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ISTFA 2001

November 11–15, 2001

Santa Clara, California, USA

Conference Sponsors:

Electronic Device Failure Analysis Society
ASM International

ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis

Issue navigation

IPFA Best Paper Award Winner
Advanced Techniques
Packaging
Poster Session
Backside
Scanning Probe Microscopy
Backside
Case Histories
Focused Ion Beam Microscopy
Case Histories
Micro Electromechanical Systems
Techniques
Yield Improvement
Discretes
Defect-Based Testing
Volume Information

ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis

IPFA Best Paper Award Winner

Application of Focused Ion Beam System as A Defect Localization and Root Cause Analysis Tool

C.C. Ooi; K.H. Siek; K.S. Sim

ISTFA 2001; 3-7doi:https://doi.org/10.31399/asm.cp.istfa2001p0003

Advanced Techniques

X-Ray Tomography of Integrated Circuit Interconnects: Past and Future

Zachary H. Levine; Steven Grantham

ISTFA 2001; 11-13doi:https://doi.org/10.31399/asm.cp.istfa2001p0011

X-Ray Nanotomography (XRMT) Tool for Non-Destructive High-Resolution Imaging of ICs

Wenbing Yun; Steve Wang; David Scott; Kenneth W. Nill; Waleed S. Haddad

ISTFA 2001; 15-22doi:https://doi.org/10.31399/asm.cp.istfa2001p0015

Single Point PICA Probing with an Avalanche Photo-Diode

Mike Bruce; Rama R. Goruganthu; Shawn McBride; David Bethke; J.M. Chin

ISTFA 2001; 23-29doi:https://doi.org/10.31399/asm.cp.istfa2001p0023

Comparison of Laser and Emission Based Optical Probe Techniques

William K. Lo; Steven Kasapi; Kenneth R. Wilsher

ISTFA 2001; 33-42doi:https://doi.org/10.31399/asm.cp.istfa2001p0033

Resistive Interconnection Localization

Edward I. Cole, Jr.; Paiboon Tangyunyong; Charles F. Hawkins; Michael R. Bruce; Victoria J. Bruce; Wan-Loong Chong; Rosalinda M. Ring

ISTFA 2001; 43-50doi:https://doi.org/10.31399/asm.cp.istfa2001p0043

Optical Waveform Probing – Strategies for Non-Fllpchlp Devices and Other Applications

Siva Kolachina; Kendall Scott Wills; Tim Nagel; Aswin Mehta; Rand Carawan; Omar Diaz de Leon; James Grund; Charles P. Todd; Kartik Ramanujachar; Sundari Nagarathnam; Christine Charpentier; Daniel Gobled; Willmar Subido

ISTFA 2001; 51-57doi:https://doi.org/10.31399/asm.cp.istfa2001p0051

Advanced LIVA/TIVA Techniques

R. Aaron Falk

ISTFA 2001; 59-65doi:https://doi.org/10.31399/asm.cp.istfa2001p0059

Packaging

Super-Conducting Quantum Interference Device Technique: 3-D Localization of a Short within a Flip Chip Assembly

Kendall Scott Wills; Omar Diaz de Leon; Kartik Ramanujachar; Charles P. Todd

ISTFA 2001; 69-76doi:https://doi.org/10.31399/asm.cp.istfa2001p0069

Integration of SQUID Microscopy into FA Flow

Rajen Dias; Lars Skoglund; Zhiyong Wang; David Smith

ISTFA 2001; 77-81doi:https://doi.org/10.31399/asm.cp.istfa2001p0077

Evaluation of Alternative Preparation Methods for Failure Analysis at Modern Chip and Package Technologies

A. Dübotzky; B. Krüger

ISTFA 2001; 83-86doi:https://doi.org/10.31399/asm.cp.istfa2001p0083

TDR Analysis of Advanced Microprocessors

David Bethke; Wayland Seifert

ISTFA 2001; 87-93doi:https://doi.org/10.31399/asm.cp.istfa2001p0087

Signal Trace and Power Plane Shorts Fault Isolation Using TDR

Dima Smolyansky; Phoumra Tan; Donald Staab

ISTFA 2001; 95-98doi:https://doi.org/10.31399/asm.cp.istfa2001p0095

Poster Session

Backside Etch: A New FA Technique for Gate Oxide Pinhole and Si Defect Identification for Power IC Devices

Zhaofeng Wang

ISTFA 2001; 101-103doi:https://doi.org/10.31399/asm.cp.istfa2001p0101

Fabrication of Inexpensive Decapsulation Fixtures for Small or Unique Plastic Packages

Mark E. Kimball

ISTFA 2001; 105-108doi:https://doi.org/10.31399/asm.cp.istfa2001p0105

Failure Analysis of Plasma-Induced Submicron CMOS IC Yield Loss by Backside Photoemission Microscopy

Zong Min Wu; Chong Khiam Oh; Soh Ping Neo; Shailesh Redkar

ISTFA 2001; 109-113doi:https://doi.org/10.31399/asm.cp.istfa2001p0109

Failure Types & Analysis In Cu Process Development of Design-Rule 0.18μm CPU

DongKwon Jeong; JuHyeon Ahn; SangIn Lee; JooHyuk Chung; ByungLyul Park; JeongLim Nam; SangRok Hah; Kyung-Tae Lee; Soocheol Lee

ISTFA 2001; 115-120doi:https://doi.org/10.31399/asm.cp.istfa2001p0115

TEM Examination of a Specified Site Identified by X-SEM in Microelectronics Failure Analysis

J.Y. Dai; S.F. Tee; C. L. Tay; S. Ansari; E. Er; S. Redkar

ISTFA 2001; 121-123doi:https://doi.org/10.31399/asm.cp.istfa2001p0121

Design Debug and Design Fix Verification in a Failure Analysis Lab for a RF/IF Circuit for Cellular Applications With High Battery Save and Electrostatic Discharge Leakage: A Case Study

Manoj Nair; Paul W. Sanders; Scott Kiefer; John Steele; Mauri S. Sutton; Syd R. Wilson; Richard Ida; Roger Miglore; John Quigley; Jim Rock

ISTFA 2001; 125-129doi:https://doi.org/10.31399/asm.cp.istfa2001p0125

Self Aligned Contact Wordline-Bitline Shorts in Memory ICs – A Comparative Study of a Failure Mode, Its Root Causes, and Simple, but Highly Effective Analysis Techniques

Jeremy D. Russell; Yuh-Juan Chew; Hong-Ming Chen; Christian Giethmann; Zhi-Hong Zhuo

ISTFA 2001; 131-137doi:https://doi.org/10.31399/asm.cp.istfa2001p0131

A Spatial Filtering Localisation Tool for Failure Analysis of Periodic Circuits

Jeremy D. Russell

ISTFA 2001; 139-142doi:https://doi.org/10.31399/asm.cp.istfa2001p0139

New Manifestation of Electrical Overstress in Advanced Device Technologies

Kendall Scott Wills; Ron Parker; Charles Todd; N. Ahsan; Demmi Jaramillo; Daniel Gobled; Christine Charpentier; Jose Manni

ISTFA 2001; 143-148doi:https://doi.org/10.31399/asm.cp.istfa2001p0143

Backside

Implementing Thermal Laser Stimulation in a Failure Analysis Laboratory

F. Beaudoin; R. Desplats; P. Perdu; D. Lewis

ISTFA 2001; 151-159doi:https://doi.org/10.31399/asm.cp.istfa2001p0151

Calibration Technique for MCT FPA Used for Backside Emission Microscopy

Yoav Wiezman; Shai Shperber; E. Baruch

ISTFA 2001; 161-165doi:https://doi.org/10.31399/asm.cp.istfa2001p0161

Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors

Travis M. Eiles; Patrick Pardy

ISTFA 2001; 167-170doi:https://doi.org/10.31399/asm.cp.istfa2001p0167

New Signal Detection Methods for Thermal Beam Induced Phenomenon

M. Palaniappan; J.M. Chin; B. Davis; M. Bruce; J. Wilcox; G. Gilfeather; C.M. Chua; L.S. Koh; H.Y. Ng; S.H. Tan; J.C.H. Phang

ISTFA 2001; 171-177doi:https://doi.org/10.31399/asm.cp.istfa2001p0171

CNC Milling and Polishing Techniques for Backside Sample Preparation

Romain Desplats; Felix Beaudoin; Philippe Perdu

ISTFA 2001; 179-187doi:https://doi.org/10.31399/asm.cp.istfa2001p0179

Emission Microscopy and Thermal Laser Stimulation for Backside Failure Localization

F. Beaudoin; R. Desplats; P. Perdu; D. Patrie; G. Haller; P. Poirier; P.J. Jacob; D. Lewis

ISTFA 2001; 227-235doi:https://doi.org/10.31399/asm.cp.istfa2001p0227

CMOS Front-End Investigation Over Large Areas by Deprocessing from the Back Side

Frank Zachariasse

ISTFA 2001; 237-241doi:https://doi.org/10.31399/asm.cp.istfa2001p0237

New Techniques for the Identification of Defects in Multi-layer Flip-Chip Packages

Steve K. Hsiung; Kevan V. Tan; Joe Luo

ISTFA 2001; 243-250doi:https://doi.org/10.31399/asm.cp.istfa2001p0243

Scanning Probe Microscopy

Characterization of MOS Devices by Scanning Thermal Microscopy (SThM)

T.H. Lee; G.B.M. Fiege; A. Altes; R. Heiderhoff; L.J. Balk; G. Zimmermann; V. Ng; J.C.H. Phang

ISTFA 2001; 191-197doi:https://doi.org/10.31399/asm.cp.istfa2001p0191

Contactless Failure Analysis of Integrated Circuits Via Current Contrast Imaging With Magnetic Force Microscopy

W. Mertin; R. Weber; F. Seifert; E. Kubalek; G. Zimmermann; C. Boit

ISTFA 2001; 199-208doi:https://doi.org/10.31399/asm.cp.istfa2001p0199

Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes

Douglas J. Thomson; Greg Bridges; Kenneth Krieg

ISTFA 2001; 209-215doi:https://doi.org/10.31399/asm.cp.istfa2001p0209

Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects

Terence L. Kane; Patrick McGinnis; Brett Engel

ISTFA 2001; 217-224doi:https://doi.org/10.31399/asm.cp.istfa2001p0217

Case Histories

Board Level Failure Analysis of Chip Scale Packages

Shamsul Mohamed; Caroline Francis; Mohd Firoz Ismail; Lam Boon Yew

ISTFA 2001; 253-257doi:https://doi.org/10.31399/asm.cp.istfa2001p0253

IC Failure by Electrical Overstress (EOS)

Fan Wang; Hongxue Zhang; Petri Ronkainen; Pasi Välimäki

ISTFA 2001; 259-264doi:https://doi.org/10.31399/asm.cp.istfa2001p0259

The Search for the Elusive EOS Monster

James E. Vinson, Ph.D.

ISTFA 2001; 265-271doi:https://doi.org/10.31399/asm.cp.istfa2001p0265

A Successful Failure Analysis Using Front and Backside Fault Localization Techniques on a Deep Sub-micron CMOS Device

Yoshiteru Yamada; Hirotaka Komoda

ISTFA 2001; 305-311doi:https://doi.org/10.31399/asm.cp.istfa2001p0305

Use of STEM in Nanometer Level Defect Analysis of SRAM Devices

Nathan Wang; Sabbas Daniel; Daniel Becker; Kevin Mcilwrath

ISTFA 2001; 313-317doi:https://doi.org/10.31399/asm.cp.istfa2001p0313

A New Deprocessing Technique by Selective Wet-Etch of Passivation and Inter Metal Dielectric Layers for Submicron Devices

Chong Khiam Oh; Zong Min Wu; Shailesh Redkar

ISTFA 2001; 319-322doi:https://doi.org/10.31399/asm.cp.istfa2001p0319

SRAM Failure Analysis Flow

Christof Brillert; Christian Burmer; Peter Egger

ISTFA 2001; 323-329doi:https://doi.org/10.31399/asm.cp.istfa2001p0323

Physical Failure Analysis on Vertical Dielectric Films

Michael W. Ruprecht; Timothy P. Pollock; Richard S. Kontra; Wayne S. Berry

ISTFA 2001; 331-341doi:https://doi.org/10.31399/asm.cp.istfa2001p0331

Focused Ion Beam Microscopy

Effect of Ga Staining due to FIB Editing on IR Imaging of Flip Chips

Q. S. Wang; C.-C. Tsao; J. Fernandez; T. Lundquist; E. Delenia

ISTFA 2001; 275-280doi:https://doi.org/10.31399/asm.cp.istfa2001p0275

Water Vapor Enhancement for Elemental Analysis Using Focused Ion Beam Secondary Ion Mass Spectrometry (FIB-SIMS)

T.L. Shofner; F.A. Stevie; J.M. McKinley; J. Lomness

ISTFA 2001; 281-284doi:https://doi.org/10.31399/asm.cp.istfa2001p0281

Various Focused Ion Beam Microsurgery Techniques in Dealing With Copper Metalization in ICs

Raymond A. Lee; Patrick Wolpert; Anant Pednekar

ISTFA 2001; 285-288doi:https://doi.org/10.31399/asm.cp.istfa2001p0285

Reliability of Bipolar and MOS Circuits after FIB Modification

Romain Desplats; Jean Christophe Courrege; Bruno Benteo; Nicholas Antoniou; David Monforte

ISTFA 2001; 289-298doi:https://doi.org/10.31399/asm.cp.istfa2001p0289

Mass Production Cross-Section TEM Samples by Focus Ion Beam Masking and Reactive Ion Etching

Lancy Y. Tsung; Adolfo Anciso; Robert Turner; Thomas Dixon; Nathan Holloway

ISTFA 2001; 299-302doi:https://doi.org/10.31399/asm.cp.istfa2001p0299

Micro Electromechanical Systems

Design for Reliability of MEMS/MOEMS for Lightwave Telecommunications

Susanne Arney; Vladimir A. Aksyuk; David J. Bishop; Cristian A. Bolle; Robert E. Frahm; Arman Gasparyan; C. Randy Giles; Suresh Goyal; Flavio Pardo; Herbert R. Shea; Michael T. Lin; Carolyn D. White

ISTFA 2001; 345-348doi:https://doi.org/10.31399/asm.cp.istfa2001p0345

Mechanical Characterization of Materials Used in MEMS

Sébastien Rigo; Jean Michel Desmarres; Talal Masri; Jacques Alain Petit

ISTFA 2001; 349-356doi:https://doi.org/10.31399/asm.cp.istfa2001p0349

Optical Imaging of High-Frequency Resonances and Semi-Static Deformations in Micro-Electromechanical Systems (MEMS)

W. Merlijn van Spengen; Ingrid De Wolf; Robert Puers; Eiolf Vikhagen

ISTFA 2001; 357-364doi:https://doi.org/10.31399/asm.cp.istfa2001p0357

Failure Analysis of MEMS Electrostatic Drop Ejectors

Jeremy A. Walraven; Paul C. Galambos; Edward I. Cole, Jr.; Alejandro A. Pimentel; George Roller; Arthur Gooray

ISTFA 2001; 365-372doi:https://doi.org/10.31399/asm.cp.istfa2001p0365

Characterization of CMOS MEMS Technology Scatterings

L. Latorre; V. Beroulle; M. Dardalhon; P. Nouet; F. Pressecq; C. Oudea

ISTFA 2001; 373-377doi:https://doi.org/10.31399/asm.cp.istfa2001p0373

Techniques

Defect Isolation and Characterization in Contacts by Primary Current and Voltage Adjustment

Jeng- Han Lee; Su-Chen Lee; Pei-Xuan Kuo

ISTFA 2001; 381-384doi:https://doi.org/10.31399/asm.cp.istfa2001p0381

Infrared Micro Thermography Applications in Fault Identification in Advanced BiCMOS Technology

Scott Kiefer; Manoj Nair; Paul Sanders; John Steele; Mauri Sutton; Syd Wilson; Grant Albright

ISTFA 2001; 385-388doi:https://doi.org/10.31399/asm.cp.istfa2001p0385

Choline OH Poly Silicon Etch for Gate Oxide Punch Through and Gate Oxide Integrity Testing

Jason M. Higgins

ISTFA 2001; 389-392doi:https://doi.org/10.31399/asm.cp.istfa2001p0389

The Preparation Method of ULSI Sample With Photoresist for TEM Analysis

Wen-Tung Chang; Jing-Fang Chiu; Hsing-Shuang Chou

ISTFA 2001; 393-396doi:https://doi.org/10.31399/asm.cp.istfa2001p0393

OBIRCH – Monitoring as a Reliability-Failure-Analysis and Screening Tool

Peter Jacob; Félix Beaudoin

ISTFA 2001; 397-403doi:https://doi.org/10.31399/asm.cp.istfa2001p0397

Yield Improvement

A Self-Clustering Algorithm for Establishing Statistical Bin Limits Using Multi-Dimensional Data

Daniel M. Lund

ISTFA 2001; 407-417doi:https://doi.org/10.31399/asm.cp.istfa2001p0407

Structure Related Origins of the PtSi Schottky Diode Soft Leakage Current - the Root Cause of the Yield Loss

J.H. Mazur; R. Brox; W. Leitz; T. DeBolske; S. Nagalingam; W. Nehrer; L. Purvis; J. Jensen; I. Donnelly; Z.U. Rek

ISTFA 2001; 419-424doi:https://doi.org/10.31399/asm.cp.istfa2001p0419

Failure Analysis of Contamination and Gate/Tunnel Oxide Failure in Wafer Fabrication

Y. N. Hua; G. B. Ang; S. Redkar; Yogaspari

ISTFA 2001; 425-430doi:https://doi.org/10.31399/asm.cp.istfa2001p0425

Yield-limiting Defect Analysis in 0.15 μm Process Development

Z. G. Song; G. Qian; J. Y. Dai; S. Ansari; C. K. Oh; S. Redkar

ISTFA 2001; 431-435doi:https://doi.org/10.31399/asm.cp.istfa2001p0431

Discretes

Imaging Failure Analysis Method for LCD

Shinji Takahashi; Katsuyuki Furumoto; Yoshiteru Kohno

ISTFA 2001; 439-446doi:https://doi.org/10.31399/asm.cp.istfa2001p0439

Improved Failure Analysis of Multilayer Ceramic Capacitors Using Thermal Imaging with Monitored Cross Sectioning and Novel Sample Preparation Methods

Eric B. Frasco; Robert Ferro; Tom Gibson; Nkiru Ogamba

ISTFA 2001; 447-450doi:https://doi.org/10.31399/asm.cp.istfa2001p0447

Tantalum Capacitor Failure Caused by Silver Migration

Fan Wang; Hongxue Zhang; Petri Ronkainen; Pasi Välimäki

ISTFA 2001; 451-455doi:https://doi.org/10.31399/asm.cp.istfa2001p0451

Defect-Based Testing

The Challenge of IC Test and Fault Diagnosis

Robert C. Aitken

ISTFA 2001; 459-464doi:https://doi.org/10.31399/asm.cp.istfa2001p0459

Innovative Technique for Bitmap Verification Using Laser Light

K. Dickson; A. Blakely; T. Garyet

ISTFA 2001; 465-468doi:https://doi.org/10.31399/asm.cp.istfa2001p0465

Smart Testing Interface: New Inexpensive Tool for Defect Localization in ICs

P. Perdu; R. Desplats; F. Beaudoin; J.-Y. Bernard

ISTFA 2001; 469-475doi:https://doi.org/10.31399/asm.cp.istfa2001p0469

Failure Analysis of Silicided related Integral Nonlinearity in Submicron Digital-to-Analog Converters

Todd Mitchell; Ivan Sanchez; Marty Karnett; Bernard Ginetti

ISTFA 2001; 477-482doi:https://doi.org/10.31399/asm.cp.istfa2001p0477

Volume Information

Credits

ISTFA 2001; iv-viiidoi:https://doi.org/10.31399/asm.cp.istfa2001fm01

Preface

ISTFA 2001; xidoi:https://doi.org/10.31399/asm.cp.istfa2001fm02

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