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Proceedings Papers
ISTFA 1997
October 27–31, 1997
Santa Clara, California, USA
Conference Sponsors:
- Electronic Device Failure Analysis Society
- ASM International
ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis
Keynote Presentation
Testing and Signature Analysis
Techniques
Poster Session
Micro-Electrical-Mechanical Systems (MEMS)
Discretes
Packaging/E-Beam
FIB/E-Beam
Case Histories
Volume Information
Credits
ISTFA 1997; iv-viiihttps://doi.org/10.31399/asm.cp.istfa1997fm01