Search Results for ultra-fast three-dimensional X-ray tomography

Metal transparency and interaction with X-rays have been recognized as obvious candidate principles from which methods for in situ monitoring of solidification processes could be developed. This article describes the use of X-ray imaging-based techniques to investigate interface morphology evolution, solute transport, and various process phenomena at spatiotemporal resolutions. It discusses the three viable imaging techniques made available by synchrotron radiation for the real-time investigation of solidification microstructures in alloys. These include two-dimensional X-ray topography, two-dimensional X-ray radiography, and ultra-fast three-dimensional X-ray tomography.

This article introduces the principal methodologies and some advanced technologies that are being applied for nondestructive evaluation (NDE) of fiber-reinforced polymer-matrix composites. These include acoustic emission, ultrasonic, eddy-current, computed tomography, electromagnetic acoustic transducer, radiography, thermography, and low-frequency vibration methods. The article also provides information on NDE methods commonly used for metal-matrix composites.

This article covers defect formation and classification, followed by a brief description of the most common nondestructive testing (NDT) methods used for postbuild inspection. Descriptions of the established and emerging NDT techniques for in-process monitoring (IPM) and in-process inspection (IPI) in additive manufacturing (AM) also are provided, highlighting the advantages and limitations. The article concludes with a list of the main NDT methods and techniques used. As qualification and certification of AM parts is an urgent matter for the AM industry, a description of the current work carried out for developing standards is also included.

Tungsten, molybdenum, and cemented carbide parts can be produced using several additive manufacturing technologies. This article classifies the most relevant technologies into two groups based on the raw materials used: powder-bed methods, such as selective laser melting, electron beam melting, and binder jet three-dimensional (3-D) printing, and feedstock methods, such as fused-filament fabrication and thermoplastic 3-D printing. It discusses the characteristics, processing steps, properties, advantages, limitations, and applications of these technologies.

This article focuses on ultrasonic testing (UT) applied to metallic additive manufacturing (AM) parts, presenting the basic principles of UT. It provides a detailed discussion on postprocess UT inspection of powder-bed-fusion-manufactured samples and directed-energy-deposition-manufactured samples.

This article presents a basic overview of technology-driven advances in the imaging of primarily metallic fracture surfaces. It describes various types of microscopes, including scanning electron, dual-beam, ion source, and transmission electron microscopes, and their capabilities. It also covers other useful hardware, such as computer-aided tomography (CAT) and micro-computer-aided tomography (micro-CAT) instruments. The article introduces some of the fracture image postprocessing methods and software, including image registration or alignment, focus stacking, Z-stacking, focal plane merging, and image stitching.

This article focuses on the pneumatic extrusion-based system for biomaterials. It provides an overview of additive manufacturing (AM) processes, followed by sections covering steps and major approaches for the 3D bioprinting process. Then, the article discusses the types, processes, advantages, limitations, and applications of AM technology and extrusion-based approaches. Next, it provides information on the research on extrusion-based printing. Finally, the article provides a comparison of the extrusion-based approach with other approaches.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

This article describes post-processing techniques for machining, finishing, heat treating, and deburring used to remove additive manufacturing (AM) metallic workpieces from a base plate and subsequent techniques to enhance printed workpieces. The AM processes include powder bed fusion, binder jetting, and direct energy deposition. The discussion provides information on powder removal, powder recycling and conditioning, part removal, and part enhancement. The mechanism, applications, advantages, and limitations of mechanical, radiation, and chemical-finishing processes as well as the properties of the resulting material are also covered.

This article presents a general understanding of causes and possible solutions for defects in the most common metal additive manufacturing (AM) processes: laser powder-bed fusion (L-PBF), laser directed-energy deposition (DED-L), and binder jetting (BJ).

Transmission electron microscopy (TEM) approach enables essentially simultaneous examination of microstructural features through imaging from lower magnifications to atomic resolution and the acquisition of chemical and crystallographic information from small regions of the thin specimen. This article discusses fundamentals of the technique, especially for solving materials problems. Background information is provided to help understand basic operations and principles, including instrumentation, the physics of signal generation and detection, image formation, electron diffraction, and spectrometry techniques with data analysis.

The formation of defects within additive-manufactured (AM) components is a major concern for critical structural and cyclic load applications. Thus, understanding the mechanisms of defect formation in fusion-based processes is important for prescribing the appropriate process parameters specific to the alloy system and selected processing technique. This article discusses the formation of defects within metal additive manufacturing, namely fusion-based processes and solid-state/sintering processes. Defects observed in fusion-based processes include lack of fusion, keyhole collapse, gas porosity, solidification cracking, solid-state cracking, and surface-connected porosity. The types of defects in solid-state/sintering processes are sintering porosity and improper binder burnout. The article also discusses defect-mitigation strategies, such as postprocess machining, surface treatment, and postprocessing HIP to eliminate defects detrimental to properties from the as-built condition. The use of noncontact thermal, optical, and ultrasound techniques for inspecting AM components are also considered. The final section summarizes the knowledge gap in our understanding of the defects observed within AM components.