Skip to Main Content

Close

ASM International Home
Handbooks Online
Databases
Magazines
Conference-Proceedings
Books
- ASM Books Home
- Technical Books
Journals
About
- About the Digital Library
- Contact

header search

search input Search input auto suggest

filter your search

Search

Advanced Search

Search ASM

Menu

Latest Proceedings
All Years
Explore Subjects
About

Skip Nav Destination

Proceedings Papers

Select Year

Select Volume

Proceedings Volume Cover

ISTFA 1999

November 14–18, 1999

Santa Clara, California, USA

Conference Sponsors:

Electronic Device Failure Analysis Society
ASM International

ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis

Issue navigation

Advanced Techniques
Poster Session: Advanced Techniques and Backside Analysis
Poster Session: FIB and Case Histories
Discretes
Software Tools
Discretes
Techniques
FIB
Case Histories
FIB
Case Histories
Techniques
Backside Analysis
Volume Information

ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis

Advanced Techniques

Terahertz Imaging: A New Technique for Inspection of Dielectric Materials

Daniel M. Mittleman

ISTFA 1999; 3-9https://doi.org/10.31399/asm.cp.istfa1999p0003

View Articletitled, Terahertz Imaging: A New Technique for Inspection of Dielectric Materials

Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy

L. A. Knauss; B. M. Frazier; H. M. Christen; S. D. Silliman; K. S. Harshavardhan; E. F. Fleet; F. C. Wellstood; M. Mahanpour; A. Ghaemmaghami

ISTFA 1999; 11-16https://doi.org/10.31399/asm.cp.istfa1999p0011

View Articletitled, Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy

Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing

Mike Bruce; Greg Dabney; Shawn McBride; Jason Mulig; Victoria Bruce; Charles Bachand; Steven Kasapi; Jeffrey A. Block

ISTFA 1999; 19-25https://doi.org/10.31399/asm.cp.istfa1999p0019

View Articletitled, Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing

Optical Probing of VLSI ICs from the Silicon Backside

Travis M. Eiles; Gary L. Woods; Valluri Rao

ISTFA 1999; 27-33https://doi.org/10.31399/asm.cp.istfa1999p0027

View Articletitled, Optical Probing of VLSI ICs from the Silicon Backside

Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache

Moyra McManus; Pia Sanda; Steven Steen; Dan Knebel; Dennis Manzer; Stas Polonsky; Bill Huott; Steve Wilson; Tony Pelella; Yuen Chan

ISTFA 1999; 35-38https://doi.org/10.31399/asm.cp.istfa1999p0035

View Articletitled, Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache

Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits

Kenneth Krieg; Richard Qi; Douglas Thomson; Greg Bridges

ISTFA 1999; 39-45https://doi.org/10.31399/asm.cp.istfa1999p0039

View Articletitled, Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits

Comparative TDR Analysis as a Packaging FA Tool

Charles Odegard; Craig Lambert

ISTFA 1999; 49-55https://doi.org/10.31399/asm.cp.istfa1999p0049

View Articletitled, Comparative TDR Analysis as a Packaging FA Tool

Light Emission Spectral Analysis: The Connection Between the Electric Field and the Spectrum

Daniel L. Barton; Paiboon Tangyunyong; Jerry M. Soden; Christopher L. Henderson; Edward I. Cole, Jr.; Rainer Danz; Reinhard Steiner; Zbigniew Iwinski

ISTFA 1999; 57-67https://doi.org/10.31399/asm.cp.istfa1999p0057

View Articletitled, Light Emission Spectral Analysis: The Connection Between the Electric Field and the Spectrum

Temperature Profile Measurement and Failure Characterization of ESD Protection Devices Using Spectroscopic Photon Emission Microscopy and Raman Spectroscopy

Mahmoud Rasras; Ingrid De Wolf; Guido Groeseneken; Jian Chen; Karlheinz Bock; Herman E. Maes

ISTFA 1999; 69-76https://doi.org/10.31399/asm.cp.istfa1999p0069

View Articletitled, Temperature Profile Measurement and Failure Characterization of ESD Protection Devices Using Spectroscopic Photon Emission Microscopy and Raman Spectroscopy

Infrared Emission Spectroscopy as a Reliability Tool

Q. Kim; S. Kayali

ISTFA 1999; 77-83https://doi.org/10.31399/asm.cp.istfa1999p0077

View Articletitled, Infrared Emission Spectroscopy as a Reliability Tool

Poster Session: Advanced Techniques and Backside Analysis

Quantitative E-beam Probe for Valid High-Speed Measurements

C. T. Salling

ISTFA 1999; 87-96https://doi.org/10.31399/asm.cp.istfa1999p0087

View Articletitled, Quantitative E-beam Probe for Valid High-Speed Measurements

Short High Voltage Stress for Design-to-Process Characterization

Boris Lisenker; Dmitry Veinger; Yuri Mitnick

ISTFA 1999; 97-102https://doi.org/10.31399/asm.cp.istfa1999p0097

View Articletitled, Short High Voltage Stress for Design-to-Process Characterization

Automatic TEM Sample Preparation

Wayne D. Kaplan; Kim Kisslinger; Ron Oviedo; Efrat M. Raz; Colin Smith

ISTFA 1999; 103-107https://doi.org/10.31399/asm.cp.istfa1999p0103

View Articletitled, Automatic TEM Sample Preparation

Failure Analysis of Sub-Micron Semiconductor Integrated Circuit Using Backside Photon Emission Microscopy

Soon Lim; Jian Hua Bi; Lian Choo Goh; Soh Ping Neo; Sudhindra Tatti

ISTFA 1999; 109-116https://doi.org/10.31399/asm.cp.istfa1999p0109

View Articletitled, Failure Analysis of Sub-Micron Semiconductor Integrated Circuit Using Backside Photon Emission Microscopy

Sample Preparation for Backside Failure Analysis Using Infrared Photoemission Microscopy

Alastair Trigg; Peak Yong Loh

ISTFA 1999; 117-124https://doi.org/10.31399/asm.cp.istfa1999p0117

View Articletitled, Sample Preparation for Backside Failure Analysis Using Infrared Photoemission Microscopy

Poster Session: FIB and Case Histories

In-Situ Use of an Optical Microscope for FIB Microsurgery of Planarized Devices

Patrick J. Wolpert; Raymond A. Lee

ISTFA 1999; 127-133https://doi.org/10.31399/asm.cp.istfa1999p0127

View Articletitled, In-Situ Use of an Optical Microscope for FIB Microsurgery of Planarized Devices

Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System due to a low I₂ Background

H. J. Bender; S. Jin; I. Vervoort; Y. Lantasov

ISTFA 1999; 135-140https://doi.org/10.31399/asm.cp.istfa1999p0135

View Articletitled, Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System due to a low I<sub>2</sub> Background

Tin Corrosion Induced by Corrosive De-Ionized (DI) Water

Shekhar Khandekar; Lakshmi Vedula; Vinod Malshe

ISTFA 1999; 141-143https://doi.org/10.31399/asm.cp.istfa1999p0141

View Articletitled, Tin Corrosion Induced by Corrosive De-Ionized (DI) Water

Latch-Up Induced Slit Voiding in Aluminum Metal Lines

Chunyu Zhang; Lakshmi Vedula; Shekhar Khandekar

ISTFA 1999; 145-148https://doi.org/10.31399/asm.cp.istfa1999p0145

View Articletitled, Latch-Up Induced Slit Voiding in Aluminum Metal Lines

Failure Analysis of Discolored Bondpads in Wafer Fabrication

Younan N. Hua

ISTFA 1999; 149-159https://doi.org/10.31399/asm.cp.istfa1999p0149

View Articletitled, Failure Analysis of Discolored Bondpads in Wafer Fabrication

Optimizing Contact Resistance at a Resistor/Conductor Interface via Thin Film Microanalysis and Process Design of Experiments

J.H. Linn; T.K. Thompson; M.G. Shlepr

ISTFA 1999; 161-169https://doi.org/10.31399/asm.cp.istfa1999p0161

View Articletitled, Optimizing Contact Resistance at a Resistor/Conductor Interface via Thin Film Microanalysis and Process Design of Experiments

Discretes

Failure Analysis of Plastic Packaged GaAs and AlGaAs/GaAs LEDs

Patricia F. Mead; Melody Burch; Patrick McCluskey; F. G. Johnson

ISTFA 1999; 173-181https://doi.org/10.31399/asm.cp.istfa1999p0173

View Articletitled, Failure Analysis of Plastic Packaged GaAs and AlGaAs/GaAs LEDs

A Technique for Measuring Device Temperature with High Accuracy in Accelerated Operational Life Tests

K. Takeda; M. Harigaya; Y. Miyazaki

ISTFA 1999; 183-188https://doi.org/10.31399/asm.cp.istfa1999p0183

View Articletitled, A Technique for Measuring Device Temperature with High Accuracy in Accelerated Operational Life Tests

Temperature Measurement on Micromachined IR Bolometers Using an Infrared Microscope

A.D. Trigg; U. Sridhar; H.S. Lee; G. Karunasiri

ISTFA 1999; 189-193https://doi.org/10.31399/asm.cp.istfa1999p0189

View Articletitled, Temperature Measurement on Micromachined IR Bolometers Using an Infrared Microscope

Selective Au-Etching on Aged GaAs-Based Devices

M. Vanzi; A. Bonfiglio; P. Salaris; P. Deplano; E.F. Trogu; A. Serpe; G. Salmini; R. De Palo

ISTFA 1999; 211-215https://doi.org/10.31399/asm.cp.istfa1999p0211

View Articletitled, Selective Au-Etching on Aged GaAs-Based Devices

Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination

Scott M. Hull

ISTFA 1999; 217-223https://doi.org/10.31399/asm.cp.istfa1999p0217

View Articletitled, Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination

Evacuated FM08 Fuses Carry a Sustained Arc in a Bus over 75 VDC

H. Leidecker; J. Slonaker

ISTFA 1999; 225-229https://doi.org/10.31399/asm.cp.istfa1999p0225

View Articletitled, Evacuated FM08 Fuses Carry a Sustained Arc in a Bus over 75 VDC

Software Tools

Automated Translation of Final Test Programs to Inexpensive FA Testers

Dan J. Bodoh

ISTFA 1999; 197-201https://doi.org/10.31399/asm.cp.istfa1999p0197

View Articletitled, Automated Translation of Final Test Programs to Inexpensive FA Testers

FMECA Modeling - A New Approach

Yizhak Bot

ISTFA 1999; 203-207https://doi.org/10.31399/asm.cp.istfa1999p0203

View Articletitled, FMECA Modeling - A New Approach

Techniques

Advanced Statistical Tools for Improving Yield and Reliability

Richard C. Kittler

ISTFA 1999; 233-238https://doi.org/10.31399/asm.cp.istfa1999p0233

View Articletitled, Advanced Statistical Tools for Improving Yield and Reliability

An Application of Passive Voltage Contrast (PVC) to Failure Analysis of CMOS LSIs Using Secondary Electron Collection

Akira Nishikawa; Naoko I. Kato; Yoshiteru Kohno; Nobuhito Miura; Masao Shimizu

ISTFA 1999; 239-244https://doi.org/10.31399/asm.cp.istfa1999p0239

View Articletitled, An Application of Passive Voltage Contrast (PVC) to Failure Analysis of CMOS LSIs Using Secondary Electron Collection

From I_DDQ Fault Detection to Defect Localization in Logic CMOS Integrated Circuits: Key Issues

Philippe Perdu; Romain Desplats

ISTFA 1999; 427-438https://doi.org/10.31399/asm.cp.istfa1999p0427

View Articletitled, From I<sub>DDQ</sub> Fault Detection to Defect Localization in Logic CMOS Integrated Circuits: Key Issues

Recent Advances in Broad Ion Beam Based Techniques/Instrumentation for SEM Specimen Preparation of Semiconductors

R. Alani; R. J. Mitro; W. Hauffe

ISTFA 1999; 439-448https://doi.org/10.31399/asm.cp.istfa1999p0439

View Articletitled, Recent Advances in Broad Ion Beam Based Techniques/Instrumentation for SEM Specimen Preparation of Semiconductors

A New Focused Ion Beam Microsampling Technique for TEM Observation of Site-Specific Areas

T. Ohnishi; H. Koike; T. Ishitani; S. Tomimatsu; K. Umemura; T. Kamino

ISTFA 1999; 449-453https://doi.org/10.31399/asm.cp.istfa1999p0449

View Articletitled, A New Focused Ion Beam Microsampling Technique for TEM Observation of Site-Specific Areas

FIB

Integrated Circuit Device Repair Using FIB System: Tips, Tricks, and Strategies

K. N. Hooghan; K. S. Wills; P.A. Rodriguez; S.J. O’Connell

ISTFA 1999; 247-254https://doi.org/10.31399/asm.cp.istfa1999p0247

View Articletitled, Integrated Circuit Device Repair Using FIB System: Tips, Tricks, and Strategies

Modeling and Optimizing XeF₂-enhanced FIB Milling of Silicon

Neil J. Bassom; Tung Mai

ISTFA 1999; 255-261https://doi.org/10.31399/asm.cp.istfa1999p0255

View Articletitled, Modeling and Optimizing XeF<sub>2</sub>-enhanced FIB Milling of Silicon

Reliability Test Results for Pt FIB Interconnect Structures

Michael Zaragoza

ISTFA 1999; 263-272https://doi.org/10.31399/asm.cp.istfa1999p0263

View Articletitled, Reliability Test Results for Pt FIB Interconnect Structures

Focused Ion Beam Induced Effects on MOS Transistor Parameters

Ann N. Campbell; Paiboon Tangyunyong; Jeffrey R. Jessing; Charles E. Hembree; Daniel M. Fleetwood; Scot E. Swanson; Jerry M. Soden; Nicholas Antoniou; William E. Vanderlinde; Marsha T. Abramo

ISTFA 1999; 273-281https://doi.org/10.31399/asm.cp.istfa1999p0273

View Articletitled, Focused Ion Beam Induced Effects on MOS Transistor Parameters

In-Situ Dual Beam (FIBSEM) Techniques for Probe Pad Deposition and Dielectric Integrity Inspection in 0.2 μm Technology DRAM Single Cells

Gunnar Zimmermann; Richard Chapman

ISTFA 1999; 311-316https://doi.org/10.31399/asm.cp.istfa1999p0311

View Articletitled, In-Situ Dual Beam (FIBSEM) Techniques for Probe Pad Deposition and Dielectric Integrity Inspection in 0.2 μm Technology DRAM Single Cells

Die Backside FIB Preparation for Identification and Characterization of Metal Voids

Ann N. Campbell; William F. Filter; Nicholas Antoniou

ISTFA 1999; 317-325https://doi.org/10.31399/asm.cp.istfa1999p0317

View Articletitled, Die Backside FIB Preparation for Identification and Characterization of Metal Voids

FIB Micromachining and Nano-Structure Fabrication

Raymond A. Lee; Patrick J. Wolpert

ISTFA 1999; 327-331https://doi.org/10.31399/asm.cp.istfa1999p0327

View Articletitled, FIB Micromachining and Nano-Structure Fabrication

Case Histories

Relay Failures Specific to Space Applications

Alexander Teverovsky

ISTFA 1999; 285-292https://doi.org/10.31399/asm.cp.istfa1999p0285

View Articletitled, Relay Failures Specific to Space Applications

Failure Analysis of Autoclave-Stressed SRAMs with Aluminum Fuses

Jamey Moss; Sam Subramanian; Vince Soorholtz; Michael Thomas; Mark Gerber; C. M. Chan

ISTFA 1999; 293-296https://doi.org/10.31399/asm.cp.istfa1999p0293

View Articletitled, Failure Analysis of Autoclave-Stressed SRAMs with Aluminum Fuses

Electrostatic Discharge (ESD) Failures in Thin Film Resistors

Scott M. Hull

ISTFA 1999; 297-304https://doi.org/10.31399/asm.cp.istfa1999p0297

View Articletitled, Electrostatic Discharge (ESD) Failures in Thin Film Resistors

Characterization of Gold Embrittlement in Solder Joints

Carl B. Bunis

ISTFA 1999; 305-308https://doi.org/10.31399/asm.cp.istfa1999p0305

View Articletitled, Characterization of Gold Embrittlement in Solder Joints

Characterization and Fault Identification of Copper BEOL sub-0.25μm Six Level Metal Microprocessor Designs

T. L. Kane; K. L. DeVries; M. T. Tenney; A. K. Patel

ISTFA 1999; 335-341https://doi.org/10.31399/asm.cp.istfa1999p0335

View Articletitled, Characterization and Fault Identification of Copper BEOL sub-0.25μm Six Level Metal Microprocessor Designs

Analysis of Ohmic Contact Metal Deposition Defect Using FIB/SEM for a GaAs MESFET Clock Buffer IC Device

Pei Y. Tsai; William Bornstein

ISTFA 1999; 343-348https://doi.org/10.31399/asm.cp.istfa1999p0343

View Articletitled, Analysis of Ohmic Contact Metal Deposition Defect Using FIB/SEM for a GaAs MESFET Clock Buffer IC Device

Identification of Subtle Isb Failure Mechanisms

N. Wang; R. Zou; J. Wu; S. Daniel; W. Stevenson

ISTFA 1999; 349-355https://doi.org/10.31399/asm.cp.istfa1999p0349

View Articletitled, Identification of Subtle Isb Failure Mechanisms

Investigation of High Frequency Failures on a 0.35μm CMOS IC

Alan Kennen; John F. Guravage; Lauren Foster; John Kornblum

ISTFA 1999; 359-364https://doi.org/10.31399/asm.cp.istfa1999p0359

View Articletitled, Investigation of High Frequency Failures on a 0.35μm CMOS IC

BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy

Jim B. Colvin

ISTFA 1999; 365-375https://doi.org/10.31399/asm.cp.istfa1999p0365

View Articletitled, BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy

Current-Signature-Based Analysis of Complex Test Fails

Anne E. Gattiker; Phil Nigh; Wojciech Maly

ISTFA 1999; 377-387https://doi.org/10.31399/asm.cp.istfa1999p0377

View Articletitled, Current-Signature-Based Analysis of Complex Test Fails

New Techniques for Logic Fault Diagnosis with a Case Study on the 440BX Chipset

Srikanth Venkataraman; Scott B. Drummonds

ISTFA 1999; 389-396https://doi.org/10.31399/asm.cp.istfa1999p0389

View Articletitled, New Techniques for Logic Fault Diagnosis with a Case Study on the 440BX Chipset

Electromigration and Electrochemical Reaction Mixed Failure Mechanism in Gold Interconnection System

Hide Murayama; Makoto Yamazaki; Shigeru Nakajima

ISTFA 1999; 399-404https://doi.org/10.31399/asm.cp.istfa1999p0399

View Articletitled, Electromigration and Electrochemical Reaction Mixed Failure Mechanism in Gold Interconnection System

Identification of Yield Limiting Defects in a 0.5 Micron, Shallow Trench Isolation Technology

Christopher L. Henderson; Charles E. Hembree; Jerry M. Soden; Thomas J. Headley; Bruce L. Draper

ISTFA 1999; 405-412https://doi.org/10.31399/asm.cp.istfa1999p0405

View Articletitled, Identification of Yield Limiting Defects in a 0.5 Micron, Shallow Trench Isolation Technology

Visualization of Local Gate Depletion in PMOSFETs Using Unique Backside Etching and Selective Etching Technique

Akio Nishida; Tomoko Sekiguchi; Toshiaki Yamanaka; Renichi Yamada; Kuniyasu Nakamura; Satoshi Tomimatsu; K. Umemura; Hiroshi Kakibayashi; Yasuko Yoshida; Kohta Funayama; Shuji Ikeda

ISTFA 1999; 413-418https://doi.org/10.31399/asm.cp.istfa1999p0413

View Articletitled, Visualization of Local Gate Depletion in PMOSFETs Using Unique Backside Etching and Selective Etching Technique

Residual Photoresist Identified as Cause for Frequency-Dependent Signal-to-Noise Failure After Autoclave Stress Testing

Martin J. McVeigh

ISTFA 1999; 419-424https://doi.org/10.31399/asm.cp.istfa1999p0419

View Articletitled, Residual Photoresist Identified as Cause for Frequency-Dependent Signal-to-Noise Failure After Autoclave Stress Testing

Backside Analysis

A Combined Infrared/Visible Photoemission Microscope

A.D. Trigg

ISTFA 1999; 457-464https://doi.org/10.31399/asm.cp.istfa1999p0457

View Articletitled, A Combined Infrared/Visible Photoemission Microscope

Correlation of Electronic and Thermal Properties of Short Channel nMOSFETS

M. Palaniappan; V. Ng; R. Heiderhoff; J.C.H. Phang; G.B.M. Fiege; L.J. Balk

ISTFA 1999; 465-470https://doi.org/10.31399/asm.cp.istfa1999p0465

View Articletitled, Correlation of Electronic and Thermal Properties of Short Channel nMOSFETS

Application of the Infrared Microscope (IREM1) for Flip-Chip (C4) Failure Analysis

A. N. Zaplatin; F. J. Low; Steve Seidel; Valluri R. Rao; T. H. Loh

ISTFA 1999; 471-476https://doi.org/10.31399/asm.cp.istfa1999p0471

View Articletitled, Application of the Infrared Microscope (IREM1) for Flip-Chip (C4) Failure Analysis

Advanced Micro-Surgery Techniques and Material Parasitics for Debug of Flip-Chip Microprocessor

Rick H. Livengood; Paul Winer; John A. Giacobbe; Jason Stinson; John D. Finnegan

ISTFA 1999; 477-483https://doi.org/10.31399/asm.cp.istfa1999p0477

View Articletitled, Advanced Micro-Surgery Techniques and Material Parasitics for Debug of Flip-Chip Microprocessor

Volume Information

Credits

ISTFA 1999; iv-vihttps://doi.org/10.31399/asm.cp.istfa1999fm01

View Articletitled, Credits

Preface

ISTFA 1999; xihttps://doi.org/10.31399/asm.cp.istfa1999fm02

View Articletitled, Preface

About This Journal
Policies
Facebook
Twitter

ASM International Home
Databases
ASM Alloy Center Database
ASM Alloy Phase Diagram Database
ASM Failure Analysis Database
ASM Handbooks Online
ASM Heat Treater's Guide Online
ASM Medical Materials Database
ASM Micrograph Database
Pearson's Crystal Data
ASM Materials Platform for Data Science

Magazines
AM&P Technical Articles
EDFA Technical Articles
Newsletters
Books
ASM Books Home
Technical Books
Proceedings
ISTFA Proceedings
Thermal Spray Proceedings
Heat Treating Proceedings
Shape Memory Proceedings
About
About the Digital Library
Contact us

Journals
Alloy Digest
International Materials Reviews
Journal of Failure Analysis & Prevention
Journal of Materials Engineering & Performance
Journal of Phase Equilibria & Diffusion
Journal of Thermal Spray Technology
Metallography, Microstructure & Analysis
Metallurgical & Materials Transactions A
Metallurgical & Materials Transactions B
Shape Memory and Superelasticity

ASM International
9639 Kinsman Road
Materials Park, OH 44073-0002

Telephone: +440.338.5151
Email: memberservicecenter@asminternational.org

Twitter
LinkedIn

Terms & Conditions
©Copyright 2023 ASM International

This Feature Is Available To Subscribers Only

Sign In or Create an Account

This site uses cookies. By continuing to use our website, you are agreeing to our privacy policy.

Accept