://doi.org/10.31399/asm.cp.istfa2012p0375

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Fault Isolation Techniques and Studies on Low Resistance Gross Short Failures

P.K. Tan; Z.H. Mai; W.Y. Lee; Y.Z. Ma; R. He; T.H. Ng; M.K. Dawood; G.R. Low; H. Tan; C.K. Oh; J. Lam

ISTFA 2012; 406-410https://doi.org/10.31399/asm.cp.istfa2012p0406

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A Silicon Debugging Methodology on Customer Prototype for Wafer Foundries

Mai Zhihong; Ng Tsu Hau; Dawood M. Khalid; Tan Pik Kee; Jeffrey Lam

ISTFA 2012; 411-416https://doi.org/10.31399/asm.cp.istfa2012p0411

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Failure Analysis of Nickel Silicide Piping Failures: A Case Study

Clifford Howard; Yuk Tsang; Sam Subramanian; Khiem Ly; Tony Chrastecky; Kent Erington; Juan Ybarra

ISTFA 2012; 417-421https://doi.org/10.31399/asm.cp.istfa2012p0417

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Energy and Space Applications

Lithium-ion Battery Degradation Mechanisms and Failure Analysis Methodology

Bhanu Sood; Lucas Severn; Michael Osterman; Michael Pecht; Anton Bougaev; David McElfresh

ISTFA 2012; 239-249https://doi.org/10.31399/asm.cp.istfa2012p0239

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Lock-in Thermography-Based Local Efficiency Analysis of Solar Cells

Otwin Breitenstein

ISTFA 2012; 250-254https://doi.org/10.31399/asm.cp.istfa2012p0250

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Challenges for Parametric Analysis of the Solar Cells Using Failure Analysis Technique Developed for the Microelectronics

M. Boostandoost; X. Ycaza; R. Leihkauf; U. Kerst; C. Boit

ISTFA 2012; 255-263https://doi.org/10.31399/asm.cp.istfa2012p0255

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Defect Detection and Analysis

SIMS Analysis for the Threshold Voltage Shift of Power MOS Caused by Abnormal Dopant Diffusion

Yanhua Huang; Lei Zhu; Kenny Ong; Hanwei Teo; Shuting Chen; Younan Hua; Miao Shen; Hao Gong

ISTFA 2012; 290-292https://doi.org/10.31399/asm.cp.istfa2012p0290

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Study of Si Crystal Defects by Chemical Preferential Etching and Its Application on Si Dislocation Defects Caused by Laser Spike Annealing (LSA)

Chen Shuting; Li Lihong; Du Anyan; Hua Younan

ISTFA 2012; 293-296https://doi.org/10.31399/asm.cp.istfa2012p0293

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A Novel Integrated Reliability Test System for BEOL TDDB Study

Jifeng Chen; Peilin Song; Thomas M. Shaw; Franco Stellari; Lynne Gignac; Chris Breslin; Dirk Pfeiffer; Griselda Bonila

ISTFA 2012; 297-304https://doi.org/10.31399/asm.cp.istfa2012p0297

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Four Stages of Defect Creation in Epitaxial Structures: High Resolution X-Ray Diffraction and Transmission Electron Microscopy Characterization

Nikolai N. Faleev; Christiana B. Honsberg; David J. Smith

ISTFA 2012; 337-346https://doi.org/10.31399/asm.cp.istfa2012p0337

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A Proof for the Possibility of Ce-Oxide from CMP Residuals in Si-Wafers by Analytical TEM

Wayne Zhao; Liem Do Thanh; Michael Gribelyuk; Mary-Ann Zaitz; Wing Lai

ISTFA 2012; 347-355https://doi.org/10.31399/asm.cp.istfa2012p0347

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Tomographic Study of Silicon Nanoparticles in Nanocrystalline Non-Volatile Flash Memory Devices by EFTEM

YongKai Zhou; Jie Zhu; AnYan Du; YouNan Hua; ZhiQiang Mo; SiPing Zhao

ISTFA 2012; 356-358https://doi.org/10.31399/asm.cp.istfa2012p0356

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Energy-Filtered Imaging of Polysilicon Defects, Gate Dielectric and Silicon Nanocrystals Using Plasmon Energy-Loss Electrons

Swaminathan Subramanian; Khiem Ly; Tony Chrastecky

ISTFA 2012; 359-364https://doi.org/10.31399/asm.cp.istfa2012p0359

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Package Level Failure Analysis

Fluorosilicate Glass (FSG) Outgassing Induced Aluminum Bond Pad Corrosion during Post-Fab Wafer Storage

Hua Younan; Nistala Ramesh Rao; Chen Shuting

ISTFA 2012; 305-309https://doi.org/10.31399/asm.cp.istfa2012p0305

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An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism

Dongmei Meng; Laura Buck; James Cargo

ISTFA 2012; 310-315https://doi.org/10.31399/asm.cp.istfa2012p0310

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Lock-in Thermography for Flip-Chip Package Failure Analysis

Lihong Cao; Manasa Venkata; Jeffery Huynh; Joseph Tan; Meng-Yeow Tay; Wen Qiu; Kannu Wadhwa; Rudolf Schlangen

ISTFA 2012; 316-324https://doi.org/10.31399/asm.cp.istfa2012p0316

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Dynamic Impact Package Characterization

Jake E. Klein; Ronald R. Madsen

ISTFA 2012; 325-331https://doi.org/10.31399/asm.cp.istfa2012p0325

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Development of Advanced Non Destructive Techniques for Failure Analysis of PCBs and PCBAs

Julien Perraud; Shaïma Enouz-Vedrenne; Jean-Claude Clement; Arnaud Grivon

ISTFA 2012; 332-336https://doi.org/10.31399/asm.cp.istfa2012p0332

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Sample Preparation

Metallic Nanoneedles Arrays for TEM Sample Preparation “Lift-Out”

Romaneh Jalilian; David Mudd; Neil Torrez; Jose Rivera; Mehdi M. Yazdanpanah; Brian Miller

ISTFA 2012; 379-382https://doi.org/10.31399/asm.cp.istfa2012p0379

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Deprocessing Methodologies for Detection of IBC and Cell-to-Cell Shorts in Submicron DRAM

Ramachandra Chitakudige; Sarat Kumar Dash; A.M. Khan

ISTFA 2012; 383-387https://doi.org/10.31399/asm.cp.istfa2012p0383

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Routine Backside FIB Milling With EXpressLO™

Lucille A. Giannuzzi

ISTFA 2012; 388-390https://doi.org/10.31399/asm.cp.istfa2012p0388

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High-Throughput, Site-Specific Sample Prep of Ultra-Thin TEM Lamella for Process Metrology and Failure Analysis

Roger Alvis; Jeff Blackwood; Sang-Hoon Lee; Matthew Bray

ISTFA 2012; 391-398https://doi.org/10.31399/asm.cp.istfa2012p0391

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Failure Analysis of Electronic Material Using Cryogenic FIB-SEM

Nicholas Antoniou; Adam Graham; Cheryl Hartfield; Gonzalo Amador

ISTFA 2012; 399-405https://doi.org/10.31399/asm.cp.istfa2012p0399

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Alternative Lapping Method to Reduce Edge Rounding Effect

Hock Guan Ong; Chee Lip Gan

ISTFA 2012; 462-464https://doi.org/10.31399/asm.cp.istfa2012p0462

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Simple and Fast Backside Sample Preparation Technique for Backside Fault Localization Analysis by Using Chemical Etching Method

Gwee Hoon Yen; Ng Kiong Kay

ISTFA 2012; 465-470https://doi.org/10.31399/asm.cp.istfa2012p0465

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Sample Preparation Challenges In WLCSP Epoxy Underfill Coating Removal

Jason H. Lagar; Rudolf A. Sia

ISTFA 2012; 471-477https://doi.org/10.31399/asm.cp.istfa2012p0471

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Stress Reduction during Silicon Thinning Using Thermal Relaxation and 3D Curvature Correction Techniques

Jim Colvin; Heenal Patel; Timothy Hazeldine

ISTFA 2012; 478-484https://doi.org/10.31399/asm.cp.istfa2012p0478

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Non-Chemical Solder Bump Removal Technique for Repackaging Flip Chip ICs

Mauri Sutton; George Geoghegan; Kenneth Schopen; Kathleen Kingma; Steve Castro; Kyle Wesley; Jack Yahl; Frank Soto

ISTFA 2012; 485-490https://doi.org/10.31399/asm.cp.istfa2012p0485

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Detecting and Preventing Counterfeit Microelectronics

Post Decapsulation Internal Visual Inspection

Erik Jordan

ISTFA 2012; 422-425https://doi.org/10.31399/asm.cp.istfa2012p0422

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Counterfeit Detection Strategies: When to Do It / How to Do It

Greg Caswell

ISTFA 2012; 426-432https://doi.org/10.31399/asm.cp.istfa2012p0426

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Counterfeit IC’s Overview – From a Test Lab’s Perspective

Dave Loaney

ISTFA 2012; 433-435https://doi.org/10.31399/asm.cp.istfa2012p0433

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Circuit Edit

Characterization of Ion Beam Current Distribution Influences on Nanomachining

Shida Tan; Richard H. Livengood; Yuval Greenzweig; Yariv Drezner; Roy Hallstein; Chris Scheffler

ISTFA 2012; 436-439https://doi.org/10.31399/asm.cp.istfa2012p0436

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Focused Ion Beam Circuit Edit on Copper Redistribution Layer

Lorenzo Motta; Paolo Veneto; Mark Antolik; Donato Di Donato

ISTFA 2012; 440-446https://doi.org/10.31399/asm.cp.istfa2012p0440

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Dielectric and Metal Depositions Using Xe+ Focused Ion Beams

Chad Rue; Brieanna Carrigan

ISTFA 2012; 447-454https://doi.org/10.31399/asm.cp.istfa2012p0447

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Fabrication and Characterization of Helium and Neon Ion Deposited Platinum Wires for Circuit Edit Applications

William Thompson; Lewis Stern; Huimeng Wu; Dave Ferranti; Deying Xia; Fouzia Khanom; Philip D. Rack; Carlos Gonzales; Michael W. Phaneuf

ISTFA 2012; 455-462https://doi.org/10.31399/asm.cp.istfa2012p0455

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Preparation of Wafer Level Packaged Integrated Circuits Using Pulsed Laser Assisted Chemical Etching

Robert Chivas; Niru Dandekar; Scott Silverman; Roddy Cruz; Michael DiBattista

ISTFA 2012; 491-497https://doi.org/10.31399/asm.cp.istfa2012p0491

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Multi-Site Full Thickness Backside Focused Ion Beam (FIB) Editing for eDRAM Array Address Descramble Verification

Steven B. Herschbein; Carmelo F. Scrudato; George K. Worth; Edward S. Hermann

ISTFA 2012; 498-504https://doi.org/10.31399/asm.cp.istfa2012p0498

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VIS-NIR LED Illumination in Backside Circuit Edit and Optical Probing Applications

Shida Tan; Richard H. Livengood; Dane Scott; Roy Hallstein; Pat Pardy; John Giacobbe

ISTFA 2012; 505-508https://doi.org/10.31399/asm.cp.istfa2012p0505

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Poster Session

Thermal Performance and Fabrication Improvements of Glass Interposer in 3D Packaging Systems

M. Faqir; M. Bouya; Y. Bouissa; A. Elamrani; Z. Sbiaa; S. Gandhi; K. Demir; V. Sundaram; R. Tummala

ISTFA 2012; 538-541https://doi.org/10.31399/asm.cp.istfa2012p0538

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TEM/FIB Technical Solutions to Electron Beam Induced Radiation Damage to Low K/Ultra Low K Dielectrics in Semiconductor Failure Analysis

Liu Binghai; Chen Ye; Mo Zhiqiang; Zhao Si Ping; Wang Chue Yuin; Wang Jili

ISTFA 2012; 542-547https://doi.org/10.31399/asm.cp.istfa2012p0542

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Photon Emission Microscope as a Tool for 3-Dimensional Semiconductor Device Failure Analysis

Steven J. Chun

ISTFA 2012; 548-550https://doi.org/10.31399/asm.cp.istfa2012p0548

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Image Reconstruction Techniques for High Numerical Aperture Integrated Circuit Imaging

T. Berkin Cilingiroglu; F. Hakan Koklu; Euan Ramsay; Yang Lu; Abdulkadir Yurt; W. Clem Karl; Janusz Konrad; Bennett B. Goldberg; M. Selim Unlu

ISTFA 2012; 551-556https://doi.org/10.31399/asm.cp.istfa2012p0551

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Two Step Fabrication of Tungsten Nanotips by AC Electrochemical Etching and Laser Irradiation for Nanoprobing on Advanced Technology Nodes

M. K. Dawood; T. H. Ng; H. Tan; P. K. Tan; C. K. Oh; J. Lam; Z.H. Mai

ISTFA 2012; 557-561https://doi.org/10.31399/asm.cp.istfa2012p0557

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Metallographic Investigation on Solder Creep Phenomenon

Paul Angelo D. Gustilo; Joyce Lyn G. Fernandez

ISTFA 2012; 562-567https://doi.org/10.31399/asm.cp.istfa2012p0562

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A Practical Method for Trace Exposure and Roughness Measurements and Implementation in High Speed Package Design

Valentina Korchnoy; Jacov Brener

ISTFA 2012; 568-573https://doi.org/10.31399/asm.cp.istfa2012p0568

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TEM Failure Analysis and Root Cause Understanding of Nitride Spacer Bridging in 45 nm Semiconductor Manufacturing Processes

Liu Binghai; Mo Zhiqiang; Zhao Si Ping; Yao Yuan; Teo Kim Hong; Chen Ye; Tee Irene; Lee Gek Li; Chen Changqing; Ang Ghim Boon; Yogaspari; Robin Tan

ISTFA 2012; 574-577https://doi.org/10.31399/asm.cp.istfa2012p0574

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Novel Failure Analysis Sample Preparation Techniques for PoP Packaging

Ng Sea Chooi; Chor Theam Hock; Ma Choo Thye; Khoo Poh Tshin; Dan Bockelman

ISTFA 2012; 578-582https://doi.org/10.31399/asm.cp.istfa2012p0578

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Image and Information Enhancement by Combining Brightfield and Darkfield Optical Images

Sonny Benson P. Rosales; Andrew C. Badillo; Wilma R. Oblefias

ISTFA 2012; 583-586https://doi.org/10.31399/asm.cp.istfa2012p0583

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Scan Chain Bridge Defect on a 28 nm Technology Node Circuit, Localization Using Dynamic Power Supplies

Thierry Parrassin; Emmanuel Petit; Guillaume Celi; Yann Mousseau; Sylvain Dudit

ISTFA 2012; 587-591https://doi.org/10.31399/asm.cp.istfa2012p0587

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Thermal Investigations on CMOS Integrated Micro-Hot-Plates Using IR Thermography

Christian Schmidt; Frank Altmann; Giorgio C. Mutinati; Elise Brunet; Stephan Steinhauer; Anton Koeck; Martin Siegele; Christoph Gamauf; Alexander Nemecek; J. Teva; J. Kraft; J. Siegert; F. Schrank; Hans Kruschke

ISTFA 2012; 592-595https://doi.org/10.31399/asm.cp.istfa2012p0592

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Low Temperature Fault Isolation Using Soft Defect Localization

Kristopher D. Staller

ISTFA 2012; 596-600https://doi.org/10.31399/asm.cp.istfa2012p0596

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Application of Scanning Probe Microscopy Techniques with Electrical Modules in Via Related Defects

Xiang-Dong Wang; N. David Theodore; Gil Garteiz; Paul Sanders

ISTFA 2012; 601-605https://doi.org/10.31399/asm.cp.istfa2012p0601

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Studies of Buried Voids Capturing with e-Beam Inspection System and Confirmation with Physical Failure Analysis

Hong Xiao; Ximan Jiang

ISTFA 2012; 606-616https://doi.org/10.31399/asm.cp.istfa2012p0606

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Volume Information

Credits

ISTFA 2012; iii-vhttps://doi.org/10.31399/asm.cp.istfa2012fm01

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User Groups

ISTFA 2012; vi-viiihttps://doi.org/10.31399/asm.cp.istfa2012fm02

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