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ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis

IPFA Best Paper Award Winner

SEM / SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of Electronic Devices

A. Altes; R. Heiderhoff; L.J. Balk; I. Joachimsthaler; G. Zimmermann

ISTFA 2002; 3-7https://doi.org/10.31399/asm.cp.istfa2002p0003

View Articletitled, SEM / SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of Electronic Devices

Advanced Techniques

From Microns to Molecules – Can FA Remain Viable Through the Next Decade?

David P. Vallett

ISTFA 2002; 11-20https://doi.org/10.31399/asm.cp.istfa2002p0011

View Articletitled, From Microns to Molecules – Can FA Remain Viable Through the Next Decade?

Soft Defect Localization (SDL) on ICs

Michael R. Bruce; Victoria J. Bruce; David H. Eppes; Jacob Wilcox; Edward I. Cole, Jr.; Paiboon Tangyunyong; Charles F. Hawkins

ISTFA 2002; 21-27https://doi.org/10.31399/asm.cp.istfa2002p0021

View Articletitled, Soft Defect Localization (SDL) on ICs

Fault Localization and Functional Testing of ICs by Lock-in Thermography

O. Breitenstein; J.P. Rakotoniaina; F. Altmann; J. Schulz; G. Linse

ISTFA 2002; 29-36https://doi.org/10.31399/asm.cp.istfa2002p0029

View Articletitled, Fault Localization and Functional Testing of ICs by Lock-in Thermography

Visualisation of Electrically Active Areas Using Electron Holography

U. Muehle; A. Lenk; M. Lehmann; H. Lichte

ISTFA 2002; 39-45https://doi.org/10.31399/asm.cp.istfa2002p0039

View Articletitled, Visualisation of Electrically Active Areas Using Electron Holography

A Study of Photoelectron Emission Microscopy Contrast Mechanisms Relevant to Microelectronics

Vincent Ballarotto; Karen Siegrist; Ellen Williams; William Vanderlinde

ISTFA 2002; 47-54https://doi.org/10.31399/asm.cp.istfa2002p0047

View Articletitled, A Study of Photoelectron Emission Microscopy Contrast Mechanisms Relevant to Microelectronics

Application of Acoustic Fourier Domain Imaging for the Evaluation of Advanced Micro Electronic Packages

Janet E. Semmens; Lawrence W. Kessler

ISTFA 2002; 55-59https://doi.org/10.31399/asm.cp.istfa2002p0055

View Articletitled, Application of Acoustic Fourier Domain Imaging for the Evaluation of Advanced Micro Electronic Packages

Orientation Imaging Microscopy Applications in Cu- Interconnects and Cu-Cu Wire Bonding

Petar Ratchev; Laureen Carbonell; Hong Meng Ho; Hugo Bender; Ingrid De Wolf; Bert Verlinden

ISTFA 2002; 61-66https://doi.org/10.31399/asm.cp.istfa2002p0061

View Articletitled, Orientation Imaging Microscopy Applications in Cu- Interconnects and Cu-Cu Wire Bonding

Metrology and Materials Analysis

Materials Analysis and Process Monitoring in MegaFabs

Bryan Tracy

ISTFA 2002; 69-75https://doi.org/10.31399/asm.cp.istfa2002p0069

View Articletitled, Materials Analysis and Process Monitoring in MegaFabs

STEM (Scanning Transmission Electron Microscopy) in a SEM (Scanning Electron Microscope) for Failure Analysis and Metrology

William E. Vanderlinde

ISTFA 2002; 77-85https://doi.org/10.31399/asm.cp.istfa2002p0077

View Articletitled, STEM (Scanning Transmission Electron Microscopy) in a SEM (Scanning Electron Microscope) for Failure Analysis and Metrology

Microcalorimeter Energy Dispersive X-Ray Spectroscopy in Routine Semiconductor Failure Analysis

B. Simmnacher; R. Weiland; E. Langer; M. Bühler; J. Höhne; C. Hollerith

ISTFA 2002; 87-92https://doi.org/10.31399/asm.cp.istfa2002p0087

View Articletitled, Microcalorimeter Energy Dispersive X-Ray Spectroscopy in Routine Semiconductor Failure Analysis

A Working Method for Adapting the (SEM) Scanning Electron Microscope to Produce (STEM) Scanning Transmission Electron Microscope Images

Edward Coyne

ISTFA 2002; 93-99https://doi.org/10.31399/asm.cp.istfa2002p0093

View Articletitled, A Working Method for Adapting the (SEM) Scanning Electron Microscope to Produce (STEM) Scanning Transmission Electron Microscope Images

Applications of EELS to Semiconductor Devices Failure Analysis by Using a 300 keV TEM

Jong-Shing Bow; Wen-Tung Chang; Yun-Ming Tsou; Hsing-Shuang Chou; Christ Chiou

ISTFA 2002; 101-105https://doi.org/10.31399/asm.cp.istfa2002p0101

View Articletitled, Applications of EELS to Semiconductor Devices Failure Analysis by Using a 300 keV TEM

Package Level Analysis

Laser Milling Methods for Package Failure Analysis

Rajen Dias; Lars Skoglund; Zhiyong Wang

ISTFA 2002; 109-115https://doi.org/10.31399/asm.cp.istfa2002p0109

View Articletitled, Laser Milling Methods for Package Failure Analysis

Laser Decapsulation of Transfer Molded Plastic Packages for Failure Analysis

George Carter

ISTFA 2002; 117-125https://doi.org/10.31399/asm.cp.istfa2002p0117

View Articletitled, Laser Decapsulation of Transfer Molded Plastic Packages for Failure Analysis

Investigation of Microstructure Change on Ni-based UBM Systems in Lead Free Solder

Tan Teck Chun; Tung Chih Hang; Chai Tai Chong

ISTFA 2002; 127-132https://doi.org/10.31399/asm.cp.istfa2002p0127

View Articletitled, Investigation of Microstructure Change on Ni-based UBM Systems in Lead Free Solder

Failure Analysis Strategy for 2 Stacked Die CSP

Shamsul Mohamed; Caroline Francis; Rodzaki Saad; Rosli Jaffar

ISTFA 2002; 133-137https://doi.org/10.31399/asm.cp.istfa2002p0133

View Articletitled, Failure Analysis Strategy for 2 Stacked Die CSP

Evaluation of Package Defects by Thermal Imaging Techniques

Yongmei Liu; Rajen Dias

ISTFA 2002; 139-144https://doi.org/10.31399/asm.cp.istfa2002p0139

View Articletitled, Evaluation of Package Defects by Thermal Imaging Techniques

A Study on Non-Stick Aluminium Bondpads Due to Fluorine Contamination Using SEM, EDX, TEM, IC, AUGER, XPS and TOF-SIMS Techniques

Y. N. Hua; S. Redkar; C. K. Lau; Z. Q. Mo

ISTFA 2002; 495-504https://doi.org/10.31399/asm.cp.istfa2002p0495

View Articletitled, A Study on Non-Stick Aluminium Bondpads Due to Fluorine Contamination Using SEM, EDX, TEM, IC, AUGER, XPS and TOF-SIMS Techniques

Microstructure Studies of Under Bump Metallization Systems Using Transmission Electron Microscopy

Chih-Hang Tung; Poi-Siong Teo; Marvin C.Y. Lo; George T.T. Sheng

ISTFA 2002; 505-511https://doi.org/10.31399/asm.cp.istfa2002p0505

View Articletitled, Microstructure Studies of Under Bump Metallization Systems Using Transmission Electron Microscopy

Hot Disk: A Transient Plane Source Technique for Rapid Thermal Conductivity Measurement

Yi He; Grace S. Ng

ISTFA 2002; 513-522https://doi.org/10.31399/asm.cp.istfa2002p0513

View Articletitled, Hot Disk: A Transient Plane Source Technique for Rapid Thermal Conductivity Measurement

Comparison of Differential Scanning Calorimetry and Energy Dispersive X-ray Microanalysis for Measuring Low Gold Concentrations in Sn/Pb Solder Bumps

James Mohr; Eileen Sullivan; Paul Deal; Michael Seddon

ISTFA 2002; 523-527https://doi.org/10.31399/asm.cp.istfa2002p0523

View Articletitled, Comparison of Differential Scanning Calorimetry and Energy Dispersive X-ray Microanalysis for Measuring Low Gold Concentrations in Sn/Pb Solder Bumps

Poster Session

Backside Hot Spot Detection

Félix Beaudoin; Philippe Perdu; Romain Desplats; Lionel Dantas de Morais; Olivier Crepel; Christophe Goupil; Gérald Haller; Thomas Beauchêne; Dean Lewis

ISTFA 2002; 147-153https://doi.org/10.31399/asm.cp.istfa2002p0147

View Articletitled, Backside Hot Spot Detection

Optimizing Backside Image Quality

R. Aaron Falk

ISTFA 2002; 155-161https://doi.org/10.31399/asm.cp.istfa2002p0155

View Articletitled, Optimizing Backside Image Quality

Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity and Limitations

S. Kiefer; M. Nair; P. Sanders; J. Steele; M. Sutton; R. Thoma; S. Wilson; G. Albright; C. Li; J. McDonald

ISTFA 2002; 163-168https://doi.org/10.31399/asm.cp.istfa2002p0163

View Articletitled, Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity and Limitations

Failure Analysis of Tungsten Contact Failure in a 0.13 μm CMOS Process

Sandeep Bagchi; Sam Subramanian; Ryan Ross; James Beck; Tony Chrastecky; Vince Soorholtz; Ed Widener

ISTFA 2002; 169-171https://doi.org/10.31399/asm.cp.istfa2002p0169

View Articletitled, Failure Analysis of Tungsten Contact Failure in a 0.13 μm CMOS Process

Backside Photoemission and Infrared Microthermography for Rapid Debug of Compound Semiconductor Devices

S. Mitra; S. Kiefer; M. Nair; P. Sanders; J. Steele; M. Sutton; S. Wilson; H. Henry; D. Hill; M. Sadaka

ISTFA 2002; 173-176https://doi.org/10.31399/asm.cp.istfa2002p0173

View Articletitled, Backside Photoemission and Infrared Microthermography for Rapid Debug of Compound Semiconductor Devices

Laser-Voltage-Prober Measurements on Bipolar Devices

Anton Stuffer; Peter Egger; Helmut Pohl; Antje Moffat

ISTFA 2002; 177-182https://doi.org/10.31399/asm.cp.istfa2002p0177

View Articletitled, Laser-Voltage-Prober Measurements on Bipolar Devices

Application of Focused Ion Beam in Debug and Characterization of 0.13 µm Copper Interconnect Technology

Caiwen Yuan; Mehrdad Mahanpour; Hung-Jen Lin; Gene Hill

ISTFA 2002; 183-188https://doi.org/10.31399/asm.cp.istfa2002p0183

View Articletitled, Application of Focused Ion Beam in Debug and Characterization of 0.13 µm Copper Interconnect Technology

Thin-Die Flip Chip Physical-FA Process Flow

Andrew J. Komrowski; N. S. Somcio; Daniel J. D. Sullivan; Charles R. Silvis; Luis Curiel; Jeff P. Baca; Steven Scott; Mary Sandoval

ISTFA 2002; 189-193https://doi.org/10.31399/asm.cp.istfa2002p0189

View Articletitled, Thin-Die Flip Chip Physical-FA Process Flow

Failure Mechanism and Root Cause Analysis of UBGA Solder Ball Contamination

Vanessa Grace Martinez; Alden Almero; Gerard Gador

ISTFA 2002; 195-203https://doi.org/10.31399/asm.cp.istfa2002p0195

View Articletitled, Failure Mechanism and Root Cause Analysis of UBGA Solder Ball Contamination

Passivation Damage and Residue-Induced Package Failure Analysis for a 16 Lead SOIC GaAs RF/IF Package

Daniel Cavasin

ISTFA 2002; 205-214https://doi.org/10.31399/asm.cp.istfa2002p0205

View Articletitled, Passivation Damage and Residue-Induced Package Failure Analysis for a 16 Lead SOIC GaAs RF/IF Package

Study on a Single NFET Degradation After Circuit Modification With FIB

Werner Lehner

ISTFA 2002; 215-219https://doi.org/10.31399/asm.cp.istfa2002p0215

View Articletitled, Study on a Single NFET Degradation After Circuit Modification With FIB

New Techniques to Improve the Efficiency of TEM Sample Preparation

Jen-Lang Lue; Jack Lee; Jian-Shing Luo

ISTFA 2002; 221-226https://doi.org/10.31399/asm.cp.istfa2002p0221

View Articletitled, New Techniques to Improve the Efficiency of TEM Sample Preparation

A Transmission X-ray Microscope (TXM) for Non-destructive 3D Imaging of ICs at Sub-100 nm Resolution

Steve Wang; Frederick Duewer; Shashidar Kamath; Christopher Kelly; Alan Lyon; Kenneth Nill; David Scott; David Trapp; Wenbing Yun; Suneeta Neogi; Markus Kuhn; Casey Bennet; Peter Coon; Souping Yan

ISTFA 2002; 227-233https://doi.org/10.31399/asm.cp.istfa2002p0227

View Articletitled, A Transmission X-ray Microscope (TXM) for Non-destructive 3D Imaging of ICs at Sub-100 nm Resolution

A Broadband Model for Ultrasonic Pulses in the Presence of Thin Layers in Microelectronics

Sridhar Canumalla

ISTFA 2002; 235-244https://doi.org/10.31399/asm.cp.istfa2002p0235

View Articletitled, A Broadband Model for Ultrasonic Pulses in the Presence of Thin Layers in Microelectronics

Beam-Based Localization Techniques for 0.18um IC Failure Analysis After Reliability Test

Re-Long Chiu; Hui Zhang; Wen-Szu Chung; Mark Cherng; Xu Liu

ISTFA 2002; 245-249https://doi.org/10.31399/asm.cp.istfa2002p0245

View Articletitled, Beam-Based Localization Techniques for 0.18um IC Failure Analysis After Reliability Test

Methodologies for Isolating Faults in Multi Chip Fiber Optic Transceivers That Use GHz Mixed Signal ICs

Kuhn Seo; Brent Wahl; Myrna Mayonte; Young Gon Kim

ISTFA 2002; 251-257https://doi.org/10.31399/asm.cp.istfa2002p0251

View Articletitled, Methodologies for Isolating Faults in Multi Chip Fiber Optic Transceivers That Use GHz Mixed Signal ICs

Application of Various Fault Localization Techniques to Different Types of 6T-SRAM Column Failures

Cheng-Piao Lin; Cheng-Chun Ting; Chin-Hsin Tang; Cheng-Hsu Wu; Chih-Ming Kuo; Yung-Sheng Huang

ISTFA 2002; 259-265https://doi.org/10.31399/asm.cp.istfa2002p0259

View Articletitled, Application of Various Fault Localization Techniques to Different Types of 6T-SRAM Column Failures

Missing Metal Pillar Failure Analysis-A Plug Technology Issue

Dat Nguyen; Tim Campbell; Steven Whitlock; Ankineedu Velaga

ISTFA 2002; 267-272https://doi.org/10.31399/asm.cp.istfa2002p0267

View Articletitled, Missing Metal Pillar Failure Analysis-A Plug Technology Issue

Microelectromechanical Systems

Reliability and Failure Analysis of RF MEMS Switches

Ingrid De Wolf; Anne Jourdain; Ann Witvrouw; Paolo Fiorini; Harrie A. C. Tilmans; W. Merlijn van Spengen; Robert Modlinski

ISTFA 2002; 275-281https://doi.org/10.31399/asm.cp.istfa2002p0275

View Articletitled, Reliability and Failure Analysis of RF MEMS Switches

Failure Analysis of Polysilicon Micromirror Arrays

Jeremy A. Walraven; Edward I. Cole, Jr.; Danelle M. Tanner; Seethambal S. Mani; Ernest J. Garcia; Marc A. Polosky

ISTFA 2002; 283-290https://doi.org/10.31399/asm.cp.istfa2002p0283

View Articletitled, Failure Analysis of Polysilicon Micromirror Arrays

Failure Analysis of the Digital Micromirror Device

Cary Davis; Wes Mahin; Becky Holdford

ISTFA 2002; 291-294https://doi.org/10.31399/asm.cp.istfa2002p0291

View Articletitled, Failure Analysis of the Digital Micromirror Device

Wavefront Coded Imaging Systems for MEMS Analysis

Daniel L. Barton; Jeremy A. Walraven; Edward R. Dowski, Jr.; Rainer Danz; Andreas Faulstich; Bernd Faltermeier

ISTFA 2002; 295-303https://doi.org/10.31399/asm.cp.istfa2002p0295

View Articletitled, Wavefront Coded Imaging Systems for MEMS Analysis

Sample Preparation

Sample Preparation for Vertical Transistors in DRAM

Michael W. Ruprecht; Shengmin Wen; Rolf-P. Vollertsen

ISTFA 2002; 307-311https://doi.org/10.31399/asm.cp.istfa2002p0307

View Articletitled, Sample Preparation for Vertical Transistors in DRAM

A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB

Chin Kai Liu; Chi Jen. Chen; Jeh Yan.Chiou; David Su

ISTFA 2002; 313-316https://doi.org/10.31399/asm.cp.istfa2002p0313

View Articletitled, A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB

CMOS Backside Deprocessing With TMAH / IPA as a Sample Preparation Procedure for Failure Analysis

Seth Prejean; Victoria Bruce; Joyce Burke

ISTFA 2002; 317-323https://doi.org/10.31399/asm.cp.istfa2002p0317

View Articletitled, CMOS Backside Deprocessing With TMAH / IPA as a Sample Preparation Procedure for Failure Analysis

Investigation of Choline Hydroxide for Selective Silicon Etch from a Gate Oxide Failure Analysis Standpoint

Valentina Korchnoy

ISTFA 2002; 325-331https://doi.org/10.31399/asm.cp.istfa2002p0325

View Articletitled, Investigation of Choline Hydroxide for Selective Silicon Etch from a Gate Oxide Failure Analysis Standpoint

In situ Decapsulation of Plastic Encapsulated Devices Mounted to a Printed Circuit Board

Ronald R. Hylton

ISTFA 2002; 333-338https://doi.org/10.31399/asm.cp.istfa2002p0333

View Articletitled, In situ Decapsulation of Plastic Encapsulated Devices Mounted to a Printed Circuit Board

Characterization of Reactive Ion Etching of Silicon Substrate for Backside Failure Mode Analysis

Huixian Wu; James Cargo

ISTFA 2002; 675-682https://doi.org/10.31399/asm.cp.istfa2002p0675

View Articletitled, Characterization of Reactive Ion Etching of Silicon Substrate for Backside Failure Mode Analysis

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

George F. Gaut

ISTFA 2002; 683-687https://doi.org/10.31399/asm.cp.istfa2002p0683

View Articletitled, The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

Methodology for TEM Analysis of Barrier Profiles

Tan-Chen Lee; Jui-Yen Huang; Li-Chien Chen; Ruey-Lian Hwang; David Su

ISTFA 2002; 689-693https://doi.org/10.31399/asm.cp.istfa2002p0689

View Articletitled, Methodology for TEM Analysis of Barrier Profiles

Studies on Chemical Methods to Expose Gate/Tunnel Oxide and Identification of Gate/Tunnel Oxide Defects in Wafer Fabrication

Y. N. Hua; G. B. Ang; S. Redkar; Yogaspari; Wilma Richter

ISTFA 2002; 695-699https://doi.org/10.31399/asm.cp.istfa2002p0695

View Articletitled, Studies on Chemical Methods to Expose Gate/Tunnel Oxide and Identification of Gate/Tunnel Oxide Defects in Wafer Fabrication

Failure Analysis Process

A Standardized Scientific Method Formulation for Failure Analysis Application

S. Ferrier

ISTFA 2002; 341-347https://doi.org/10.31399/asm.cp.istfa2002p0341

View Articletitled, A Standardized Scientific Method Formulation for Failure Analysis Application

Probeless FA Approach: A Breakthrough Simulation Based Failure Analysis Method

ChoonHou Lock; YikChoong Wong; KahHee Siek

ISTFA 2002; 349-353https://doi.org/10.31399/asm.cp.istfa2002p0349

View Articletitled, Probeless FA Approach: A Breakthrough Simulation Based Failure Analysis Method

Electrical Faults Captured by In-line E-beam Inspection and Failure Analysis

Z.G. Song; G.B. Ang; H.Y. Li; V. Sane; J. Indahwan; S. Ansari; S.F. Tee; W. Richter; C.K. Oh; S. Redkar

ISTFA 2002; 355-358https://doi.org/10.31399/asm.cp.istfa2002p0355

View Articletitled, Electrical Faults Captured by In-line E-beam Inspection and Failure Analysis

TEM Direct Observation of Gate Oxide Defects

Nathan Wang; Sabbas Daniel

ISTFA 2002; 765-769https://doi.org/10.31399/asm.cp.istfa2002p0765

View Articletitled, TEM Direct Observation of Gate Oxide Defects

Localization Techniques on a 0.15um CMOS Device: Charge Pump Failure Analysis

Hui Pan; Thomas Gibson

ISTFA 2002; 771-775https://doi.org/10.31399/asm.cp.istfa2002p0771

View Articletitled, Localization Techniques on a 0.15um CMOS Device: Charge Pump Failure Analysis

Debug and Fault Isolation of an RF/IF Circuit for 3G Cellular Applications With High Leakage: A Case Study

Syd Wilson; Manoj Nair; Michael Vicker; Richard B. Meador; George Smoot; Paul Sanders; Scott Kiefer; John Steele; Mauri Sutton

ISTFA 2002; 777-783https://doi.org/10.31399/asm.cp.istfa2002p0777

View Articletitled, Debug and Fault Isolation of an RF/IF Circuit for 3G Cellular Applications With High Leakage: A Case Study

System Level Analysis

Effect of Corner Underfill Voids on Chip Scale Package (CSP) Performance Under Mechanical Loading

Sridhar Canumalla; Santosh Shetty; Nael Hannan

ISTFA 2002; 361-370https://doi.org/10.31399/asm.cp.istfa2002p0361

View Articletitled, Effect of Corner Underfill Voids on Chip Scale Package (CSP) Performance Under Mechanical Loading

Leakage Isolation of Mixed-Signal Devices at Operating Modes

William Xia

ISTFA 2002; 371-376https://doi.org/10.31399/asm.cp.istfa2002p0371

View Articletitled, Leakage Isolation of Mixed-Signal Devices at Operating Modes

Method for Measuring Package to Board Interconnection Shear Strength for Area Array, Fine Pitch Packages

Sridhar Yee; Hee Dong Yang; Puligandla Viswanadham

ISTFA 2002; 377-384https://doi.org/10.31399/asm.cp.istfa2002p0377

View Articletitled, Method for Measuring Package to Board Interconnection Shear Strength for Area Array, Fine Pitch Packages

Making Failure Analysis a Value Add Proposition in Today’s High Speed Low Cost PC environment

Michael Lane; Roger Bjork; Jeff Birdsley

ISTFA 2002; 609-615https://doi.org/10.31399/asm.cp.istfa2002p0609

View Articletitled, Making Failure Analysis a Value Add Proposition in Today’s High Speed Low Cost PC environment

Boundary-Scan’s Next Plateau: Testing and In-System Configuration at the System Level

Pete Collins; Ray Dellecker

ISTFA 2002; 617-622https://doi.org/10.31399/asm.cp.istfa2002p0617

View Articletitled, Boundary-Scan’s Next Plateau: Testing and In-System Configuration at the System Level

Functional Failure Analysis by Induced Stimulus

Jim Colvin

ISTFA 2002; 623-630https://doi.org/10.31399/asm.cp.istfa2002p0623

View Articletitled, Functional Failure Analysis by Induced Stimulus

Case Studies of IR Based Rapid PC Motherboard Failure Analysis

Jan Swart; John Woo; Randall Zumwalt; Jeff Birdsley; Yitages Taffese

ISTFA 2002; 631-641https://doi.org/10.31399/asm.cp.istfa2002p0631

View Articletitled, Case Studies of IR Based Rapid PC Motherboard Failure Analysis

Die Level Fault Isolation

Picosecond Imaging Circuit Analysis of Leakage Currents in CMOS Circuits

Stas Polonsky; Alan Weger; Moyra McManus

ISTFA 2002; 387-390https://doi.org/10.31399/asm.cp.istfa2002p0387

View Articletitled, Picosecond Imaging Circuit Analysis of Leakage Currents in CMOS Circuits

Scanning SQUID Microscopy for Die Level Fault Isolation

David P. Vallett

ISTFA 2002; 391-396https://doi.org/10.31399/asm.cp.istfa2002p0391

View Articletitled, Scanning SQUID Microscopy for Die Level Fault Isolation

A Successful Failure Localization Approach for Defect Identification on High Resistance Interconnects

Yu-Ting Lin; Y.S. Huang; C.S. Lee; C.M. Cheng; Will Hsu

ISTFA 2002; 397-401https://doi.org/10.31399/asm.cp.istfa2002p0397

View Articletitled, A Successful Failure Localization Approach for Defect Identification on High Resistance Interconnects

Backside FIB Device Modifications Through the BOX Layer of an SOI Device

Jeffery P. Huynh; Joseph P. Shannon; Richard W. Johnson; Mike Santana, Jr.; Thomas Y. Chu; Manuel Gonzalez

ISTFA 2002; 403-407https://doi.org/10.31399/asm.cp.istfa2002p0403

View Articletitled, Backside FIB Device Modifications Through the BOX Layer of an SOI Device

Coaxial, Photon-Ion Technology Enables Direct Navigation to Buried Nodes on Planarized Surfaces, Including Silicon

M. A. Thompsona; E. Le Roya; T. Lundquista; W. B. Thompsona; C. Richardsonb

ISTFA 2002; 409-417https://doi.org/10.31399/asm.cp.istfa2002p0409

View Articletitled, Coaxial, Photon-Ion Technology Enables Direct Navigation to Buried Nodes on Planarized Surfaces, Including Silicon

Infrared Emission-based Static Logic State Imaging on Advanced Silicon Technologies

Daniel R. Bockelman; Steven Chen; Borna Obradovic

ISTFA 2002; 531-537https://doi.org/10.31399/asm.cp.istfa2002p0531

View Articletitled, Infrared Emission-based Static Logic State Imaging on Advanced Silicon Technologies

Pseudo-Dynamic Fault Isolation Technique Using Backside Emission Microscopy – Case Study, Where All Other Methods Fail

Yoav Weizman; Ezra Baruch; Michael Zimin

ISTFA 2002; 539-542https://doi.org/10.31399/asm.cp.istfa2002p0539

View Articletitled, Pseudo-Dynamic Fault Isolation Technique Using Backside Emission Microscopy – Case Study, Where All Other Methods Fail

Laser Beam Based ESD Defect Localization in ICs

Félix Beaudoin; Philippe Perdu; Romain Desplats; Emmanuel Doche; Alain Wislez; Thomas Beauchêne; Dean Lewis; Dominique Carisetti; David Trémouilles; Marise Bafleur

ISTFA 2002; 543-551https://doi.org/10.31399/asm.cp.istfa2002p0543

View Articletitled, Laser Beam Based ESD Defect Localization in ICs

Advanced sub 0.13µm Cu Devices – Failure Analysis and Circuit Edit With Improved FIB Chemical Processes and Beam Characteristics

J. David Casey, Jr.; Thomas J. Gannon; Alex Krechmer; David Monforte; Nicholas Antoniou; Neil Bassom; Chuong Huynh; Brian Silva; Raymond Hill; George Gu; Valery Ray; Andrew Saxonis; Clive Chandler; Michael Megorden; Peter Carleson; Michael Phaneuf; Jian Li

ISTFA 2002; 553-557https://doi.org/10.31399/asm.cp.istfa2002p0553

View Articletitled, Advanced sub 0.13µm Cu Devices – Failure Analysis and Circuit Edit With Improved FIB Chemical Processes and Beam Characteristics

Microwave Frequency Signal Propagation in Backside Focused Ion Beam (FIB) Fabricated Interconnects

Jeremy A. Rowlette; M. DiBattista; Seth Fortuna; Richard H. Livengood

ISTFA 2002; 559-568https://doi.org/10.31399/asm.cp.istfa2002p0559

View Articletitled, Microwave Frequency Signal Propagation in Backside Focused Ion Beam (FIB) Fabricated Interconnects

Discretes

Tin Whiskers on Discrete Components: The Problem

Jocelyn P. Siplon; Gary J. Ewell; Eric Frasco; Tom Gibson; Jay A. Brusse

ISTFA 2002; 421-434https://doi.org/10.31399/asm.cp.istfa2002p0421

View Articletitled, Tin Whiskers on Discrete Components: The Problem

Electron Beam Induced Luminescence

N.C. Miller; K.P. Rispoli

ISTFA 2002; 435-438https://doi.org/10.31399/asm.cp.istfa2002p0435

View Articletitled, Electron Beam Induced Luminescence

High Power Testing of Optical Connectors

Paola Furcas; Rosanna Pastorelli; Giulia Salmini; Massimo Vanzi

ISTFA 2002; 439-444https://doi.org/10.31399/asm.cp.istfa2002p0439

View Articletitled, High Power Testing of Optical Connectors

Failure Analysis of LCD Drivers: A Case Study

A. C. C. Telles; L. R. Felix; M. H. Comerlato; A. P. Mammana; D. S. Rozario; S. Eleutério Filho

ISTFA 2002; 445-448https://doi.org/10.31399/asm.cp.istfa2002p0445

View Articletitled, Failure Analysis of LCD Drivers: A Case Study

Plastic BGA Module FA Process Flow Development

Zhaofeng Wang; Lars Wagner; Chuan Cheah

ISTFA 2002; 449-451https://doi.org/10.31399/asm.cp.istfa2002p0449

View Articletitled, Plastic BGA Module FA Process Flow Development

Scanning Probe Microscopy

What Can a Failure Analyst Do With an AFM?

Andrew N. Erickson

ISTFA 2002; 455-459https://doi.org/10.31399/asm.cp.istfa2002p0455

View Articletitled, What Can a Failure Analyst Do With an AFM?

Microprobing on Sub-Micron Features on ICs Using an AFM Based Technique

Rama R. Goruganthu; Shawn McBride; Mike Santana, Jr.; Mehrdad Mahanpour

ISTFA 2002; 461-465https://doi.org/10.31399/asm.cp.istfa2002p0461

View Articletitled, Microprobing on Sub-Micron Features on ICs Using an AFM Based Technique

Site Specific 2-D Implant Profiling Using FIB Assisted SCM

Konrad Jarausch; John F. Richards; Lloyd Denney; Alex Guichard; Phillip E. Russell

ISTFA 2002; 467-471https://doi.org/10.31399/asm.cp.istfa2002p0467

View Articletitled, Site Specific 2-D Implant Profiling Using FIB Assisted SCM

Conducting Atomic-Force Microscopy Investigations on Thin Silicon Gate Oxides: Influence of Tip Shape and Humidity

S. Kremmer; S. Peissl; C. Teichert; F. Kuchar

ISTFA 2002; 473-482https://doi.org/10.31399/asm.cp.istfa2002p0473

View Articletitled, Conducting Atomic-Force Microscopy Investigations on Thin Silicon Gate Oxides: Influence of Tip Shape and Humidity

Enhancements of Non-contact Measurements of Electrical Waveforms on the Proximity of a Signal Surface Using Groups of Pulses

Fenglei Du; Greg Bridges; D.J. Thomson; Rama R. Goruganthu; Shawn McBride; Mike Santana, Jr.

ISTFA 2002; 483-492https://doi.org/10.31399/asm.cp.istfa2002p0483

View Articletitled, Enhancements of Non-contact Measurements of Electrical Waveforms on the Proximity of a Signal Surface Using Groups of Pulses

Yield Enhancement

Targeted Defect Analysis for Yield Improvement

Luis Andrade; Timothy Bynum; Richard Doyle; Brian Flaherty; David Grammer; Chris Jacobs; Mark Luzar; Eric McDaniel; Dave Ricks; Randall Stanley; Tom Taylor

ISTFA 2002; 571-577https://doi.org/10.31399/asm.cp.istfa2002p0571

View Articletitled, Targeted Defect Analysis for Yield Improvement

Driving Baseline Yields on ASICs Using Logic Mapping

Brady R. Benware

ISTFA 2002; 579-586https://doi.org/10.31399/asm.cp.istfa2002p0579

View Articletitled, Driving Baseline Yields on ASICs Using Logic Mapping

Methodology to Correlate Defect Reduction Systems to Electrical Test Data via Artificially Manufactured Defects

Mike Santana, Jr.; Alfredo V. Herrera

ISTFA 2002; 587-589https://doi.org/10.31399/asm.cp.istfa2002p0587

View Articletitled, Methodology to Correlate Defect Reduction Systems to Electrical Test Data via Artificially Manufactured Defects

Real Time Fault Site Isolation of Front-End Defects in ULSI-ESRAM Utilizing In-Line Passive Voltage Contrast Inspection

Oliver D. Patterson; Jennifer L. Drown; Brian D. Crevasse; Ahmed Salah; Keiko K. Harris

ISTFA 2002; 591-598https://doi.org/10.31399/asm.cp.istfa2002p0591

View Articletitled, Real Time Fault Site Isolation of Front-End Defects in ULSI-ESRAM Utilizing In-Line Passive Voltage Contrast Inspection

N-Channel Sub-Threshold Leakage “Pipes” Generated From Micro-Twinning Near Shallow Trench Isolation Interface

Erick M. Spory

ISTFA 2002; 599-606https://doi.org/10.31399/asm.cp.istfa2002p0599

View Articletitled, N-Channel Sub-Threshold Leakage “Pipes” Generated From Micro-Twinning Near Shallow Trench Isolation Interface

Optical Probing

Prospects of Time-Resolved Photon Emission as a Debug Tool

Jim Vickers; Nader Pakdaman; Steven Kasapi

ISTFA 2002; 645-653https://doi.org/10.31399/asm.cp.istfa2002p0645

View Articletitled, Prospects of Time-Resolved Photon Emission as a Debug Tool

Defect Localization Using Time-Resolved Photon Emission on SOI Devices that Fail Scan Tests

Dan Bodoh; Ed Black; Kris Dickson; Ron Wang; Tim Cheng; Nader Pakdaman; Jim Vickers; Dan Cotton; Birk Lee

ISTFA 2002; 655-661https://doi.org/10.31399/asm.cp.istfa2002p0655

View Articletitled, Defect Localization Using Time-Resolved Photon Emission on SOI Devices that Fail Scan Tests

Timing Characterization of Multiple Timing Domains

Al an J. Weger; Moyra McManus; Peilin Song; Andy Muszynski

ISTFA 2002; 663-666https://doi.org/10.31399/asm.cp.istfa2002p0663

View Articletitled, Timing Characterization of Multiple Timing Domains

Circuit Voltage Probe Based on Time-Integrated Measurements of Optical Emission From Leakage Current

Franco Stellari; Peilin Song; James C. Tsang; Moyra K. McManus; Mark B. Ketchen

ISTFA 2002; 667-672https://doi.org/10.31399/asm.cp.istfa2002p0667

View Articletitled, Circuit Voltage Probe Based on Time-Integrated Measurements of Optical Emission From Leakage Current

Single Element Time Resolved Emission Probing for Practical Microprocessor Diagnostic Applications

Elizabeth B. Varner; Chi-Lin (Kenny) Young; Hung M.(Paul) Ng; Steven P. Maher; Travis M. Eiles; Birk Lee

ISTFA 2002; 741-746https://doi.org/10.31399/asm.cp.istfa2002p0741

View Articletitled, Single Element Time Resolved Emission Probing for Practical Microprocessor Diagnostic Applications

The Influence of Optical Beams on Semiconductor Devices During Failure Analysis

Charles Zhang; Matt Thayer; Lowell Herlinger; Greg Dabney; Manuel Gonzalez

ISTFA 2002; 747-751https://doi.org/10.31399/asm.cp.istfa2002p0747

View Articletitled, The Influence of Optical Beams on Semiconductor Devices During Failure Analysis

Next-Generation Optical Probing Tools for Design Debug of High Speed Integrated Circuits

William Lo; Kenneth Wilsher; Richard Malinsky; Nina Boiadjieva; Chun-Cheng Tsao; Martin Leibowitz; Hervé Deslandes

ISTFA 2002; 753-762https://doi.org/10.31399/asm.cp.istfa2002p0753

View Articletitled, Next-Generation Optical Probing Tools for Design Debug of High Speed Integrated Circuits

Test

Parametric Variation or Defects?: Statistical Post-Processing Analysis of Wafer-Sort Data

W. Robert Daasch

ISTFA 2002; 703-712https://doi.org/10.31399/asm.cp.istfa2002p0703

View Articletitled, Parametric Variation or Defects?: Statistical Post-Processing Analysis of Wafer-Sort Data

Diagnosis Using Quiescent Signal Analysis on a Commercial Power Grid

Chintan Patel; Ernesto Staroswiecki; Smita Pawar; Dhruva Acharyya; Jim Plusquellic

ISTFA 2002; 713-722https://doi.org/10.31399/asm.cp.istfa2002p0713

View Articletitled, Diagnosis Using Quiescent Signal Analysis on a Commercial Power Grid

A New Technique for Scan Chain Failure Diagnosis

Ruifeng Guo; Srikanth Venkataraman

ISTFA 2002; 723-732https://doi.org/10.31399/asm.cp.istfa2002p0723

View Articletitled, A New Technique for Scan Chain Failure Diagnosis

SEM in-situ Study of Electromigaration Induced Degradation Processes in Embedded Copper Interconnects

Eckhard Langer; Moritz Andreas Meyer; Ehrenfried Zschech; Marko Herrmann

ISTFA 2002; 733-737https://doi.org/10.31399/asm.cp.istfa2002p0733

View Articletitled, SEM <em>in-situ</em> Study of Electromigaration Induced Degradation Processes in Embedded Copper Interconnects

Volume Information

Credits

ISTFA 2002; iii-viiihttps://doi.org/10.31399/asm.cp.istfa2002fm01

View Articletitled, Credits

Preface

ISTFA 2002; xiiihttps://doi.org/10.31399/asm.cp.istfa2002fm02

View Articletitled, Preface