X-ray topography is the general term for a family of x-ray diffraction imaging techniques capable of providing information on the nature and distribution of imperfections. This article provides a detailed account of x-ray topography techniques, providing information on the historical background and development trends in x-ray diffraction topography. The discussion covers the general principles, components of systems, and applications of x-ray topography techniques, namely conventional X-ray topographic techniques and synchrotron x-ray topographic techniques.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

This article describes the structure of coatings produced by plasma spraying, vapor deposition, and electrodeposition processes. The main techniques used for microstructure assessment are introduced. The relationship between the microstructure and property is also discussed. The experimental techniques for microstructural characterization include metallographic technique, X-ray diffraction, electron, microscopies, and porosimetry.

This article focuses on the modes of operation, physical basis, sample requirements, properties characterized, advantages, and limitations of common characterization methods that are used to evaluate the physical morphology and chemical properties of component surfaces for medical devices. The methods include light microscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive x-ray spectroscopy, Auger electron spectroscopy, secondary ion mass spectrometry, x-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and Raman spectroscopy.

Quantitative image analysis has expanded the capabilities of surface analysis significantly with the use of computer technology. This article provides an overview of the quantitative image analysis and optical microscopy. It describes the various steps involved in surface preparation of samples prone to abrasion damage and artifacts for quantitative image analysis.

This article provides an overview of scanning probe microscopes (scanning tunneling microscope and atomic force microscope (AFM)), covering the various operating modes and probes used in these instruments and providing information on AFM instrumentation, applications, and analyses.

The characterization, testing, and nondestructive evaluation of ceramics and glasses are vital to manufacturing control, property improvement, failure prevention, and quality assurance. This article provides a broad overview of characterization methods and their relationship to property control, both in the production and use of ceramics and glasses. Important aspects covered include the means for characterizing ceramics and glasses, the corresponding rationale behind them, and relationship of chemistry, phases, and microconstituents to engineering properties. The article also describes the effects that the structure of raw ceramic materials and green products and processing parameters have on the ultimate structure and properties of the processed piece. The effects that trace chemistry and processing parameters have on glass properties are discussed. The article describes mechanical tests and failure analysis techniques used for ceramics.

Scanning electron microscopy (SEM) has unique capabilities for analyzing fracture surfaces. This article discusses the basic principles and practice of SEM, with an emphasis on its applications in fractography. The topics include an introduction to SEM instrumentation, imaging and analytical capabilities, specimen preparation, and the interpretation of fracture features. SEM can be subdivided into four systems, namely, illuminating/imaging, information, display, and vacuum systems. The article also describes the major criteria and techniques of SEM specimen preparation, and the general features of ductile and brittle fracture modes.

The application of transmission electron microscope to the study of fracture surfaces and related phenomena has made it possible to obtain magnifications and depths of field much greater than those possible with light (optical) microscopes. This article reviews the methods for preparing single-stage, double-stage, and extraction replicas of fracture surfaces. It discusses the types of artifacts and their effects on these replicas, and provides information on shadowing of replicas. The article concludes with a comparison of the transmission electron and scanning electron fractographs with illustrations.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

This article describes various evaluation techniques of fractography such as visual inspection, macroscopic and microscopic examinations that are used to resolve different aspects of failure. It gives a brief description and pictorial representation of various defects leading to fracture of metals, including laps, seams, cold shuts, cracks, inclusions, porosity, fatigue, and stress corrosion cracking.

Fractography is the systematic study of fractures and fracture surfaces. It is a useful tool in failure analysis and provides a means for correlating the influence of microstructure on the fracture mode of a given material. This article discusses the preservation, preparation, and photography of fractured parts and surfaces, and describes some of the more common fractographic features revealed by light microscopy, including tensile-fracture surface marks in unnotched specimens, fatigue marks, and structural discontinuities within the metal. The article also explains how to interpret fracture information contained in optical and scanning-electron microscope fractographs.

Failure analysis is a process of acquiring specified information regarding the appropriateness of the design of a part, the competence with which the various steps of its manufacture have been performed, any abuse suffered by it in packing and transportation, or the severity of service under which failure has occurred. Beginning with a discussion of the various stages of failure analysis of glass and ceramic materials, this article focuses on descriptive and quantitative fracture surface analysis techniques that are used in the examination of glass and surfaces created by fracture and the interpretation of the fracture markings seen on these surfaces. Details are provided for the procedures for locating fracture origins, determining direction of crack propagation, learning the sequence of crack propagation, deducing the stress state at the time of fracture, and observing interactions between crack fronts and inclusions, etc. A separate fractography terminology is provided in this article.

This article describes the methods and equipments involved in the preparation of specimens for examination by light optical microscopy, scanning electron microscopy, electron microprobe analysis for microindentation hardness testing, and for quantification of microstructural parameters, either manually or by the use of image analyzers. Preparation of metallographic specimens generally requires five major operations: sectioning, mounting, grinding, chemical polishing, and etching. The article provides information on the principles of technique selection in mechanical polishing, and describes the procedures, advantages, and disadvantages of electrolytic and chemical polishing. It also provides a detailed account of procedures, precautions, and composition for preparation and handling of etchants.

This article focuses on the principles and applications of high-sputter-rate dynamic secondary ion mass spectroscopy (SIMS) for depth profiling and bulk impurity analysis. It begins with an overview of various factors pertinent to sputtering. This is followed by a discussion on the effects of ion implantation and electronic excitation on the charge of the sputtered species. The design and operation of the various instrumental components of SIMS is then reviewed. Details on a depth-profiling analysis of SIMS, the quantitative analysis of SIMS data, and the static mode of operation of time-of-flight SIMS are covered. Instrumental features required for secondary ion imaging are presented and the differences between quadrupole and high-resolution magnetic mass filters are described. The article also reviews the optimum method for analysis of nonmetallic samples and high detection sensitivity of SIMS. It ends with a discussion on a variety of examples of SIMS applications.