Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses ion implantation in the context of research and development applications.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

Chemical vapor deposition (CVD) involves the formation of a coating by the reaction of the coating substance with the substrate. Serving as an introduction to CVD, the article provides information on metals, ceramics, and diamond films formed by the CVD process. It further discusses the characteristics of different pack cementation processes, including aluminizing, siliconizing, chromizing, boronizing, and multicomponent coating.

This article focuses on transport phenomena and modeling approaches that are specific to vapor-phase processes (VPP). It discusses the VPP for the synthesis of materials. The article reviews the basic notions of molecular collisions and gas flows, and presents transport equations. It describes the modeling of vapor-surface interactions and kinetics of hetereogeneous processes as well as the modeling and kinetics of homogenous reactions in chemical vapor deposition (CVD). The article provides information on the various stages of developing models for numerical simulation of the transport phenomena in continuous media and transition regime flows of VPP. It explains the methods used for molecular modeling in computational materials science. The article also presents examples that illustrate multiscale simulations of CVD or PVD processes and examples that focus on sputtering deposition and reactive or ion beam etching.

Ion-beam-assisted deposition (IBAD) refers to the process wherein evaporated atoms produced by physical vapor deposition are simultaneously struck by an independently generated flux of ions. This article discusses the energy utilization of this process. It describes the physical and chemical processes occurring at the film-vacuum interface during IBAD and dual-ion-beam sputtering with illustrations. The article also reviews the methods used for large-area, high-volume implementation of IBAD and the modes of film formation for IBAD. It contains a table that presents information on deposition and synthesis of inorganic compounds by IBAD and concludes with a discussion on the improved coating properties, advantages, limitations, and applications of IBAD.

The classes of tool materials for machining operations are high-speed tool steels, carbides, cermets, ceramics, polycrystalline cubic boron nitrides, and polycrystalline diamonds. This article discusses the expanding role of surface engineering in increasing the manufacturing productivity of carbide, cermet, and ceramic cutting tool materials used in machining operations. The useful life of cutting tools may be limited by a variety of wear processes, such as crater wear, flank wear or abrasive wear, builtup edge, depth-of-cut notching, and thermal cracks. The article provides information on the applicable methods for surface engineering of cutting tools, namely, chemical vapor deposited (CVD) coatings, physical vapor deposited coatings, plasma-assisted CVD coatings, diamond coatings, and ion implantation.

Coating technology for carbon-carbon has been driven primarily by the aerospace and defense industries, in applications where the composite is exposed to high-temperature oxidizing environments. The most notable application of coated carbon-carbon is for the nose cap and wing leading edges of the Shuttle Orbiter vehicle. This article details the fundamentals of protecting carbon-carbon composites. It explains various coating deposition techniques: pack cementation, chemical vapor deposition, and slurry coatings. The article discusses typical coating architectures in accordance with the process used to deposit the primary oxygen barrier. It also provides information on the practical limitations of coatings for the composites.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

This article discusses the important characteristics of fluidized beds. The total space occupied by a fluidized bed can be divided into three zones: grid zone, main zone, and above-bed zone. The article discusses the various types of atmospheres of fluidized beds, such as oxidizing and decarburizing atmosphere; nitrocarburizing and nitriding atmosphere; carburizing and carbonitriding atmosphere; and chemical vapor deposition atmosphere. External resistance heating, external combustion heating, internal resistance heating, direct resistance heating, submerged combustion heating, and internal combustion heating can be used to achieve the heat input for a fluidized bed. The article also describes the operations, design considerations, and applications of fluidized-bed furnaces in heat treating. Thermochemical surface treatments, such as carburizing, carbonitriding, nitriding, and nitrocarburizing, are also discussed. Finally, the article reviews the principles and applications of fluidized-bed heat treatment.

Nanotechnology and smart-coating technologies have been reported to show great promise for improved performance in critical areas such as corrosion resistance, durability, and conductivity. This article exemplifies nanofilms and nanomaterials used in coatings applications, including carbon nanotubes, silica, metals/metal oxides, ceramics, clays, buckyballs, graphene, polymers, titanium dioxide, and waxes. These can be produced by a variety of methods, including chemical vapor deposition, plasma arcing, electrodeposition, sol-gel synthesis, and ball milling. The application of nanotechnology and the development of smart coatings have been dependent largely on the availability of analytical and imaging techniques such as Raman spectroscopy, scanning and transmission electron microscopy, atomic force microscopy, and scanning tunneling microscopy.

Cemented carbides belong to a class of hard, wear-resistant, refractory materials in which the hard carbide particles are bound together, or cemented, by a ductile metal binder. Cermet refers to a composite of a ceramic material with a metallic binder. This article discusses the manufacture, composition, classifications, and physical and mechanical properties of cemented carbides. It describes the application of hard coatings to cemented carbides by physical or chemical vapor deposition (PVD or CVD). Tungsten carbide-cobalt alloys, submicron tungsten carbide-cobalt alloys, and alloys containing tungsten carbide, titanium carbide, and cobalt are used for machining applications. The article also provides an overview of cermets used in machining applications.

This article reviews cleaning and finishing operations that have proven to be effective on titanium, its alloys, and semi-fabricated titanium products. It explains how to remove scale, tarnish films, grease, and other soils and how to achieve required finishes and/or improve wear and oxidation resistance through the use of polishing, buffing, and wire brushing operations. The article also covers a wide range of surface modification and coating processes, including ion implantation, diffusion, chemical and physical vapor deposition, plating, anodizing, and chemical conversion coatings as well as sprayed and sol-gel coatings and laser and electron-beam treatments.

This article discusses the classifications, compositions, properties, advantages, disadvantages, limitations, and applications of the most commonly used methods for surface engineering of carbon and alloy steels. These include cleaning methods, finishing methods, conversion coatings, hot-dip coating processes, electrogalvanizing, electroplating, metal cladding, organic coatings, zinc-rich coatings, porcelain enameling, thermal spraying, hardfacing, vapor-deposited coatings, surface modification, and surface hardening via heat treatment.

This article describes the structure of coatings produced by plasma spraying, vapor deposition, and electrodeposition processes. The main techniques used for microstructure assessment are introduced. The relationship between the microstructure and property is also discussed. The experimental techniques for microstructural characterization include metallographic technique, X-ray diffraction, electron, microscopies, and porosimetry.

This article begins with a discussion on the environmental factors that induce corrosion in magnesium alloys. It reviews the factors that determine the severity of different forms of localized corrosion, namely, galvanic corrosion, corrosion fatigue, and stress-corrosion. The article discusses the corrosion protection in magnesium assemblies and the protective coating systems used in corrosion protection practices. The protection schemes for specific applications and production of novel magnesium alloys with improved corrosion resistance are also described. The article concludes with a discussion on corrosion of bulk vapor-deposited alloys and magnesium-matrix composites.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.