Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic oxygen environment exposure effect, solar cell interconnect, integrated circuit defects, and fatigue failure of these materials.

This article is a compilation of definitions for terms related to welding fundamentals and all welding processes. The processes include arc and resistance welding, friction stir welding, laser beam welding, explosive welding, and ultrasonic welding.

This article presents an introduction to brazing, including information on its mechanics, advantages, and limitations. It reviews soldering with emphasis on chronology, solder metals, and flux technology. The article also provides useful information on mass, wave, and drag soldering. It presents a table which contains information on the comparison of soldering, brazing, and welding.

Ultrasonic welding (USW) is effectively used to join both similar and dissimilar metals with lap-joint welds. This article describes procedure considerations for the ultrasonic welding of specific material types. It reviews difficult-to-weld alloys, such as carbon and low-alloy steels, high-strength steels, and stainless steel, and provides information on the applications of weldable alloys such as aluminum alloys and copper alloys. The article concludes with a discussion on welding of dissimilar metal (nonferrous-to-nonferrous) combinations and its applications.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

The ultrasonic machining (USM) process consists of two methods, namely, ultrasonic impact grinding and rotary USM. This article lists the major ultrasonic components that are similar to both rotary USM and ultrasonic impact grinding. It also provides schematic representations of the components used in rotary USM and ultrasonic impact grinding. The article describes the operations of the components of the rotary ultrasonic machine and ultrasonic impact grinding machine. It discusses the applications of the rotary ultrasonic machine: drilling, milling, and surface grinding. The article concludes with information on machining characteristics of ultrasonic impact grinding.

This article outlines the requirements and methods associated with the inspection of brazements. It emphasizes the incorporation of these requirements into the overall quality system. The article reviews the acceptance limits, design limitations, and nondestructive and destructive inspection techniques involved in the brazement inspection. Selected case studies are also provided for further reference.

Ultrasonic metal welding is a solid-state welding process that produces coalescence through the simultaneous application of localized high-frequency vibratory energy and moderate clamping forces. This article discusses the parameters to be considered when selecting a suitable welder for ultrasonic metal welding. It details the personnel requirements, advantages, limitations, and applications, namely, wire welds, spot welds, continuous seam welds, and microelectronic welds of ultrasonic metal welding.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.

This article overviews the classification of welding processes and the key process embodiments for joining by various fusion welding processes: fusion welding with chemical sources for heating; fusion welding with electrical energy sources, such as arc welding or resistance welding; and fusion welding with directed energy sources, such as laser welding, electron beam welding. The article reviews the different types of nonfusion welding processes, regardless of the particular energy source, which is usually mechanical but can be chemical, and related subprocesses of brazing and soldering.

This article describes the factors considered in the analysis of brazeability and solderability of engineering materials. These are the wetting and spreading behavior, joint mechanical properties, corrosion resistance, metallurgical considerations, and residual stress levels. It discusses the application of brazed and soldered joints in sophisticated mechanical assemblies, such as aerospace equipment, chemical reactors, electronic packaging, nuclear applications, and heat exchangers. The article also provides a detailed discussion on the joining process characteristics of different types of engineering materials considered in the selection of a brazing process. The engineering materials include low-carbon steels, low-alloy steels, and tool steels; cast irons; aluminum alloys; copper and copper alloys; nickel-base alloys; heat-resistant alloys; titanium and titanium alloys; refractory metals; cobalt-base alloys; and ceramic materials.

Ultrasonic cleaning involves the use of high-frequency sound waves that is above the upper range of human heating, or about 18 kHz, to remove a variety of contaminants from parts immersed in aqueous media. This article describes the process, design considerations and the equipment in ultrasonic cleaning. The components used in the generation of ultrasonic wave include piezoelectric and magnetostrictive transducers that are used in ultrasonic generators and tanks. The effects of solution type and its temperature on the effectiveness of ultrasonic cleaning are also discussed.

Atomization is the dominant method for producing metal and prealloyed powders from aluminum, brass, iron, low-alloy steels, stainless steels, tool steels, superalloys, titanium alloys, and other alloys. The general types of atomization processes encompass a number of industrial and research methods. This article describes the key process variables and production factors for the industrial methods: two-fluid, centrifugal, vacuum or soluble-gas, and ultrasonic atomization. It also reviews the effect of atomization methods and process variables on key powder characteristics such as the average particle size, particle size distribution or screen analysis, particle shape, chemical composition, and microstructure.

This article discusses different types of joining processes, including welding, brazing, soldering, mechanical fastening, and adhesive bonding. It examines two broad classes of welding: fusion welding and solid-state welding. The article discusses the process selection considerations for welding, brazing, and soldering. It also describes joint design considerations such as selection of weld joints and welds.