Analyzing the structure of composite materials is essential for understanding how the part will perform in service. Assessing fiber volume variations, void content, ply orientation variability, and foreign object inclusions helps in preventing degradation of composite performance. This article describes the optical microscopy and bright-field illumination techniques involved in analyzing ply terminations, prepreg plies, splices, and fiber orientation to provide the insight necessary for optimizing composite structure and performance.

Adhesive-bonded joints are extensively used in aircraft components and assemblies where structural integrity is critical. This article addresses the problem of how to inspect bonded assemblies so that all discrepancies are identified. It describes several inspection techniques and presents drawbacks and limitations of these techniques. Generic flaw types and flaw-producing mechanisms are listed in a table. The article discusses metal-to-metal defects, adherend defects, honeycomb sandwich defects, repair defects, and in-service defects. It reviews the methods applicable to the inspection of bonded structures, including visual inspection, ultrasonic inspection, X-ray radiography, and neutron radiography. The evaluation and correlation of inspection results are also discussed. The article concludes with information on the effects of ultrasonic wave interference in the ultrasonic inspection of adhesive-bonded joints.

Any model that describes the early stage of cavitation must therefore address experimental observations of continuous nucleation, cracklike interface cavities, cavity growth from nanometer-scale sizes, and debonding at particle interfaces and formation of large-faceted cavities. This article summarizes the microstructural details of the early stages of cavitation in metals for understanding the interface-constrained plasticity cavitation model. It discusses formulation, predictions and implications, involved in analysis of cavitation under constrained conditions.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

This article reviews how process variations influence the characteristics of thermal spray coatings. It describes various specimen preparation techniques, which allow accurate microstructural analysis. These techniques include sectioning, cleaning, mounting, planar grinding, fine grinding, rough polishing, and etching. The article provides information on the problems associated with specimen preparation. It concludes with a discussion on the various methods of analysis for thermal spray coatings.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.