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ISTFA 2000

November 12–16, 2000

Bellevue, Washington, USA

Conference Sponsors:

Electronic Device Failure Analysis Society
ASM International

ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis

Issue navigation

IPFA Best Paper Award Winner
Advanced Techniques
Packaging
Test/Yield
Poster Session
Backside
EOS/ESD
Techniques
Case Histories
Packaging
Case Histories
Packaging
Case Histories
FIB
Discretes
Techniques
Case Histories
Scanning Probe Microscopy
Backside
Volume Information

ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis

IPFA Best Paper Award Winner

Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors

Wai Mun Yee; Mario Paniccia; Travis Eiles; Valluri Rao

ISTFA 2000; 3-8https://doi.org/10.31399/asm.cp.istfa2000p0003

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Advanced Techniques

Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis and Microcharacterization

W-K Wong; J.T.L. Thong; J.C.H. Phang; Q.R. Yin; J.W. Fang

ISTFA 2000; 11-16https://doi.org/10.31399/asm.cp.istfa2000p0011

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Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis

M. Palaniappan; J.M. Chin; J.C.H. Phang; D.S.H. Chan; C.E. Soh; G. Gilfeather

ISTFA 2000; 17-21https://doi.org/10.31399/asm.cp.istfa2000p0017

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Packaging

Measurement of Interfacial Adhesion and its Degradation in Multi-Layer Packages, Devices, and Blanket Films Using the Laser Spallation Technique

Vijay Gupta; Robert Hernandez; Rajen Dias; Vasudeva Atluri; George Raiser; Mike Mello; Lars Skoglund; Paul Zimmerman

ISTFA 2000; 25-33https://doi.org/10.31399/asm.cp.istfa2000p0025

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New FIB-Supported Approach for Wire-Bondpad Characterization

Peter Jacob; Giovanni Nicoletti

ISTFA 2000; 35-40https://doi.org/10.31399/asm.cp.istfa2000p0035

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Failure Analysis of Flip-Chip Bumps After Thermal Stressing

Tejpal K. Hooghan; Kultaransingh Hooghan; Sho Nakahara; Robert K. Wolf; Robert W. Privette; Ralph S. Moyer

ISTFA 2000; 41-48https://doi.org/10.31399/asm.cp.istfa2000p0041

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X-Ray Tomography for Electronic Packages

Deepak Goyal

ISTFA 2000; 49-54https://doi.org/10.31399/asm.cp.istfa2000p0049

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Electronic Package Failure Analysis Using TDR

Dima A. Smolyansky

ISTFA 2000; 277-283https://doi.org/10.31399/asm.cp.istfa2000p0277

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Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool

Damion T. Searls; Anura Don; Emilie Dy; Deepak Goyal

ISTFA 2000; 285-291https://doi.org/10.31399/asm.cp.istfa2000p0285

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Contrast Inversions in Scanning Acoustic Microscopy (C-SAM) of Glue Die-Attach

Boris Plikat

ISTFA 2000; 293-302https://doi.org/10.31399/asm.cp.istfa2000p0293

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Application of Scanning Acoustic Microscopy to Electric and Electronic Parts

C. Miyasaka; B. R. Tittmann

ISTFA 2000; 303-306https://doi.org/10.31399/asm.cp.istfa2000p0303

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Failure Analysis of Stacked-Chip Scale Package

Christopher C. Flores

ISTFA 2000; 333-337https://doi.org/10.31399/asm.cp.istfa2000p0333

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Reducing Top-of-Die Plastic Delamination by Assuring Pre-Mold Cleanliness of Die Surfaces

R.K. Lowry; J.H. Linn; A.L. Northen; J.R. Zalnoski; H.W. Satterfield

ISTFA 2000; 339-345https://doi.org/10.31399/asm.cp.istfa2000p0339

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SMT Ceramic Capacitor Failure Mechanisms, Isolation Tools, Techniques and Analysis Methods

Ralph A. Carbone; David J. Roche

ISTFA 2000; 347-353https://doi.org/10.31399/asm.cp.istfa2000p0347

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Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

George M. Wenger; Richard J. Coyle; Patrick P. Solan; John K. Dorey; Courtney V. Dodd; Anthony Primavera; Robert Erich

ISTFA 2000; 355-366https://doi.org/10.31399/asm.cp.istfa2000p0355

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Test/Yield

Data Analysis Tools and Methodologies for Quick Yield Learning in a High Volume Manufacturing Environment

L. Andrade; T. Taylor

ISTFA 2000; 57-62https://doi.org/10.31399/asm.cp.istfa2000p0057

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Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication

Y. N. Hua; Z. R. Guo; L. H. An; Shailesh Redkar

ISTFA 2000; 63-68https://doi.org/10.31399/asm.cp.istfa2000p0063

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Embedded Memory Analysis for Standard Cell ASIC Yield Enhancement

Cary A. Gloor

ISTFA 2000; 69-75https://doi.org/10.31399/asm.cp.istfa2000p0069

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Yield Enhancement Study: Process Variation and Design Margins Leading to Timing Issues in the RAM

Srikanth Perungulam; Scott Wills; Greg Mekras

ISTFA 2000; 77-79https://doi.org/10.31399/asm.cp.istfa2000p0077

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In-Line Defect to Bitmap Signature Correlation: A Shortcut to Physical FA Results

Julie Segal; Arman Sagatelian; Bob Hodgkins; Tom Ho; Ben Chu; Tony Singh; Harvey Berman

ISTFA 2000; 81-85https://doi.org/10.31399/asm.cp.istfa2000p0081

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Poster Session

Analysis of Leakage Failures in Flash Memory Devices and Root Cause Identification

J. N. C. de Luna; M. O. del Fierro; J. L. Muñoz

ISTFA 2000; 89-91https://doi.org/10.31399/asm.cp.istfa2000p0089

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Passive Voltage Contrast Application on Analysis of Gate Oxide Failure in 0.25 μm Technology

Song Zhigang; Loh Sock Khim; Shailesh Redkar

ISTFA 2000; 93-95https://doi.org/10.31399/asm.cp.istfa2000p0093

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Forensic Microscopy in the Failure Analysis Laboratory

William E. Vanderlinde; David A. Stoney

ISTFA 2000; 97-105https://doi.org/10.31399/asm.cp.istfa2000p0097

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Failure Analysis Process Flows and Common Failure Mechanisms in Flip-Chip Packaged Device

Steve Hsiung; Victer Chan

ISTFA 2000; 107-115https://doi.org/10.31399/asm.cp.istfa2000p0107

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A Study on the Yield Loss Due to Al(Cu) Interconnections with Spacing Failure

Ruey Lian Hwang; Yung-Sheng Huang; Ying-Lang Wang; Ming-Jer Lee

ISTFA 2000; 117-120https://doi.org/10.31399/asm.cp.istfa2000p0117

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Near IR Absorption in Heavily Doped Silicon – An Empirical Approach

R. Aaron Falk

ISTFA 2000; 121-123https://doi.org/10.31399/asm.cp.istfa2000p0121

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Embedded SRAM Bitmapping and Failure Analysis for Manufacturing Yield Improvement

Jean-Yves Glacet; Fourmun Lee

ISTFA 2000; 129-135https://doi.org/10.31399/asm.cp.istfa2000p0129

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LSI Process Diagnosis for High Reliability Usage

Miki Imai; Daiki Tanaka; Katsuhiko Hosoda; Katsuhumi Noda; Sumio Matsuda

ISTFA 2000; 137-140https://doi.org/10.31399/asm.cp.istfa2000p0137

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Application of KOH Electrochemical Etch and Passive Voltage Contrast Techniques for Deep Sub-Micron CMOS Leaky Gate Detection

Fred Y. Chang; Victer Chan

ISTFA 2000; 141-146https://doi.org/10.31399/asm.cp.istfa2000p0141

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UV Reflectance Spectroscopy of the Copper/Copper Oxide System for Assessment of Solderability

L. S. Forney; C. Thierolf; B. Toleno; G. Parks

ISTFA 2000; 147-151https://doi.org/10.31399/asm.cp.istfa2000p0147

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Backside

Antireflection Coatings for Semiconductor Failure Analysis

Brennan Davis; Wilson Chi

ISTFA 2000; 155-160https://doi.org/10.31399/asm.cp.istfa2000p0155

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Comparative Study of Sample Preparation Techniques for Backside Analysis

Philippe Perdu; Romain Desplats; Felix Beaudoin

ISTFA 2000; 161-171https://doi.org/10.31399/asm.cp.istfa2000p0161

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A Comparison of Backside Emission Microscopy Systems

Brennan V. Davis

ISTFA 2000; 173-176https://doi.org/10.31399/asm.cp.istfa2000p0173

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Failure Analysis from the Backside of a Die

Silke Liebert

ISTFA 2000; 177-185https://doi.org/10.31399/asm.cp.istfa2000p0177

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Transparent Heat Spreader for Backside Optical Analysis of High Power GHz-Scale Microprocessors

Travis M. Eiles; Dean Hunt; David Chi

ISTFA 2000; 547-551https://doi.org/10.31399/asm.cp.istfa2000p0547

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New Laser Ablation Method for Non-Destructive Backside Sample Preparation

F. Beaudoin; P. Perdu; F. Saviot; D. Lewis; F. Salin

ISTFA 2000; 553-558https://doi.org/10.31399/asm.cp.istfa2000p0553

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Silicon Trenching Using Dry Etch Process for Backside FIB and Probing

Valentina Korchnoi; Amos Fenigstein; Anastasia Barger

ISTFA 2000; 559-565https://doi.org/10.31399/asm.cp.istfa2000p0559

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Application of Near IR, Phase-Contrast Imaging to Backside Failure Isolation and Analysis

R. Aaron Falk; Edward W. Budiarto

ISTFA 2000; 567-573https://doi.org/10.31399/asm.cp.istfa2000p0567

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EOS/ESD

ESD Effects on Electromigration Performance of Aluminum Metallization Systems

J. E. Vinson; M. J. Dion

ISTFA 2000; 189-194https://doi.org/10.31399/asm.cp.istfa2000p0189

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Evaluation of On-Chip ESD Supply Clamp Robustness by In-Situ Floating Power Bus Monitoring

Michael Fliesler; Ian H. Morgan

ISTFA 2000; 195-201https://doi.org/10.31399/asm.cp.istfa2000p0195

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Transmission Line Pulse Testing of the ESD Protection Structures in ICs – A Failure Analyst’s Perspective

Leo G. Henry; Jon Barth; John Richner; Koen Verhaege

ISTFA 2000; 203-213https://doi.org/10.31399/asm.cp.istfa2000p0203

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Failure Analysis of CDM-ESD Damage in a GaAs RFIC

Amy Poe; Steve Brockett; Tony Rubalcava

ISTFA 2000; 215-221https://doi.org/10.31399/asm.cp.istfa2000p0215

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Techniques

A Focused Ion Beam Technique to Electrically Contact the Deep Trench Capacitor of a Single Active Memory Cell in the Sub 0.25µm Technology Regime

Gunnar Zimmermann; Mark Johnston; Rolf Christ

ISTFA 2000; 225-230https://doi.org/10.31399/asm.cp.istfa2000p0225

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The Use of TMAH to Etch Silicon and Expose Metal Bridging Failures

Mark Morris; James Mohr; Esteban Ortiz; Steven Englebretson

ISTFA 2000; 231-234https://doi.org/10.31399/asm.cp.istfa2000p0231

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Selective Au Etching in Au/Al Bonds in Current IC Technology

M. Vanzi; A. Serpe; E.F. Trogu; P. Deplano; C. Hartfield; W. Subido

ISTFA 2000; 235-239https://doi.org/10.31399/asm.cp.istfa2000p0235

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A Novel Method to Analyze the Deep Trench Capacitors in DRAM

Jack Lee; Kuo-Hui Huang; Jen-Lang Lue

ISTFA 2000; 241-244https://doi.org/10.31399/asm.cp.istfa2000p0241

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Planar TEM Analysis of Nanoindented Samples Using the Focused Ion Beam Lift-Out Technique

T. L. Shofner; S. R. Brown; B.B. Rossie; M. A. Decker; Y. S. Obeng; F. A. Stevie; J.L. Drown

ISTFA 2000; 459-461https://doi.org/10.31399/asm.cp.istfa2000p0459

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Computerized Quantification of the Dicing Process: The First Step Toward Related Die Cracking Failure Analysis

Doug Glover; John R. Lynch; Irvin Huseby

ISTFA 2000; 463-467https://doi.org/10.31399/asm.cp.istfa2000p0463

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Automatic IC Die Positioning in the SEM

H.W. Tan; J.C.H Phang; J.T.L Thong

ISTFA 2000; 469-477https://doi.org/10.31399/asm.cp.istfa2000p0469

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Integrated Circuit Waveform Probing Using Optical Phase Shift Detection

Ken Wilsher; William Lo; Travis M. Eiles; Guoqing Xiao

ISTFA 2000; 479-485https://doi.org/10.31399/asm.cp.istfa2000p0479

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Case Histories

Identification and Analysis of Parasitic Depletion Mode Leakage in a Memory Select Transistor

Jim B. Colvin; Anirban Roy

ISTFA 2000; 247-249https://doi.org/10.31399/asm.cp.istfa2000p0247

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Thermal Fatigue Induced Voiding in LDMOS Transistors Submitted to Multiple Energy Discharges

I. Percheron-Garcon; J.M. Bosc; C. Levade; M. Cabié; G. Vanderschaeve

ISTFA 2000; 255-262https://doi.org/10.31399/asm.cp.istfa2000p0255

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Humidity-Bias Driven Shorts in Multilayer Circuits: A Case Study in Failure Analysis

Hei-Ruey Harry Jen; Gerald S. D’Urso; Harold Andrews

ISTFA 2000; 263-266https://doi.org/10.31399/asm.cp.istfa2000p0263

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Passivation Cracks in a Four-Level Metal Low-K Dielectric Backend Process

Michael C. Olewine; John F. DiGregorio; Gus J. Colovos; Kevin F. Saiz; Hongjiang Sun

ISTFA 2000; 267-277https://doi.org/10.31399/asm.cp.istfa2000p0267

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Combining FIB Sequential Cross-Sectioning with TEM for Small Defect Analysis in SRAM Array

Nathan Wang; Rei Fang

ISTFA 2000; 309-313https://doi.org/10.31399/asm.cp.istfa2000p0309

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Failure Analysis of Tungsten Stud Defect from the CMP Process

K. Takagi; Y. Kohno; S. Nukii

ISTFA 2000; 315-321https://doi.org/10.31399/asm.cp.istfa2000p0315

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Integrated Circuit SNR Improvement Using Dielectric Altering Compound, Laser Trim and FIB System

B.J. Dutt; J.J. Kroutch, Jr.; K.N. Hooghan; R.J. Jenkins; M.J. Toth

ISTFA 2000; 323-326https://doi.org/10.31399/asm.cp.istfa2000p0323

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Characterization and Isolation Techniques in Silicon on Insulator Technology Microprocessor Designs

T. Kane; M. Cambra; M. Tenney; P. McGinnis; A. Domenicucci; Y. Wang; D. Falcon

ISTFA 2000; 327-330https://doi.org/10.31399/asm.cp.istfa2000p0327

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Failure Analysis and Elimination of Galvanic Corrosion on Bondpads During Wafer Sawing

Y. N. Hua; E. C. Low; L. H. An; Shailesh Redkar

ISTFA 2000; 369-372https://doi.org/10.31399/asm.cp.istfa2000p0369

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High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities

Carl B. Bunis

ISTFA 2000; 373-376https://doi.org/10.31399/asm.cp.istfa2000p0373

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Semiconductor Wear Out at Nuclear Power Plants

James B. Riddle

ISTFA 2000; 377-383https://doi.org/10.31399/asm.cp.istfa2000p0377

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UTC Clinic Hospital Network: Description of International Network of Failure Analysis Labs and Case Studies

Timothy C. Wilkins

ISTFA 2000; 385-389https://doi.org/10.31399/asm.cp.istfa2000p0385

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Failure Analysis of MEMS Using Thermally-Induced Voltage Alteration

Jeremy A. Walraven; Edward I. Cole, Jr.; Paiboon Tangyunyong

ISTFA 2000; 489-496https://doi.org/10.31399/asm.cp.istfa2000p0489

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Application of TIVA in Design Debug

Siva Kolachina; Bill Taylor; Kendall Scott Wills; Edward I. Cole, Jr.

ISTFA 2000; 497-501https://doi.org/10.31399/asm.cp.istfa2000p0497

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Backside Fault Isolation Using a Magnetic Field Imaging System on SRAMs with Indirect Shorts

L. A. Knauss; B. M. Frazier; A. B. Cawthorne; E. Budiarto; R. Crandall; S. Melnik; C. Bennett

ISTFA 2000; 503-507https://doi.org/10.31399/asm.cp.istfa2000p0503

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FIB

Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB/Dual Beam Inline Application

R. Weiland; C. Boit; B. Ebersberger; P. Meis; N. Dawes; A. Dziesiaty; H. Zimmermann; E. Demm; A. Hirsch; L. Frey; C. Lehrer; S. Geyer; M. Kamolz; H. Rettenmaier; W. Tittes; H. Lezec; R. Treichler

ISTFA 2000; 393-396https://doi.org/10.31399/asm.cp.istfa2000p0393

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Focused Ion Beam Analysis of Low-K Dielectrics

H. J. Bender; R. A. Donaton

ISTFA 2000; 397-405https://doi.org/10.31399/asm.cp.istfa2000p0397

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Automatic Determination of Optimal FIB Operations for Improved Circuit Probing and Fast Reconfiguration

Romain Desplats; Timothee Dargnies; Jean-Christophe Courrege; Philippe Perdu; Jean-Louis Noullet

ISTFA 2000; 407-414https://doi.org/10.31399/asm.cp.istfa2000p0407

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Specific Area Planar and Cross-Sectional Lift-Out Techniques: Procedures and Novel Applications

Raghaw S. Rai; Swaminathan Subramanian; Stewart Rose; James Conner; Phil Schani; Jamey Moss

ISTFA 2000; 415-421https://doi.org/10.31399/asm.cp.istfa2000p0415

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Discretes

EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes

Alexander Teverovsky

ISTFA 2000; 425-434https://doi.org/10.31399/asm.cp.istfa2000p0425

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Temperature Distributions in III-V and SiC Micro-Wave Power Transistors Using Spatially Resolved Photoluminescence and Raman-Spectrometry Mapping Respectively

P. Martin; R. Bisaro; C. Dua; O. Noblanc; S. L. Delage; D. Floriot; F. Lemaire; P. Galtier; J. P. Landesman; C. Brylinski

ISTFA 2000; 435-442https://doi.org/10.31399/asm.cp.istfa2000p0435

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Failure Analysis of a Transistor Lead

Yasushi Deguchi; Sumio Matsuda; Jiro Aoki; Takashi Tamura; Yasunobu Iwai; Shigeki Kikui

ISTFA 2000; 443-448https://doi.org/10.31399/asm.cp.istfa2000p0443

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Liquid Metal Embrittlement of Copper Wires

L. E. Brown

ISTFA 2000; 449-455https://doi.org/10.31399/asm.cp.istfa2000p0449

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Scanning Probe Microscopy

Local Electrical Thickness-Mapping of Thin Oxides with Conducting Atomic Force Microscopy

Alexander Olbrich; Bernd Ebersberger; Christian Boit

ISTFA 2000; 511-519https://doi.org/10.31399/asm.cp.istfa2000p0511

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Guidelines for Two-Dimensional Dopant Profiling Using Scanning Capacitance Microscopy

Axel Born; R. Wiesendanger

ISTFA 2000; 521-527https://doi.org/10.31399/asm.cp.istfa2000p0521

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pn Junction Delineation in Si Devices Using Scanning Capacitance Spectroscopy

Hal Edwards

ISTFA 2000; 529-532https://doi.org/10.31399/asm.cp.istfa2000p0529

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Contactless Voltage and Current Contrast Imaging with Scanning Force Microscope Based Test Systems

W. Mertin; S.-W. Bae; U. Behnke; R. Weber; E. Kubalek

ISTFA 2000; 533-543https://doi.org/10.31399/asm.cp.istfa2000p0533

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Volume Information

Credits

ISTFA 2000; iv-viiihttps://doi.org/10.31399/asm.cp.istfa2000fm01

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Preface

ISTFA 2000; xiiihttps://doi.org/10.31399/asm.cp.istfa2000fm02

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