This article describes the eight chemical cleaning methods, namely, circulation, fill and soak, cascade, foam, vapor-phase organic, steam-injected, on-line chemical, and mechanical cleaning. It presents information on deposit types, solvents used to remove them, and construction material incompatibilities in a table. The article summarizes the uses of chemical cleaning solutions, including hydrochloric acid, phosphoric acid, and sulfamic acid, as well as the additives used to neutralize their impact on corrosion. It discusses the chemical cleaning procedures, including selection of cleaning method and solvent, documentation of cleaning, and corrosion monitoring in chemical cleaning.

Wipe solvents are used to remove contaminants from a workpiece before it undergoes manufacturing operations that require clean surfaces, such as bonding, sealing, painting, welding, plating, specialized surface treatment procedures, and others. This article describes the evaluation parameters for wipe solvent cleaners, including methyl ethyl ketone, methyl isobutyl ketone, trichloroethene, tetrachloroethylene, acetone, toluene, dichloromethane, benzene, xylene, and other alternate wipe solvent cleaners. It contains a table that lists the compositions and properties of wipe solvent cleaners.

Metal surfaces must often be cleaned before subsequent operations to remove unwanted substances such as pigmented drawing compounds, unpigmented oil and grease, chips and cutting fluids, polishing and buffing compounds, rust and scale, and miscellaneous contaminants. The article describes common cleaning processes, including alkaline, electrolytic, solvent, emulsion, molten salt bath, ultrasonic and acid cleaning as well as pickling and abrasive blasting. It also explains how to select the appropriate process for a given soil type and surface composition.

Solvent cleaning is a surface preparation process that can be accomplished in room temperature baths (cold cleaning ) or by condensing vapors of a solvent on a workpiece (vapor degreasing). This article provides a detailed discussion on solvents, equipment, process limitations and applications, and safety and health hazards of cold cleaning and vapor degreasing. It also includes information on control of contamination, conservation and recovery of solvent, and disposal of solvent wastes.

This article discusses the materials of construction found in pharmaceutical production facilities. The materials discussed are different stainless steels, nickel and nickel-base alloys, titanium, zirconium, impervious graphite, fluoropolymers, and glass-lined steel. The article describes the three primary causes of failure in the manufacture of pharmaceuticals: embedded iron, failures of glass linings, and corrosion under thermal insulation.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

Organic coatings are the principal means of corrosion control for the hulls and topsides of ships and for the splash zones on permanent offshore structures. This article describes surface preparation which is the most important consideration in determining the performance of organic coating systems. It contains a table that lists the uses and applicable standards for various surface preparation techniques. The article provides information on organic coatings in topside coating systems and reviews the importance of primers in the protection of steel substrates. It also explains the property requirements and the common types of immersion coatings.

Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.

Emulsion cleaning is an industrial cleaning process that uses an organic solvent as the main active agent. This article provides information on the applications, concerns and limitations, and process parameters of emulsion cleaning. It describes the processing variables and equipment for three main stages of emulsion cleaning: immersion cleaning, secondary cleaning, and spray cleaning. In addition, the classifications, composition, and selection criteria are also discussed.

This article describes the basic attributes of the most widely used metal surface cleaning processes to remove pigmented drawing compounds, unpigmented oil and grease, chips, cutting fluids, polishing and buffing compounds, rust and scale from steel parts, and residues and lapping compounds from magnetic particle and fluorescent penetrant inspection. The cleaning processes include emulsion cleaning, electrolytic alkaline cleaning, acid cleaning, solvent cleaning, vapor degreasing, alkaline cleaning, ultrasonic cleaning, and glass bead cleaning. The article provides guidelines for choosing an appropriate process for particular applications and discusses eight well-known methods for determining the degree of cleanliness of the work surface.

This article provides an overview of surface contaminants that may affect the heat treatment processes and end-product quality. It presents information on the chemicals used to clean different surface contaminants of steels. The article discusses three types of cleaning methods, namely, mechanical, chemical, and electrochemical and their effectiveness and applicability. The mechanical cleaning methods include grinding, brushing, steam or flame jet cleaning, abrasive blasting, and tumbling. Solvent cleaning, emulsion cleaning, alkaline cleaning, acid cleaning, pickling, and descaling are chemical cleaning methods. The electrochemical cleaning methods include electropolishing, electrolytic alkaline cleaning, and electrolytic pickling. The article provides information on cleanliness measurement methods such as qualitative tests and quantitative tests to ensure product quality. Health hazards that may be associated with each cleaning method and the general control measures to be used for each hazard are tabulated.

Maintenance coating is an important part of any meaningful asset-preservation strategy in facilities producing pulp and paper and other chemicals. This article discusses maintenance coating for carbon steel structures and process equipment exposed to normal external pulp and paper mill atmospheric conditions. The important requirements and standards for surface preparation are emphasized and common issues encountered in maintenance coating projects are described.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

The process of coating plastics with metals for functional purposes is called metallizing of plastics. This article discusses the metallizing of plastics, provides information on its history, and gives a short note on applications and adhesion properties of metallic coatings. It also discusses the selection of plastics for plating. This article also describes metallizing techniques, including plating (electrolytic or electroplating), vacuum metallizing and thermal spraying, and environmental considerations. The article discusses the quality assurance procedures for metallized plastic parts which include tests that assess the quality of the finish, coating thickness, adhesion, and corrosion resistance, and gives a short note on service performance, which includes service condition classifications.

This article describes the characteristics of zinc-rich coatings that can be subcategorized according to the type of binder material used. It discusses the formulations of zinc-rich coatings with organic binders. The three major groups of inorganic zinc-rich coatings categorized by the Society for Protective Coatings are also discussed. These include postcured water-based alkali metal silicates, self-cured water-based alkali metal silicates, and self-cured solvent-based alkyl silicates. The article concludes with information on comparisons of inorganic with organic zinc-rich coatings.

Painting is a generic term for the application of a thin organic coating to the surface of a material for decorative, protective, or functional purposes. This article provides a detailed account of the types and selection factors of paints and the various application methods, including conventional air atomized, airless, and electrostatic spray; roller coating; dip coating; flow coating; curtain coating; tumble coating; electrocoating; and powder coating. Surface preparation methods and prepaint treatments for coating systems are also discussed. The article includes information on quality control procedures, causes of paint film defects, cost calculation, and safety and environmental precautions. The composition and characteristics of organic coatings, coating system selection factors, the types of paints for structural steel, and the applications of paint on structural steel are also reviewed.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.