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Image
Published: 09 June 2014
Image
Dept profiles of the oxidized surface of the tin-lead alloy. (a) Sample was...
Available to PurchasePublished: 01 January 1986
Fig. 13 Dept profiles of the oxidized surface of the tin-lead alloy. (a) Sample was oxidized at 10 −5 torr of oxygen. (b) Sample was oxidized in air.
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Image
Published: 01 January 1993
Image
Effect of tin on internal resistance of lead alloys or lead grids with a ti...
Available to PurchasePublished: 01 January 2003
Fig. 10 Effect of tin on internal resistance of lead alloys or lead grids with a tin-rich coating during overcharge conditions in a lead-acid battery. Source: Ref 10
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Published: 01 December 2008
Image
Classic example of eutectic system in lead-tin alloys. Diagram contains the...
Available to Purchase
in Physical Metallurgy Concepts in Interpretation of Microstructures
> Metallography and Microstructures
Published: 01 December 2004
Fig. 7 Classic example of eutectic system in lead-tin alloys. Diagram contains the more scientifically useful atomic %. Weight % is shown at the top. Source: Ref 2 , 3
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Image
Very soft metals; alloys of lead and tin. (a) and (b) A near-eutectic soft ...
Available to PurchasePublished: 01 December 2004
Fig. 1 Very soft metals; alloys of lead and tin. (a) and (b) A near-eutectic soft solder (63% Sn, 37% Pb; hardness, 9 HV). A globular eutectic of tin phase (light) and lead phase (dark). (c) and (d) A linotype metal (4% Sn, 12% Sb, 84% Pb; hardness, 26 HV). Primary lead dendrite in a ternary
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Image
Type I microstructure present in lead and tin Babbitt bearing alloys. (a) S...
Available to PurchasePublished: 31 December 2017
Fig. 3 Type I microstructure present in lead and tin Babbitt bearing alloys. (a) Schematic showing discrete hard particles dispersed in a soft matrix that is bonded to a steel backing. (b) Micrograph of a lead-base Babbitt in which lead is present in the dark phase and antimony in the light
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Book Chapter
Corrosion in the Assembly of Semiconductor Integrated Circuits
Available to PurchaseSeries: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
... Abstract In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article...
Abstract
In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.
Book Chapter
Corrosion and Related Phenomena in Portable Electronic Assemblies
Available to PurchaseSeries: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses...
Abstract
This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.
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Published: 27 April 2016
Source: K. Osamura, The Pb-Sb-Sn (Lead-Antimony-Tin) System, Bull. Alloy Phase Diagrams , Vol 6, 1985, p 372–379 ( Ref 2 )
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Image
Published: 27 April 2016
Source: K. Osamura, The Pb-Sb-Sn (Lead-Antimony-Tin) System, Bull. Alloy Phase Diagrams , Vol 6, 1985, p 372–379 ( Ref 2 )
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Image
Published: 27 April 2016
Source: K. Osamura, The Pb-Sb-Sn (Lead-Antimony-Tin) System, Bull. Alloy Phase Diagrams , Vol 6, 1985, p 372–379 ( Ref 2 )
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Image
From top: electroplated 0.013 mm (0.0005 in.) overlay of lead-tin alloy (SA...
Available to PurchasePublished: 01 December 2004
Fig. 38 From top: electroplated 0.013 mm (0.0005 in.) overlay of lead-tin alloy (SAE 191), sintered copper-lead alloy (SAE 49) liner, and steel backing. See also Fig. 39 . NH 4 OH + H 2 O 2 . Original magnification 100×
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From top: electroplated overlay of lead-tin-copper alloy (SAE 192), electro...
Available to PurchasePublished: 01 December 2004
Fig. 40 From top: electroplated overlay of lead-tin-copper alloy (SAE 192), electroplated brass barrier layer (see Fig. 41 for better detail), sintered copper-lead alloy liner (SAE 49), and steel backing strip (bottom). NH 4 OH + H 2 O 2 . Original magnification 100×
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Image
Published: 01 December 2004
Fig. 44 Similar to Fig. 42 , except the lead-tin-copper alloy overlay was electroplated on the copper-lead alloy liner (SAE 48) shown in Fig. 50 , which first had been nickel electroplated. NH 4 OH + H 2 O 2 . Original magnification 100×
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Image
Electropolished section of a lead-tin eutectic alloy. Secondary electron de...
Available to PurchasePublished: 01 January 1986
Fig. 33 Electropolished section of a lead-tin eutectic alloy. Secondary electron detector image. 630 ×
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Book Chapter
Metallography and Microstructures of Tin and Tin Alloys
Available to PurchaseSeries: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration...
Abstract
This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... alloy plating tin-bismuth plating tin-lead plating tin-nickel plating tin-zinc plating wear resistance ELECTRODEPOSITION of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. Four types of tin alloys are available...
Abstract
Electrodeposition of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. This article focuses on the compositions, operating conditions, advantages, and limitations of methane sulfonic acid plating solutions and fluoborate plating solutions for tin-lead. It briefly describes the solution compositions and operating conditions of tin-bismuth, tin-nickel, and tin-zinc.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
..., when compared with tin-lead alloys. Tin plate is sometimes used as a protective finish on device leads and terminations, although a solder dip coating is the preferred finish. Tin-base tin-lead solders represent the most widely used solders for electronic assembly: eutectic 63Sn-37Pb, near-eutectic...
Abstract
Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.
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