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Proceedings Papers

Proceedings Volume Cover
ISTFA 1997
October 27–31, 1997
Santa Clara, California, USA
Conference Sponsors:
  • Electronic Device Failure Analysis Society
  • ASM International
ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis

Keynote Presentation

Testing and Signature Analysis

Techniques

Poster Session

Micro-Electrical-Mechanical Systems (MEMS)

Discretes

Packaging/E-Beam

FIB/E-Beam

Case Histories

Volume Information

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