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Proceedings Papers
ISTFA 2000
November 12–16, 2000
Bellevue, Washington, USA
Conference Sponsors:
- Electronic Device Failure Analysis Society
- ASM International
ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis
IPFA Best Paper Award Winner
Advanced Techniques
Packaging
Measurement of Interfacial Adhesion and its Degradation in Multi-Layer Packages, Devices, and Blanket Films Using the Laser Spallation Technique
Vijay Gupta; Robert Hernandez; Rajen Dias; Vasudeva Atluri; George Raiser; Mike Mello; Lars Skoglund; Paul Zimmerman
ISTFA 2000; 25-33https://doi.org/10.31399/asm.cp.istfa2000p0025
Test/Yield
Poster Session
Backside
EOS/ESD
Techniques
Case Histories
FIB
Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB/Dual Beam Inline Application
R. Weiland; C. Boit; B. Ebersberger; P. Meis; N. Dawes; A. Dziesiaty; H. Zimmermann; E. Demm; A. Hirsch; L. Frey; C. Lehrer; S. Geyer; M. Kamolz; H. Rettenmaier; W. Tittes; H. Lezec; R. Treichler
ISTFA 2000; 393-396https://doi.org/10.31399/asm.cp.istfa2000p0393
Discretes
Temperature Distributions in III-V and SiC Micro-Wave Power Transistors Using Spatially Resolved Photoluminescence and Raman-Spectrometry Mapping Respectively
P. Martin; R. Bisaro; C. Dua; O. Noblanc; S. L. Delage; D. Floriot; F. Lemaire; P. Galtier; J. P. Landesman; C. Brylinski
ISTFA 2000; 435-442https://doi.org/10.31399/asm.cp.istfa2000p0435
Scanning Probe Microscopy
Volume Information
Credits
ISTFA 2000; iv-viiihttps://doi.org/10.31399/asm.cp.istfa2000fm01