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Book Chapter
Chemical Vapor Deposition of Semiconductor Materials
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001284
EISBN: 978-1-62708-170-2
... Abstract This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind...
Abstract
This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.
Book Chapter
Solid Solutions and Phase Transformations
Available to PurchaseBook: Alloy Phase Diagrams
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006222
EISBN: 978-1-62708-163-4
... solid states is then called a phase, and one speaks of the α phase and the β phase. Fig. 1 The distribution of atoms in solid, liquid, and vapor phases of alloys. (a) Two solid solutions formed in a 50% Fe-50% Cu alloy. (b) Liquid phase formed by 50% Fe-50% Cu alloy. (c) Two liquid phases formed...
Abstract
This article begins with the one-component, or unary, diagram for magnesium. The diagram shows what phases are present as a function of the temperature and pressure. When two metals are mixed in the liquid state to produce a solution, the resulting alloy is called a binary alloy. The article describes the various types of solid solutions such as interstitial solid solutions and substitutional solid solutions. Free energy is important because it determines whether or not a phase transformation is thermodynamically possible. The article discusses the thermodynamics of phase transformations and free energy, as well as kinetics of phase transformations. It concludes with a description of solid-state phase transformations that occur when one or more parent phases, usually on cooling, produces a phase or phases.
Book Chapter
Growth and Growth-Related Properties of Films Formed by Physical Vapor Deposition
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... Abstract This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition...
Abstract
This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001294
EISBN: 978-1-62708-170-2
... to achieve. When single-element sources are used, the arrival rate of each individual component must be calibrated and inter-regulated. In PLD, the composition of the vapor is the same as that of the target. Starting with the correct composition of the vapor greatly facilitates the growth of a desired phase...
Abstract
This article presents a general description of pulsed-laser deposition. It describes the components of pulsed-laser deposition equipment. The article also discusses the effects of angular distribution of materials. Finally, the article reviews the characteristics of high-temperature superconductors and ferroelectric materials.
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005434
EISBN: 978-1-62708-196-2
.... Most of the elementary steps depicted in Fig. 1 for CVD are involved in PVD, except that there is usually no thermal activation of the vapor phase, that is, no gas-phase reactions and no (or few) chemically driven desorption or adsorption steps at the film surface. Hence, growth is mainly driven...
Abstract
This article focuses on transport phenomena and modeling approaches that are specific to vapor-phase processes (VPP). It discusses the VPP for the synthesis of materials. The article reviews the basic notions of molecular collisions and gas flows, and presents transport equations. It describes the modeling of vapor-surface interactions and kinetics of hetereogeneous processes as well as the modeling and kinetics of homogenous reactions in chemical vapor deposition (CVD). The article provides information on the various stages of developing models for numerical simulation of the transport phenomena in continuous media and transition regime flows of VPP. It explains the methods used for molecular modeling in computational materials science. The article also presents examples that illustrate multiscale simulations of CVD or PVD processes and examples that focus on sputtering deposition and reactive or ion beam etching.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001395
EISBN: 978-1-62708-173-3
..., namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously...
Abstract
Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.
Book Chapter
Densification and Sintering of Ceramics
Available to PurchaseSeries: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003054
EISBN: 978-1-62708-200-6
... the underlying mechanisms and kinetics and the relationship between grain growth and densification. densification gas pressure sintering grain growth hot isostatic pressing liquid-phase sintering reaction sintering sintering sol-gel processing solid-state sintering technical ceramics...
Abstract
Sintering provides the interparticle bonding that generates the attractive forces needed to hold together the otherwise loose ceramic powder mass. It also improves hardness, strength, transparency, toughness, electrical conductivity, thermal expansion, magnetic saturation, corrosion resistance, and other properties. This article discusses the fundamentals of sintering and its effects on pore structures and particle density. It addresses some of the more common sintering methods, including solid-state, liquid-phase, and gas pressure sintering, and presents alternative processes such as reaction sintering and self-propagating, high-temperature synthesis. It also describes several pressure densification methods, including hot isostatic pressing, gas pressure sintering, molten particle deposition, and sol-gel processing. The article concludes with a section on grain growth that discusses the underlying mechanisms and kinetics and the relationship between grain growth and densification.
Book: Powder Metallurgy
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006117
EISBN: 978-1-62708-175-7
... densification grain boundaries grain growth hot isostatic pressing liquid-phase sintering microstructure phase diagram pressure-assisted sintering sinter forging sintering solid-state sintering spark plasma sintering supersolidus liquid-phase sintering transient liquid-phase sintering uniaxial hot...
Abstract
Sintering is a thermal treatment process in which a powder or a porous material, already formed into the required shape, is converted into a useful article with the requisite microstructure. Sintering can be classified as solid-state, viscous, liquid-phase, and pressure-assisted (or pressure) sintering. This article provides information on the mechanisms and theoretical analysis of sintering and focuses on the types, mechanisms, process and microstructural variables, computer simulation, stages, and fundamentals of densification and grain growth of solid-state sintering and liquid-phase sintering. It describes the models for viscous sintering and the methods used in pressure-assisted sintering, namely, uniaxial hot pressing, hot isostatic pressing, sinter forging, and spark plasma sintering.
Book: Fatigue and Fracture
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002361
EISBN: 978-1-62708-193-1
... argon environment. Fig. 3 Room-temperature fatigue crack growth kinetics of AISI 4340 steel in dehumidified argon and in water vapor (585 Pa) at R = 0.1 Source: Ref 6 Fig. 4 Environment-dependent component of fatigue crack growth parameter as a function of cyclic load period...
Abstract
Corrosion fatigue refers to the phenomenon of cracking in materials under the combined actions of fatigue loading and a corrosive environment. This article focuses on the various mechanisms of corrosion fatigue, namely, hydrogen-assisted cracking, anodic dissolution, and surface energy reduction. It discusses the variables affecting corrosion fatigue. The effect of fatigue load frequency, environment, grain size, stress ratio, waveform, and temperature fatigue crack growth are also discussed.
Book Chapter
Biomedical Coatings Made by Thermal Spraying for Orthopaedic Joint Applications
Available to PurchaseBook: Thermal Spray Technology
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005741
EISBN: 978-1-62708-171-9
... ): Crystallinity is 50 to 90%. The best range is 70 to 85% for bone growth. Minimize the amorphous phase and other decomposed phases, if possible. The best coating thickness is 50 to 70 μm (2.0 to 2.8 mils). Hydroxyapatite and other calcium phosphates have different dissolution behaviors at different...
Abstract
This article provides an overview of how thermal spray technology has adapted to meet the needs of the orthopaedic industry. It includes the challenges facing the development of artificial joints, substrate material selection criteria, thermal spray solutions, and clinical outcomes of thermal spray coatings. The article focuses on plasma thermal spray, which is the technique most often used to make porous titanium and hydroxyapatite (HA) coatings, such as thermal spray titanium, thermal spray HA, solution-precipitated HA, thermal spray chromium oxide, and thermal spray chromium carbide cermet coatings.
Book Chapter
Sintering of Hardmetals
Available to PurchaseBook: Powder Metallurgy
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006069
EISBN: 978-1-62708-175-7
... sintering nitrogen sintering overpressure sintering oxygen content partial-pressure sintering pressure-assisted sintering pressureless sintering sintering sintering furnaces vacuum sintering HARDMETALS (cemented carbide and cemented tungsten carbide) are classic two-phase materials consisting...
Abstract
This article discusses two major sintering methods: pressureless and pressure-assisted sintering. Pressureless sintering techniques include vacuum and partial-pressure, hydrogen, and microwave sintering. Pressure-assisted consolidation techniques include overpressure sintering, sintering followed by postsinter hot isostatic pressing, hot pressing, and several rapid hot consolidation techniques. The article describes nitrogen sintering and the sintering of cermets. It reviews the furnaces used for sintering and presents the lubrication removal techniques. The article also outlines the need to control carbon and oxygen to obtain optimal properties and explains microstructure development and grain size control.
Book Chapter
Chemical Vapor Deposition of Nonsemiconductor Materials
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001283
EISBN: 978-1-62708-170-2
..., tribological, and high-temperature coatings, as well as free-standing structures. Principles of Chemical Vapor Deposition The CVD process can be defined as the deposition of a solid on a heated surface via a chemical reaction from the vapor or gas phase. It belongs to the class of vapor-transport...
Abstract
This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001113
EISBN: 978-1-62708-162-7
... determined ( Ref 6 ) that at the annealing temperatures necessary to form the superconducting phase substantial diffusion occurred from the substrate into the material, with a substantial degradation of superconducting properties. This, combined with the desire for oriented growth (hopefully single crystal...
Abstract
This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.
Book Chapter
Vacuum Deposition, Reactive Evaporation, and Gas Evaporation
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001287
EISBN: 978-1-62708-170-2
... or nitrogen, or a hydrocarbon is metered into the vacuum chamber, where it reacts with the vapor from a metallic evaporant to form a metal oxide, nitride, or carbide coating. In gas evaporation, a high residual gas pressure causes the formation of ultrafine (100 nm, or 1000 Å) particles by gas phase...
Abstract
This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.
Book Chapter
Microstructural Characterization of Coatings and Thin Films
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001300
EISBN: 978-1-62708-170-2
... depend on the substrate surface structure and deposition parameters Competitive growth, where certain favorably oriented nuclei will grow into the vapor phase faster than others, but which may not constitute the majority of the nuclei population Steady growth, which occurs once a preferred...
Abstract
This article describes the structure of coatings produced by plasma spraying, vapor deposition, and electrodeposition processes. The main techniques used for microstructure assessment are introduced. The relationship between the microstructure and property is also discussed. The experimental techniques for microstructural characterization include metallographic technique, X-ray diffraction, electron, microscopies, and porosimetry.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001289
EISBN: 978-1-62708-170-2
... Abstract This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing...
Abstract
This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.
Book: Composites
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 30 April 2026
DOI: 10.31399/asm.hb.v21.a0007045
EISBN: 978-1-62708-489-5
... with support from the U.S. Department of Energy to evaluate the vapor-liquid-solid (VLS) approach to producing SiC fibers. The VLS process is driven by gas-phase reactions that are aided by a catalyst substrate onto which the solid fiber is formed ( Ref 9 ). 2000s TISICS Ltd. ( Ref 10 ) broadened...
Abstract
This article discusses the array of fiber products, manufacturing approaches, and production suppliers. It also discusses carbon fibers, their range of uses, and their performance capabilities, which are unique and separate from oxide and non-oxide fibers. The article reviews the history of developing silicon carbide (SiC) fibers and SiC-base ceramic-matrix composites. CMCs provide a roadmap and timeline for the technologies developed and refined over the last 50 years of effort to make SiC-SiC composites a reality. The article also describes the use of fiber in composite applications.
Book Chapter
Surface Engineering of Zirconium and Hafnium
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001312
EISBN: 978-1-62708-170-2
... cleaning, chemical descaling, pickling or etching, anodizing, autoclaving, polishing, buffing, vapor phase nitriding, and electroplating. Applications of these surface treatment processes are also reviewed. anodizing autoclaving blast cleaning buffing chemical descaling cleaning electroplating...
Abstract
Zirconium and hafnium surfaces require cleaning and finishing for reasons such as preparation for joining, heat treatment, plating, forming, and producing final surface finishes. This article provides information on various surface treatment processes, surface soil removal, blast cleaning, chemical descaling, pickling or etching, anodizing, autoclaving, polishing, buffing, vapor phase nitriding, and electroplating. Applications of these surface treatment processes are also reviewed.
Book Chapter
Corrosion of Uranium and Uranium Alloys
Available to PurchaseBook: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003828
EISBN: 978-1-62708-183-2
... as galvanic interactions between uranium, its alloys, and other metals. The article provides information on the atmospheric corrosion of uranium based on oxidation in dry air or oxygen, water vapor, and oxygen-water vapor mixtures depending upon particular storage conditions. The mechanism and morphology...
Abstract
This article reviews general corrosion of uranium and its alloys under atmospheric and aqueous exposure as well as with gaseous environments. It describes the dependence of uranium and uranium alloy corrosion on microstructure, alloying, solution chemistry, and temperature as well as galvanic interactions between uranium, its alloys, and other metals. The article provides information on the atmospheric corrosion of uranium based on oxidation in dry air or oxygen, water vapor, and oxygen-water vapor mixtures depending upon particular storage conditions. The mechanism and morphology of hydride corrosion of uranium are discussed. The article provides information on environmentally assisted cracking, protective coatings, and surface modification of uranium and its alloys. It also summarizes the environmental, safety, and health considerations for their use.
Book Chapter
Spray Quenching
Available to PurchaseSeries: ASM Handbook
Volume: 4A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v04a.a0005816
EISBN: 978-1-62708-165-8
... (momentum) will be able to penetrate the vapor film and strike the plate. The result will be a film of liquid separated from the plate by a layer of vapor. This is called the film boiling or nonwetting phase. The heat-transfer process for this state can be pictured as shown in Fig. 5 ( Ref 2 , 26...
Abstract
Spray quenching refers to a wide variety of quenching processes that involve heat removal facilitated by the impingement of a quenchant medium on a hot metal surface. This article provides information on the basic concepts of spray quenching, and discusses the most commonly used techniques in quench tank agitation to establish uniformity of the quenched part. Common techniques include quenchant stirring, quenchant circulation, and submerged jet/spray mixing. The article also describes the effect of quenching agitation and reviews heat-transfer characteristics of immersion quenching and spray quenching with water.
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