Properly designed beam-delivery optics is essential to quality of the beam acting on the workpiece and to the economics of the manufacturing process. This article describes the design considerations of laser beam delivery optics. It also reviews the manufacturing economics and presents two case studies of typical economic environments found in laser welding applications.

This article introduces the concepts of electron and light microscopy with some general features of imaging systems and the ideas of magnification, resolution, depth of field, depth of focus, and lens aberrations as they apply to simple and familiar light-optical systems. In addition, it describes the differences between electron and light in the context of their respective microscopy techniques.

Transmission electron microscopy (TEM) approach enables essentially simultaneous examination of microstructural features through imaging from lower magnifications to atomic resolution and the acquisition of chemical and crystallographic information from small regions of the thin specimen. This article discusses fundamentals of the technique, especially for solving materials problems. Background information is provided to help understand basic operations and principles, including instrumentation, the physics of signal generation and detection, image formation, electron diffraction, and spectrometry techniques with data analysis.

Optical testing of plastics includes characterization of materials and analysis of optical components. This article focuses on procedures for testing various characteristics of optical components, including transmission and haze, yellowness, refractive index, birefringence, as well as surface irregularity, contamination, gloss, and color. It provides a short note on ad hoc testing, which is beneficial for practical applications in which lenses, prisms, and light pipes are being used and tested, as other test instruments are often not available.

Optical testing of plastics includes the characterization of materials and the analysis of optical components. If a material is tested for transmission, haze, yellowness, and refractive index, the knowledge of its optical properties is nearly complete. For optical components, surface irregularity, birefringence, and internal contamination must also be considered. These characteristics are a function of the material and the fabrication method. Gloss and color also are affected by the base material and measured as optical properties.

Visual inspection is a nondestructive testing technique that provides a means to detect and examine a variety of surface flaws, such as corrosion, contamination, surface finish, and surface discontinuities. This article discusses the equipment used to aid visual inspection, including borescopes (rigid and flexible), optical sensors, and magnifying systems. The article discusses the special features of borescopes, the factors that influence the choice of a flexible or rigid borescope for use in a specific application, and some of the image sensors used in visual inspection.

Acoustical holography is the extension of holography into the ultrasonic domain. The basic systems for acoustical holography are the liquid-surface type and the scanning type. This article discusses the applications for acoustical holography, including inspection of large composite parts, through-transmission breast imaging system, inspection of welds in thick materials, and inspection of sleeve-bearing stock. It describes the basic system for liquid-surface acoustical holography and scanning acoustical holography. A comparison between these techniques is also provided.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

Part quality in additive manufacturing (AM) is highly dependent on process control, but there is a lack of adequate AM control methods and standards. Laser powder-bed fusion (L-PBF) is one of the most-used metal AM techniques. This article focuses on the following laser control parameters: laser focus, laser power, laser position, and laser power-position synchronization. It then provides a discussion on laser scan strategies. The article also provides an overview of the AM control framework, the two major sections of which are software and hardware.

This article discusses the fundamentals and operating principles of the following acoustic microscopy methods: scanning laser acoustic microscopy, C-mode scanning acoustic microscopy, and scanning acoustic microscopy. It describes the applications of acoustic microscopy for detecting defects in metals, ceramics, glasses, polymers, and composites with examples.

This article reviews photographic principles, namely, visual examination, field photographic documentation, and laboratory photographic documentation, as applied to failure analysis and the specific techniques employed in both the field and laboratory. It provides information on the photographic equipment used in failure analysis and on film and digital photography. The article describes the basics of photography and the uses of different types of lighting in photography of a fractured surface. The article also addresses the techniques involved in macrophotography and microscopic photography as well as other special techniques.

This article presents a basic overview of technology-driven advances in the imaging of primarily metallic fracture surfaces. It describes various types of microscopes, including scanning electron, dual-beam, ion source, and transmission electron microscopes, and their capabilities. It also covers other useful hardware, such as computer-aided tomography (CAT) and micro-computer-aided tomography (micro-CAT) instruments. The article introduces some of the fracture image postprocessing methods and software, including image registration or alignment, focus stacking, Z-stacking, focal plane merging, and image stitching.

Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.

This article is a compilation of definitions of terms related to materials characterization techniques.

This article discusses the advantages, disadvantages, applications, and selection criteria of various technologies and transduction modalities that can generate and detect ultrasonic waves. These include piezoelectric transducers, electromagnetic acoustic transducers (EMATs), laser ultrasound phased array transducers, magnetostriction transducers, and couplants. The article discusses four basic types of search units with piezoelectric transducers. These include the straight-beam contact type, the angle-beam contact type, the dual-element contact type, and the immersion type. The article concludes with information on immersion or contact type focused search units.

This article provides information on the basic components of a light microscope, including the illumination system, collector lens, and optical and mechanical components. It describes optical performance in terms of image aberrations, resolution, and depth of field. The article discusses the examination of specimen surfaces using polarized light, phase contrast, oblique illumination, dark-field illumination, bright-field illumination, interference-contrast illumination, and phase contrast illumination. Special techniques and devices that may be used with the optical microscope, to obtain additional information, are also described. The article concludes with information on photomicroscopy and macrophotography.