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Published: 09 June 2014
Fig. 4 Constitutional diagram for the tin-lead alloy system. Source: Ref 2 More
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Published: 01 January 1986
Fig. 13 Dept profiles of the oxidized surface of the tin-lead alloy. (a) Sample was oxidized at 10 −5 torr of oxygen. (b) Sample was oxidized in air. More
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Published: 01 January 1993
Fig. 3 Constitutional diagram for the tin-lead alloy system More
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Published: 01 January 2003
Fig. 10 Effect of tin on internal resistance of lead alloys or lead grids with a tin-rich coating during overcharge conditions in a lead-acid battery. Source: Ref 10 More
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Published: 01 December 2008
Fig. 2 Influence of alloy composition on fluidity in lead-tin alloys. Source: Ref 2 More
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Published: 01 December 2004
Fig. 7 Classic example of eutectic system in lead-tin alloys. Diagram contains the more scientifically useful atomic %. Weight % is shown at the top. Source: Ref 2 , 3 More
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Published: 01 December 2004
Fig. 1 Very soft metals; alloys of lead and tin. (a) and (b) A near-eutectic soft solder (63% Sn, 37% Pb; hardness, 9 HV). A globular eutectic of tin phase (light) and lead phase (dark). (c) and (d) A linotype metal (4% Sn, 12% Sb, 84% Pb; hardness, 26 HV). Primary lead dendrite in a ternary More
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Published: 31 December 2017
Fig. 3 Type I microstructure present in lead and tin Babbitt bearing alloys. (a) Schematic showing discrete hard particles dispersed in a soft matrix that is bonded to a steel backing. (b) Micrograph of a lead-base Babbitt in which lead is present in the dark phase and antimony in the light More
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
... Abstract In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses...
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Published: 27 April 2016
Source: K. Osamura, The Pb-Sb-Sn (Lead-Antimony-Tin) System, Bull. Alloy Phase Diagrams , Vol 6, 1985, p 372–379 ( Ref 2 ) More
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Published: 27 April 2016
Source: K. Osamura, The Pb-Sb-Sn (Lead-Antimony-Tin) System, Bull. Alloy Phase Diagrams , Vol 6, 1985, p 372–379 ( Ref 2 ) More
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Published: 27 April 2016
Source: K. Osamura, The Pb-Sb-Sn (Lead-Antimony-Tin) System, Bull. Alloy Phase Diagrams , Vol 6, 1985, p 372–379 ( Ref 2 ) More
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Published: 01 December 2004
Fig. 38 From top: electroplated 0.013 mm (0.0005 in.) overlay of lead-tin alloy (SAE 191), sintered copper-lead alloy (SAE 49) liner, and steel backing. See also Fig. 39 . NH 4 OH + H 2 O 2 . Original magnification 100× More
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Published: 01 December 2004
Fig. 40 From top: electroplated overlay of lead-tin-copper alloy (SAE 192), electroplated brass barrier layer (see Fig. 41 for better detail), sintered copper-lead alloy liner (SAE 49), and steel backing strip (bottom). NH 4 OH + H 2 O 2 . Original magnification 100× More
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Published: 01 December 2004
Fig. 44 Similar to Fig. 42 , except the lead-tin-copper alloy overlay was electroplated on the copper-lead alloy liner (SAE 48) shown in Fig. 50 , which first had been nickel electroplated. NH 4 OH + H 2 O 2 . Original magnification 100× More
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Published: 01 January 1986
Fig. 33 Electropolished section of a lead-tin eutectic alloy. Secondary electron detector image. 630 × More
Book Chapter

Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration...
Book Chapter

By Reginald K. Asher, Sr.
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... alloy plating tin-bismuth plating tin-lead plating tin-nickel plating tin-zinc plating wear resistance ELECTRODEPOSITION of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. Four types of tin alloys are available...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
..., when compared with tin-lead alloys. Tin plate is sometimes used as a protective finish on device leads and terminations, although a solder dip coating is the preferred finish. Tin-base tin-lead solders represent the most widely used solders for electronic assembly: eutectic 63Sn-37Pb, near-eutectic...