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Proceedings Papers
ISTFA 1996
November 18–22, 1996
Los Angeles, California, USA
Conference Sponsors:
- Electronic Device Failure Analysis Society
- ASM International
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ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis
Advanced Techniques
Case Histories
Techniques
FIB and E-Beam Techniques
Software Tools for Failure Analysis
Signature Analysis
TEM
Discretes
Testing
Contactless Function Test of Integrated Circuits on the Wafer
H.H. Berger; J. Sturm; F. Esfahani; A. Benedix; K-O. Hofacker; D. McClymont; D. Bartelt; M. Pohland; H. Bergner; K. Hempel; G. Sargsjan; J. Degenhardt; C. Dietrich; D. Runge; C. Swiatkowski
ISTFA 1996; 263-266https://doi.org/10.31399/asm.cp.istfa1996p0263