Fusion welding processes involve four phase changes, namely, solid-solid state, solid-liquid, liquid-vapor, and vapor-plasma. Each has its own thermal, momentum, and stress history. This article discusses some important techniques to validate temperature, momentum, stress, and residual strain history observed in the heat-affected zone of fusion welded materials.

This article describes the characteristics of continuous cathodic arc sources and filtering process for removing macroparticles from a cathodic arc. It provides information on the types of arc sources and the properties of deposited materials. The advantages, limitations, and applications of arc deposition are also discussed.

This article presents a summary of the current and new materials and processing techniques for thermal barrier coatings (TBCs) and environmental barrier coatings (EBCs). Different thermal spraying and postspraying processing techniques are required to produce coatings with optimal performance. For TBCs and EBCs, the elastic modulus, mechanical strength, and toughness values are extremely important in predicting failure behavior under stress and strain conditions, mainly for modeling purposes. Sand and/or volcanic ash particles are molten in the hot zones of turbines and deposited over TBCs and EBCs. They form calcium-magnesium-aluminosilicate (CMAS) glassy deposits.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

This article is a detailed account of optical emission spectroscopy (OES) for elemental analysis. It begins with a discussion on the historical background of OES and development trends in OES methods. This is followed by a description of the general principles and optical systems of OES, along with various types of emission sources commonly used for OES. Some of the processes involved in calibration and quantification of OES for direct solids analysis by the ratio method are then described. The article ends with a discussion on the applications of each type of emission sources.

This article provides a comprehensive review and critical assessment of numerical modeling of heat and mass transfer in fusion welding. The different fusion welding processes are gas tungsten arc welding, gas metal arc welding, laser welding, electron beam welding, and laser-arc hybrid welding. The article presents the mathematical equations of mass, momentum, energy, and species conservation. It reviews the applications of heat transfer and fluid flow models for different welding processes. Finally, the article discusses the approaches to improve reliability of, and reduce uncertainty in, numerical models.

Coatings and other surface modifications are used for a variety of functional, economic, and aesthetic purposes. Two major applications of thermal spray coatings are for wear resistance and corrosion resistance. This article discusses thermal (surface hardening) and thermochemical (carburizing, nitriding, and boriding) surface modifications, electrochemical treatments (electroplating, and anodizing), chemical treatments (electroless plating, phosphating, and hot dip coating), hardfacing, and thermal spray processes. It provides information on chemical and physical vapor deposition techniques such as conventional CVD, laser-assisted CVD, cathodic arc deposition, molecular beam epitaxy, ion plating, and sputtering.

The electronic microcircuit industry has placed severe demands on metal suppliers to provide metals of the highest reproducible purity attainable as a result of the constant quest for the true values of physical and chemical properties of metals. This article describes the commonly used methods for ultrapurification of metals produced by electrolytic processes, including fractional crystallization, zone refining, vacuum melting, distillation, chemical vapor deposition, and solid state refining techniques. In addition, it describes the trace element analysis and resistance-ratio test methods used to characterize purity. Tables list the values for resistance ratios of zone-refined metals and their corresponding chemical compositions, and provide an example of the detection of impurities to concentrations in the parts per billion range, utilizing a combination of the glow discharge mass spectroscopy method and Leco combustion methods.

Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses ion implantation in the context of research and development applications.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

Chemical vapor deposition (CVD) involves the formation of a coating by the reaction of the coating substance with the substrate. Serving as an introduction to CVD, the article provides information on metals, ceramics, and diamond films formed by the CVD process. It further discusses the characteristics of different pack cementation processes, including aluminizing, siliconizing, chromizing, boronizing, and multicomponent coating.

This article discusses the general principles, optical systems, and emission sources of optical emission spectroscopy for elemental analysis. Changes in the energy of the valence or outer shell electrons result in the atomic lines used in emission spectroscopy. Each possible combination of electron configurations produces a spectroscopic term that describes the state of the atom. Atomic emission is analytically useful only to the extent that the emission from one atomic species can be measured and its intensity recorded independent of emission from other sources. Emission sources are often designed to minimize molecular emission. Each of the four types of emission sources; arcs, high-voltage sparks, glow discharges, and flames; has a set of physical characteristics with accompanying analytical assets and liabilities. The article also discusses the applications of each type of emission source.

Inductively coupled plasma atomic emission spectroscopy (ICP-AES) is an analytical technique for elemental determinations in the concentration range of major to trace based on the principles of atomic spectroscopy. This article provides a description of the basic atomic theory, and explains the analytical procedures and various interference effects of ICP, namely, spectral, vaporization-atomization, and ionization. It provides a detailed discussion on the principal components of an analytical ICP system, namely, the sample introduction system; ICP torch and argon gas supplies; radio-frequency generator and associated electronics; spectrometers, such as polychromators and monochromators; detection electronics and interface; and the system computer with appropriate hardware and software. The article also describes the uses of direct-current plasma, and provides examples of the applications of ICP-AES.

This article provides an overview of the fundamentals, mechanisms, process physics, advantages, and limitations of laser beam welding. It describes the independent and dependent process variables in view of their role in procedure development and process selection. The article includes information on independent process variables such as incident laser beam power and diameter, laser beam spatial distribution, traverse speed, shielding gas, depth of focus and focal position, weld design, and gap size. Dependent variables, including depth of penetration, microstructure and mechanical properties of laser-welded joints, and weld pool geometry, are discussed. The article also reviews the various injuries and electrical and chemical hazards associated with laser beam welding.

This article presents a general description of pulsed-laser deposition. It describes the components of pulsed-laser deposition equipment. The article also discusses the effects of angular distribution of materials. Finally, the article reviews the characteristics of high-temperature superconductors and ferroelectric materials.

This article is a general introduction to surface engineering of engineering components, providing an overview of the applications of surface treatments and the environmental protection regulations directly or indirectly related to surface engineering processes.