This article describes the allotropic modification and atmospheric corrosion of pure tin. Corrosion of pure tin due to oxidation reaction, and reaction with the other gases, water, acids, bases, and other liquid media, is discussed. The article provides information on corrosion behavior on soft solders, pewter, bearing alloys, tin-copper alloys, and tin-silver alloys. It reviews the influence of corrosion on immersion tin coating, tin-cadmium alloy coatings, tin-cobalt coatings, tin-copper coatings, tin-lead coatings, tin-nickel coatings, and tin-zinc coatings. The general properties and corrosion resistance of tinplate are summarized. The article also describes the methods of corrosion testing of coatings; these include an analysis of coating thickness measurements, porosity and rust resistance testing, solderability test, and specific special tests.

This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

This article contains a table that lists the thermal conductivity of selected metals and alloys near room temperature. These include aluminum and aluminum alloys; copper and copper alloys; iron and iron alloys; lead and lead alloys; magnesium and magnesium alloys; nickel and nickel alloys; tin and tin alloys; titanium and titanium alloys; zinc and zinc alloys; and pure metals.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

This article is a compilation of binary alloy phase diagrams for which tin (Sn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings. It presents a short note on pure (unalloyed) tin and uses of tin in chemicals. The article also covers the compositions and uses of tin alloys which include solders, pewter, bearing alloys, alloys for organ pipes, and fusible alloys. It goes on to discuss the other alloys containing tin including battery grid alloys, type metals, copper alloys, dental alloys, cast irons, titanium alloys, and zirconium alloys. Finally, it presents a short note on the applications of tin powder and corrosion resistance of tin.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

This article is a compilation of ternary alloy phase diagrams for which lead (Pb) is the first-named element in the ternary system. The diagrams are presented with element compositions in weight percent. The article includes 7 phase diagrams: Pb-Sb-Sn liquidus projection; Pb-Sb-Sn isothermal section at 240 °C; Pb-Sb-Sn isothermal section at 189 °C; Pb-Sb-Sn (Pb) liquidus projection; Pb-Sn-Zn liquidus projection; and Pb-Sn-Zn isothermal section at 532 °C.

Selection of the process steps used, powder chosen, and lubricant choice have marked effects on the quality of a sintered component. This article describes the alloy composition, mechanical and structural properties, processing routes, and advantages of the common members of the copper alloy family, namely, pure copper, brass, and bronze, which all aid in the selection of the suitable material for structural and bearing applications. It outlines the structural applications of nickel silver alloys.

Copper and copper alloys are used extensively in structural applications in which they are subject to moderately elevated temperatures. At relatively low operating temperatures, these alloys can undergo thermal softening or stress relaxation, which can lead to service failures. This article is a collection of curves and tables that present data on thermal softening and stress-relaxation in copper and copper alloys. Thermal softening occurs over extended periods at temperatures lower than those inducing recrystallization in commercial heat treatments. Stress relaxation occurs because of the transformation of elastic strain in the material to plastic, or permanent strain.

This article describes the different types of precipitation and transformation processes and their effects that can occur during heat treatment of various nonferrous alloys. The nonferrous alloys are aluminum alloys, copper alloys, magnesium alloys, nickel alloys, titanium alloys, cobalt alloys, zinc alloys, and heat treatable silver alloys, gold alloys, lead alloys, and tin alloys. It also provides a detailed discussion on the effects due to precipitation and transformation processes in these non-ferrous alloys.

This article focuses on the process design set-up procedure for brazing and soldering. It provides a detailed account of the types of base metals that can be joined by these processes, and reviews the factors to be considered to enhance the joint design. Criteria for selection of the right induction heating equipment to carry out the brazing or soldering operation are also provided. The article describes the types of brazing filler metals and joint designs. It also presents the types of inspection methods, namely, mechanical and visual, used to determine the quality of the brazed joint. Important considerations for the automation of induction-heated brazing applications are also discussed. The article concludes by emphasizing the need for documenting an in-control process which is a vitally important reference for questions or problems arising in the machine settings or part quality.

This article focuses on the use of noble and precious metals for biomedical applications. These include gold, platinum, palladium, ruthenium, rhodium, iridium, and osmium. The physical and mechanical properties of noble and precious metals are presented in tables. A brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical applications. It also provides information on gold coatings and iridium oxide coatings for stents.

A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article discusses the properties of bearing materials. It provides information on bearing material systems: single-metal systems, bimetal systems, and trimetal systems. The article describes the designations, nominal compositions, mechanical properties, and applications of various sliding bearing alloys: tin-base alloys, lead-base alloys, copper-base alloys, aluminum-base alloys, silver-base alloys, zinc-base alloys, additional metallic materials, nonmetallic materials. It describes casting processes, powder metallurgy processes, and electroplating processes. The article also discusses the selection criteria for bearing materials.

A sliding bearing (plain bearing) is a machine element designed to transmit loads or reaction forces to a shaft that rotates relative to the bearing. This article explains the role of wear damage mechanisms in the design and selection of bearing materials, and its relationship with bearing material properties. Sliding bearings are commonly classified by terms that describe their application; they also are classified according to material construction, as single-metal, bimetal, or trimetal sliding bearings. The article further provides detailed tabular data on the designation and composition of the following types of bearing materials: tin-base alloys, lead-base alloys, copper-base alloys, and aluminum-base alloys. It also briefly discusses the following types of bearing materials: zinc-base alloys, silver-base alloys, gray cast irons, cemented carbides, and nonmetallic bearing materials.

This article is a compilation of binary alloy phase diagrams for which ytterbium (Yb) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article describes dental alloy compositions and its properties. It discusses the safety and efficacy considerations of dental alloy devices. The article defines and compares interstitial fluid and oral fluid environments. Artificial solutions developed for the testing and evaluation of dental materials are summarized. The article examines the effects of restoration contact on electrochemical parameters and reviews the concentration cells developed by dental alloy-environment electrochemical reactions. The composition and characterization of biofilms, corrosion products, and other debris that deposit on dental material surfaces are discussed. The article evaluates the types of alloys available for dental applications, including direct filling alloys, crown and bridge alloys, partial denture alloys, porcelain fused to metal alloys, wrought wire alloys, soldering alloys, and implant alloys. The effects of composition and microstructure on the corrosion of each alloy group are also discussed. The article concludes with information on the tarnishing and corrosion behavior of these alloys.