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void-free structures

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Published: 01 August 2018
of adhesive. (b) Method 4 uses two chamfered aluminum sheets of different thicknesses with drilled holes 9.5 or 13 mm ( 3 8 or 1 2 in.) in diameter (free of adhesive) and edge voids made by inserting Teflon shims of the size shown. Shims must be removed after bonding. This standard can More
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0009077
EISBN: 978-1-62708-177-1
... composite cross section having prepreg ply terminations within the part is shown in Fig. 1 . In this figure, the number of prepreg plies and ply terminations can easily be observed, as well as how the adjacent plies accommodate the ply-drops. Where both ply terminations are found, the area is free of voids...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006457
EISBN: 978-1-62708-190-0
... the heat-up rate. Thick glue lines occur in a bonded assembly due to inadequate mating of the facing sheets or blocked fixing rivets, and they result mostly in porosity and voids. However, a thick glue line made with added layers of adhesive is usually free of porosity. Porosity has a significant...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005458
EISBN: 978-1-62708-196-2
... wetting and essentially defect-free interfaces, whereas different sites may contain unsealed nanovoids that can grow in size. Based on the experimental observations, initial void growth thus appears to occur along particle-matrix interfaces in a manner similar to crack propagation, with only slight...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
.... The IPC-A-610G standard defines a maximum allowable void rate of 30% projection area under x-ray observation for BGA solder balls ( Ref 25 ). However, for the thermal pad, it is recommended to have a maximum 50% void rate to guarantee thermal conductivity. For solder joints where structural strength...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003791
EISBN: 978-1-62708-177-1
... optical microscope and SEM analyses. For example, it is possible to determine positively whether a void is true porosity or the result of pullout by analyzing for encapsulating material in the void ( Ref 7 ). A void free of encapsulating material is the result of pullout during specimen preparation...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... 2 . Growth and coalescence of the nuclei can leave interfacial voids or structural discontinuities at the interface, particularly if there is no chemical interaction between the nuclei and the substrate material and dewetting growth occurs. In cases where there is little chemical interaction...