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Proceedings Papers

Proceedings Volume Cover
ISTFA 2001
November 11–15, 2001
Santa Clara, California, USA
Conference Sponsors:
  • Electronic Device Failure Analysis Society
  • ASM International
ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis
ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis

IPFA Best Paper Award Winner

Application of Focused Ion Beam System as A Defect Localization and Root Cause Analysis Tool
C.C. Ooi; K.H. Siek; K.S. Sim
ISTFA 2001; 3-7https://doi.org/10.31399/asm.cp.istfa2001p0003
View Articletitled, Application of Focused Ion Beam System as A Defect Localization and Root Cause Analysis Tool
PDF

Advanced Techniques

X-Ray Tomography of Integrated Circuit Interconnects: Past and Future
Zachary H. Levine; Steven Grantham
ISTFA 2001; 11-13https://doi.org/10.31399/asm.cp.istfa2001p0011
View Articletitled, X-Ray Tomography of Integrated Circuit Interconnects: Past and Future
PDF
X-Ray Nanotomography (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs
Wenbing Yun; Steve Wang; David Scott; Kenneth W. Nill; Waleed S. Haddad
ISTFA 2001; 15-22https://doi.org/10.31399/asm.cp.istfa2001p0015
View Articletitled, X-Ray Nanotomography (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs
PDF
Single Point PICA Probing with an Avalanche Photo-Diode
Mike Bruce; Rama R. Goruganthu; Shawn McBride; David Bethke; J.M. Chin
ISTFA 2001; 23-29https://doi.org/10.31399/asm.cp.istfa2001p0023
View Articletitled, Single Point PICA Probing with an Avalanche Photo-Diode
PDF
Comparison of Laser and Emission Based Optical Probe Techniques
William K. Lo; Steven Kasapi; Kenneth R. Wilsher
ISTFA 2001; 33-42https://doi.org/10.31399/asm.cp.istfa2001p0033
View Articletitled, Comparison of Laser and Emission Based Optical Probe Techniques
PDF
Resistive Interconnection Localization
Edward I. Cole, Jr.; Paiboon Tangyunyong; Charles F. Hawkins; Michael R. Bruce; Victoria J. Bruce; Wan-Loong Chong; Rosalinda M. Ring
ISTFA 2001; 43-50https://doi.org/10.31399/asm.cp.istfa2001p0043
View Articletitled, Resistive Interconnection Localization
PDF
Optical Waveform Probing – Strategies for Non-Fllpchlp Devices and Other Applications
Siva Kolachina; Kendall Scott Wills; Tim Nagel; Aswin Mehta; Rand Carawan; Omar Diaz de Leon; James Grund; Charles P. Todd; Kartik Ramanujachar; Sundari Nagarathnam; Christine Charpentier; Daniel Gobled; Willmar Subido
ISTFA 2001; 51-57https://doi.org/10.31399/asm.cp.istfa2001p0051
View Articletitled, Optical Waveform Probing – Strategies for Non-Fllpchlp Devices and Other Applications
PDF
Advanced LIVA/TIVA Techniques
R. Aaron Falk
ISTFA 2001; 59-65https://doi.org/10.31399/asm.cp.istfa2001p0059
View Articletitled, Advanced LIVA/TIVA Techniques
PDF

Packaging

Super-Conducting Quantum Interference Device Technique: 3-D Localization of a Short within a Flip Chip Assembly
Kendall Scott Wills; Omar Diaz de Leon; Kartik Ramanujachar; Charles P. Todd
ISTFA 2001; 69-76https://doi.org/10.31399/asm.cp.istfa2001p0069
View Articletitled, Super-Conducting Quantum Interference Device Technique: 3-D Localization of a Short within a Flip Chip Assembly
PDF
Integration of SQUID Microscopy into FA Flow
Rajen Dias; Lars Skoglund; Zhiyong Wang; David Smith
ISTFA 2001; 77-81https://doi.org/10.31399/asm.cp.istfa2001p0077
View Articletitled, Integration of SQUID Microscopy into FA Flow
PDF
Evaluation of Alternative Preparation Methods for Failure Analysis at Modern Chip and Package Technologies
A. Dübotzky; B. Krüger
ISTFA 2001; 83-86https://doi.org/10.31399/asm.cp.istfa2001p0083
View Articletitled, Evaluation of Alternative Preparation Methods for Failure Analysis at Modern Chip and Package Technologies
PDF
TDR Analysis of Advanced Microprocessors
David Bethke; Wayland Seifert
ISTFA 2001; 87-93https://doi.org/10.31399/asm.cp.istfa2001p0087
View Articletitled, TDR Analysis of Advanced Microprocessors
PDF
Signal Trace and Power Plane Shorts Fault Isolation Using TDR
Dima Smolyansky; Phoumra Tan; Donald Staab
ISTFA 2001; 95-98https://doi.org/10.31399/asm.cp.istfa2001p0095
View Articletitled, Signal Trace and Power Plane Shorts Fault Isolation Using TDR
PDF

Poster Session

Backside Etch: A New FA Technique for Gate Oxide Pinhole and Si Defect Identification for Power IC Devices
Zhaofeng Wang
ISTFA 2001; 101-103https://doi.org/10.31399/asm.cp.istfa2001p0101
View Articletitled, Backside Etch: A New FA Technique for Gate Oxide Pinhole and Si Defect Identification for Power IC Devices
PDF
Fabrication of Inexpensive Decapsulation Fixtures for Small or Unique Plastic Packages
Mark E. Kimball
ISTFA 2001; 105-108https://doi.org/10.31399/asm.cp.istfa2001p0105
View Articletitled, Fabrication of Inexpensive Decapsulation Fixtures for Small or Unique Plastic Packages
PDF
Failure Analysis of Plasma-Induced Submicron CMOS IC Yield Loss by Backside Photoemission Microscopy
Zong Min Wu; Chong Khiam Oh; Soh Ping Neo; Shailesh Redkar
ISTFA 2001; 109-113https://doi.org/10.31399/asm.cp.istfa2001p0109
View Articletitled, Failure Analysis of Plasma-Induced Submicron CMOS IC Yield Loss by Backside Photoemission Microscopy
PDF
Failure Types & Analysis In Cu Process Development of Design-Rule 0.18μm CPU
DongKwon Jeong; JuHyeon Ahn; SangIn Lee; JooHyuk Chung; ByungLyul Park; JeongLim Nam; SangRok Hah; Kyung-Tae Lee; Soocheol Lee
ISTFA 2001; 115-120https://doi.org/10.31399/asm.cp.istfa2001p0115
View Articletitled, Failure Types & Analysis In Cu Process Development of Design-Rule 0.18μm CPU
PDF
TEM Examination of a Specified Site Identified by X-SEM in Microelectronics Failure Analysis
J.Y. Dai; S.F. Tee; C. L. Tay; S. Ansari; E. Er; S. Redkar
ISTFA 2001; 121-123https://doi.org/10.31399/asm.cp.istfa2001p0121
View Articletitled, TEM Examination of a Specified Site Identified by X-SEM in Microelectronics Failure Analysis
PDF
Design Debug and Design Fix Verification in a Failure Analysis Lab for a RF/IF Circuit for Cellular Applications With High Battery Save and Electrostatic Discharge Leakage: A Case Study
Manoj Nair; Paul W. Sanders; Scott Kiefer; John Steele; Mauri S. Sutton; Syd R. Wilson; Richard Ida; Roger Miglore; John Quigley; Jim Rock
ISTFA 2001; 125-129https://doi.org/10.31399/asm.cp.istfa2001p0125
View Articletitled, Design Debug and Design Fix Verification in a Failure Analysis Lab for a RF/IF Circuit for Cellular Applications With High Battery Save and Electrostatic Discharge Leakage: A Case Study
PDF
Self Aligned Contact Wordline-Bitline Shorts in Memory ICs – A Comparative Study of a Failure Mode, Its Root Causes, and Simple, but Highly Effective Analysis Techniques
Jeremy D. Russell; Yuh-Juan Chew; Hong-Ming Chen; Christian Giethmann; Zhi-Hong Zhuo
ISTFA 2001; 131-137https://doi.org/10.31399/asm.cp.istfa2001p0131
View Articletitled, Self Aligned Contact Wordline-Bitline Shorts in Memory ICs – A Comparative Study of a Failure Mode, Its Root Causes, and Simple, but Highly Effective Analysis Techniques
PDF
A Spatial Filtering Localisation Tool for Failure Analysis of Periodic Circuits
Jeremy D. Russell
ISTFA 2001; 139-142https://doi.org/10.31399/asm.cp.istfa2001p0139
View Articletitled, A Spatial Filtering Localisation Tool for Failure Analysis of Periodic Circuits
PDF
New Manifestation of Electrical Overstress in Advanced Device Technologies
Kendall Scott Wills; Ron Parker; Charles Todd; N. Ahsan; Demmi Jaramillo; Daniel Gobled; Christine Charpentier; Jose Manni
ISTFA 2001; 143-148https://doi.org/10.31399/asm.cp.istfa2001p0143
View Articletitled, New Manifestation of Electrical Overstress in Advanced Device Technologies
PDF

Backside

Implementing Thermal Laser Stimulation in a Failure Analysis Laboratory
F. Beaudoin; R. Desplats; P. Perdu; D. Lewis
ISTFA 2001; 151-159https://doi.org/10.31399/asm.cp.istfa2001p0151
View Articletitled, Implementing Thermal Laser Stimulation in a Failure Analysis Laboratory
PDF
Calibration Technique for MCT FPA Used for Backside Emission Microscopy
Yoav Wiezman; Shai Shperber; E. Baruch
ISTFA 2001; 161-165https://doi.org/10.31399/asm.cp.istfa2001p0161
View Articletitled, Calibration Technique for MCT FPA Used for Backside Emission Microscopy
PDF
Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors
Travis M. Eiles; Patrick Pardy
ISTFA 2001; 167-170https://doi.org/10.31399/asm.cp.istfa2001p0167
View Articletitled, Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors
PDF
New Signal Detection Methods for Thermal Beam Induced Phenomenon
M. Palaniappan; J.M. Chin; B. Davis; M. Bruce; J. Wilcox; G. Gilfeather; C.M. Chua; L.S. Koh; H.Y. Ng; S.H. Tan; J.C.H. Phang
ISTFA 2001; 171-177https://doi.org/10.31399/asm.cp.istfa2001p0171
View Articletitled, New Signal Detection Methods for Thermal Beam Induced Phenomenon
PDF
CNC Milling and Polishing Techniques for Backside Sample Preparation
Romain Desplats; Felix Beaudoin; Philippe Perdu
ISTFA 2001; 179-187https://doi.org/10.31399/asm.cp.istfa2001p0179
View Articletitled, CNC Milling and Polishing Techniques for Backside Sample Preparation
PDF
Emission Microscopy and Thermal Laser Stimulation for Backside Failure Localization
F. Beaudoin; R. Desplats; P. Perdu; D. Patrie; G. Haller; P. Poirier; P.J. Jacob; D. Lewis
ISTFA 2001; 227-235https://doi.org/10.31399/asm.cp.istfa2001p0227
View Articletitled, Emission Microscopy and Thermal Laser Stimulation for Backside Failure Localization
PDF
CMOS Front-End Investigation Over Large Areas by Deprocessing from the Back Side
Frank Zachariasse
ISTFA 2001; 237-241https://doi.org/10.31399/asm.cp.istfa2001p0237
View Articletitled, CMOS Front-End Investigation Over Large Areas by Deprocessing from the Back Side
PDF
New Techniques for the Identification of Defects in Multi-layer Flip-Chip Packages
Steve K. Hsiung; Kevan V. Tan; Joe Luo
ISTFA 2001; 243-250https://doi.org/10.31399/asm.cp.istfa2001p0243
View Articletitled, New Techniques for the Identification of Defects in Multi-layer Flip-Chip Packages
PDF

Scanning Probe Microscopy

Characterization of MOS Devices by Scanning Thermal Microscopy (SThM)
T.H. Lee; G.B.M. Fiege; A. Altes; R. Heiderhoff; L.J. Balk; G. Zimmermann; V. Ng; J.C.H. Phang
ISTFA 2001; 191-197https://doi.org/10.31399/asm.cp.istfa2001p0191
View Articletitled, Characterization of MOS Devices by Scanning Thermal Microscopy (SThM)
PDF
Contactless Failure Analysis of Integrated Circuits Via Current Contrast Imaging With Magnetic Force Microscopy
W. Mertin; R. Weber; F. Seifert; E. Kubalek; G. Zimmermann; C. Boit
ISTFA 2001; 199-208https://doi.org/10.31399/asm.cp.istfa2001p0199
View Articletitled, Contactless Failure Analysis of Integrated Circuits Via Current Contrast Imaging With Magnetic Force Microscopy
PDF
Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes
Douglas J. Thomson; Greg Bridges; Kenneth Krieg
ISTFA 2001; 209-215https://doi.org/10.31399/asm.cp.istfa2001p0209
View Articletitled, Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes
PDF
Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects
Terence L. Kane; Patrick McGinnis; Brett Engel
ISTFA 2001; 217-224https://doi.org/10.31399/asm.cp.istfa2001p0217
View Articletitled, Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects
PDF

Case Histories

Board Level Failure Analysis of Chip Scale Packages
Shamsul Mohamed; Caroline Francis; Mohd Firoz Ismail; Lam Boon Yew
ISTFA 2001; 253-257https://doi.org/10.31399/asm.cp.istfa2001p0253
View Articletitled, Board Level Failure Analysis of Chip Scale Packages
PDF
IC Failure by Electrical Overstress (EOS)
Fan Wang; Hongxue Zhang; Petri Ronkainen; Pasi Välimäki
ISTFA 2001; 259-264https://doi.org/10.31399/asm.cp.istfa2001p0259
View Articletitled, IC Failure by Electrical Overstress (EOS)
PDF
The Search for the Elusive EOS Monster
James E. Vinson, Ph.D.
ISTFA 2001; 265-271https://doi.org/10.31399/asm.cp.istfa2001p0265
View Articletitled, The Search for the Elusive EOS Monster
PDF
A Successful Failure Analysis Using Front and Backside Fault Localization Techniques on a Deep Sub-micron CMOS Device
Yoshiteru Yamada; Hirotaka Komoda
ISTFA 2001; 305-311https://doi.org/10.31399/asm.cp.istfa2001p0305
View Articletitled, A Successful Failure Analysis Using Front and Backside Fault Localization Techniques on a Deep Sub-micron CMOS Device
PDF
Use of STEM in Nanometer Level Defect Analysis of SRAM Devices
Nathan Wang; Sabbas Daniel; Daniel Becker; Kevin Mcilwrath
ISTFA 2001; 313-317https://doi.org/10.31399/asm.cp.istfa2001p0313
View Articletitled, Use of STEM in Nanometer Level Defect Analysis of SRAM Devices
PDF
A New Deprocessing Technique by Selective Wet-Etch of Passivation and Inter Metal Dielectric Layers for Submicron Devices
Chong Khiam Oh; Zong Min Wu; Shailesh Redkar
ISTFA 2001; 319-322https://doi.org/10.31399/asm.cp.istfa2001p0319
View Articletitled, A New Deprocessing Technique by Selective Wet-Etch of Passivation and Inter Metal Dielectric Layers for Submicron Devices
PDF
SRAM Failure Analysis Flow
Christof Brillert; Christian Burmer; Peter Egger
ISTFA 2001; 323-329https://doi.org/10.31399/asm.cp.istfa2001p0323
View Articletitled, SRAM Failure Analysis Flow
PDF
Physical Failure Analysis on Vertical Dielectric Films
Michael W. Ruprecht; Timothy P. Pollock; Richard S. Kontra; Wayne S. Berry
ISTFA 2001; 331-341https://doi.org/10.31399/asm.cp.istfa2001p0331
View Articletitled, Physical Failure Analysis on Vertical Dielectric Films
PDF

Focused Ion Beam Microscopy

Effect of Ga Staining due to FIB Editing on IR Imaging of Flip Chips
Q. S. Wang; C.-C. Tsao; J. Fernandez; T. Lundquist; E. Delenia
ISTFA 2001; 275-280https://doi.org/10.31399/asm.cp.istfa2001p0275
View Articletitled, Effect of Ga Staining due to FIB Editing on IR Imaging of Flip Chips
PDF
Water Vapor Enhancement for Elemental Analysis Using Focused Ion Beam Secondary Ion Mass Spectrometry (FIB-SIMS)
T.L. Shofner; F.A. Stevie; J.M. McKinley; J. Lomness
ISTFA 2001; 281-284https://doi.org/10.31399/asm.cp.istfa2001p0281
View Articletitled, Water Vapor Enhancement for Elemental Analysis Using Focused Ion Beam Secondary Ion Mass Spectrometry (FIB-SIMS)
PDF
Various Focused Ion Beam Microsurgery Techniques in Dealing With Copper Metalization in ICs
Raymond A. Lee; Patrick Wolpert; Anant Pednekar
ISTFA 2001; 285-288https://doi.org/10.31399/asm.cp.istfa2001p0285
View Articletitled, Various Focused Ion Beam Microsurgery Techniques in Dealing With Copper Metalization in ICs
PDF
Reliability of Bipolar and MOS Circuits after FIB Modification
Romain Desplats; Jean Christophe Courrege; Bruno Benteo; Nicholas Antoniou; David Monforte
ISTFA 2001; 289-298https://doi.org/10.31399/asm.cp.istfa2001p0289
View Articletitled, Reliability of Bipolar and MOS Circuits after FIB Modification
PDF
Mass Production Cross-Section TEM Samples by Focus Ion Beam Masking and Reactive Ion Etching
Lancy Y. Tsung; Adolfo Anciso; Robert Turner; Thomas Dixon; Nathan Holloway
ISTFA 2001; 299-302https://doi.org/10.31399/asm.cp.istfa2001p0299
View Articletitled, Mass Production Cross-Section TEM Samples by Focus Ion Beam Masking and Reactive Ion Etching
PDF

Micro Electromechanical Systems

Design for Reliability of MEMS/MOEMS for Lightwave Telecommunications
Susanne Arney; Vladimir A. Aksyuk; David J. Bishop; Cristian A. Bolle; Robert E. Frahm; Arman Gasparyan; C. Randy Giles; Suresh Goyal; Flavio Pardo; Herbert R. Shea; Michael T. Lin; Carolyn D. White
ISTFA 2001; 345-348https://doi.org/10.31399/asm.cp.istfa2001p0345
View Articletitled, Design for Reliability of MEMS/MOEMS for Lightwave Telecommunications
PDF
Mechanical Characterization of Materials Used in MEMS
Sébastien Rigo; Jean Michel Desmarres; Talal Masri; Jacques Alain Petit
ISTFA 2001; 349-356https://doi.org/10.31399/asm.cp.istfa2001p0349
View Articletitled, Mechanical Characterization of Materials Used in MEMS
PDF
Optical Imaging of High-Frequency Resonances and Semi-Static Deformations in Micro-Electromechanical Systems (MEMS)
W. Merlijn van Spengen; Ingrid De Wolf; Robert Puers; Eiolf Vikhagen
ISTFA 2001; 357-364https://doi.org/10.31399/asm.cp.istfa2001p0357
View Articletitled, Optical Imaging of High-Frequency Resonances and Semi-Static Deformations in Micro-Electromechanical Systems (MEMS)
PDF
Failure Analysis of MEMS Electrostatic Drop Ejectors
Jeremy A. Walraven; Paul C. Galambos; Edward I. Cole, Jr.; Alejandro A. Pimentel; George Roller; Arthur Gooray
ISTFA 2001; 365-372https://doi.org/10.31399/asm.cp.istfa2001p0365
View Articletitled, Failure Analysis of MEMS Electrostatic Drop Ejectors
PDF
Characterization of CMOS MEMS Technology Scatterings
L. Latorre; V. Beroulle; M. Dardalhon; P. Nouet; F. Pressecq; C. Oudea
ISTFA 2001; 373-377https://doi.org/10.31399/asm.cp.istfa2001p0373
View Articletitled, Characterization of CMOS MEMS Technology Scatterings
PDF

Techniques

Defect Isolation and Characterization in Contacts by Primary Current and Voltage Adjustment
Jeng- Han Lee; Su-Chen Lee; Pei-Xuan Kuo
ISTFA 2001; 381-384https://doi.org/10.31399/asm.cp.istfa2001p0381
View Articletitled, Defect Isolation and Characterization in Contacts by Primary Current and Voltage Adjustment
PDF
Infrared Micro Thermography Applications in Fault Identification in Advanced BiCMOS Technology
Scott Kiefer; Manoj Nair; Paul Sanders; John Steele; Mauri Sutton; Syd Wilson; Grant Albright
ISTFA 2001; 385-388https://doi.org/10.31399/asm.cp.istfa2001p0385
View Articletitled, Infrared Micro Thermography Applications in Fault Identification in Advanced BiCMOS Technology
PDF
Choline OH Poly Silicon Etch for Gate Oxide Punch Through and Gate Oxide Integrity Testing
Jason M. Higgins
ISTFA 2001; 389-392https://doi.org/10.31399/asm.cp.istfa2001p0389
View Articletitled, Choline OH Poly Silicon Etch for Gate Oxide Punch Through and Gate Oxide Integrity Testing
PDF
The Preparation Method of ULSI Sample With Photoresist for TEM Analysis
Wen-Tung Chang; Jing-Fang Chiu; Hsing-Shuang Chou
ISTFA 2001; 393-396https://doi.org/10.31399/asm.cp.istfa2001p0393
View Articletitled, The Preparation Method of ULSI Sample With Photoresist for TEM Analysis
PDF
OBIRCH – Monitoring as a Reliability-Failure-Analysis and Screening Tool
Peter Jacob; Félix Beaudoin
ISTFA 2001; 397-403https://doi.org/10.31399/asm.cp.istfa2001p0397
View Articletitled, OBIRCH – Monitoring as a Reliability-Failure-Analysis and Screening Tool
PDF

Yield Improvement

A Self-Clustering Algorithm for Establishing Statistical Bin Limits Using Multi-Dimensional Data
Daniel M. Lund
ISTFA 2001; 407-417https://doi.org/10.31399/asm.cp.istfa2001p0407
View Articletitled, A Self-Clustering Algorithm for Establishing Statistical Bin Limits Using Multi-Dimensional Data
PDF
Structure Related Origins of the PtSi Schottky Diode Soft Leakage Current - the Root Cause of the Yield Loss
J.H. Mazur; R. Brox; W. Leitz; T. DeBolske; S. Nagalingam; W. Nehrer; L. Purvis; J. Jensen; I. Donnelly; Z.U. Rek
ISTFA 2001; 419-424https://doi.org/10.31399/asm.cp.istfa2001p0419
View Articletitled, Structure Related Origins of the PtSi Schottky Diode Soft Leakage Current - the Root Cause of the Yield Loss
PDF
Failure Analysis of Contamination and Gate/Tunnel Oxide Failure in Wafer Fabrication
Y. N. Hua; G. B. Ang; S. Redkar; Yogaspari
ISTFA 2001; 425-430https://doi.org/10.31399/asm.cp.istfa2001p0425
View Articletitled, Failure Analysis of Contamination and Gate/Tunnel Oxide Failure in Wafer Fabrication
PDF
Yield-limiting Defect Analysis in 0.15 μm Process Development
Z. G. Song; G. Qian; J. Y. Dai; S. Ansari; C. K. Oh; S. Redkar
ISTFA 2001; 431-435https://doi.org/10.31399/asm.cp.istfa2001p0431
View Articletitled, Yield-limiting Defect Analysis in 0.15 μm Process Development
PDF

Discretes

Imaging Failure Analysis Method for LCD
Shinji Takahashi; Katsuyuki Furumoto; Yoshiteru Kohno
ISTFA 2001; 439-446https://doi.org/10.31399/asm.cp.istfa2001p0439
View Articletitled, Imaging Failure Analysis Method for LCD
PDF
Improved Failure Analysis of Multilayer Ceramic Capacitors Using Thermal Imaging with Monitored Cross Sectioning and Novel Sample Preparation Methods
Eric B. Frasco; Robert Ferro; Tom Gibson; Nkiru Ogamba
ISTFA 2001; 447-450https://doi.org/10.31399/asm.cp.istfa2001p0447
View Articletitled, Improved Failure Analysis of Multilayer Ceramic Capacitors Using Thermal Imaging with Monitored Cross Sectioning and Novel Sample Preparation Methods
PDF
Tantalum Capacitor Failure Caused by Silver Migration
Fan Wang; Hongxue Zhang; Petri Ronkainen; Pasi Välimäki
ISTFA 2001; 451-455https://doi.org/10.31399/asm.cp.istfa2001p0451
View Articletitled, Tantalum Capacitor Failure Caused by Silver Migration
PDF

Defect-Based Testing

The Challenge of IC Test and Fault Diagnosis
Robert C. Aitken
ISTFA 2001; 459-464https://doi.org/10.31399/asm.cp.istfa2001p0459
View Articletitled, The Challenge of IC Test and Fault Diagnosis
PDF
Innovative Technique for Bitmap Verification Using Laser Light
K. Dickson; A. Blakely; T. Garyet
ISTFA 2001; 465-468https://doi.org/10.31399/asm.cp.istfa2001p0465
View Articletitled, Innovative Technique for Bitmap Verification Using Laser Light
PDF
Smart Testing Interface: New Inexpensive Tool for Defect Localization in ICs
P. Perdu; R. Desplats; F. Beaudoin; J.-Y. Bernard
ISTFA 2001; 469-475https://doi.org/10.31399/asm.cp.istfa2001p0469
View Articletitled, Smart Testing Interface: New Inexpensive Tool for Defect Localization in ICs
PDF
Failure Analysis of Silicided related Integral Nonlinearity in Submicron Digital-to-Analog Converters
Todd Mitchell; Ivan Sanchez; Marty Karnett; Bernard Ginetti
ISTFA 2001; 477-482https://doi.org/10.31399/asm.cp.istfa2001p0477
View Articletitled, Failure Analysis of Silicided related Integral Nonlinearity in Submicron Digital-to-Analog Converters
PDF

Volume Information

Credits
ISTFA 2001; iv-viiihttps://doi.org/10.31399/asm.cp.istfa2001fm01
View Articletitled, Credits
PDF
Preface
ISTFA 2001; xihttps://doi.org/10.31399/asm.cp.istfa2001fm02
View Articletitled, Preface
PDF
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