Tin is produced from both primary and secondary sources. This article discusses the chemical compositions, production, properties, microstructure and applications of tin and tin alloys. The major tin alloys discussed here are tin-antimony-copper alloy (pewter), bearing alloy, solder alloy and other alloys containing traces of tin. Data on tin consumption in the United States is presented graphically.

This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems.

This article describes the various specimen preparation procedures for lead, lead alloys, and sleeve bearings, including sectioning, mounting, grinding, polishing, and etching. The microscopic examination and microstructures of lead and lead alloys are discussed. The article also provides information on the microstructures of sleeve bearing materials.

This article discusses the processing, properties, and applications of various grades of lead and lead-base alloys with the aid of several tables and illustrations. It lists the Unified Numbering System (UNS) designations for various pure lead grades and lead-base alloys grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest usage of lead is in the lead acid storage batteries (in the grid plates, posts, and connector straps). Other applications include ammunition; cable sheathing; cast products such as type metals, terneplates, and foils; and building construction materials. Lead is also used as an alloying element in steel and in copper alloys to improve machinability and other characteristics. In many applications, lead is combined with stronger materials to make structures that have the best qualities of both materials such as the plumbum series.

This article is a compilation of ternary alloy phase diagrams for which lead (Pb) is the first-named element in the ternary system. The diagrams are presented with element compositions in weight percent. The article includes 7 phase diagrams: Pb-Sb-Sn liquidus projection; Pb-Sb-Sn isothermal section at 240 °C; Pb-Sb-Sn isothermal section at 189 °C; Pb-Sb-Sn (Pb) liquidus projection; Pb-Sn-Zn liquidus projection; and Pb-Sn-Zn isothermal section at 532 °C.

Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings. It presents a short note on pure (unalloyed) tin and uses of tin in chemicals. The article also covers the compositions and uses of tin alloys which include solders, pewter, bearing alloys, alloys for organ pipes, and fusible alloys. It goes on to discuss the other alloys containing tin including battery grid alloys, type metals, copper alloys, dental alloys, cast irons, titanium alloys, and zirconium alloys. Finally, it presents a short note on the applications of tin powder and corrosion resistance of tin.

The properties of copper alloys occur in unique combinations found in no other alloy system. This article focuses on the major and minor alloying additions and their impact on the properties of copper. It describes major alloying additions, such as zinc, tin, lead, aluminum, silicon, nickel, beryllium, chromium, and iron. The article discusses minor alloying additions, including antimony, bismuth, selenium, manganese, and phosphorus. Copper alloys can be cast by many processes, including sand casting, permanent mold casting, precision casting, high-pressure die casting, and low-pressure die casting. The article provides information on the types of copper castings and tabulates the nominal chemical composition and mechanical properties of several cast alloys.

This article discusses the properties, primary and secondary production, product forms and applications of various grades of lead and lead-base alloys with the aid of several tables and illustrations. It lists the Unified Numbering System (UNS) designations for various pure lead grades and lead-base alloys grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest use of lead is in lead-acid storage batteries. Other applications include ammunition, cable sheathing, cast products such as type metals, terneplate, foils, and building construction materials. Lead is also used as an alloying element in steel and in copper alloys to improve machinability. The article concludes with information on the principles of lead corrosion, corrosion resistance of lead in water, atmospheres, underground ducts, soil and chemicals.

This article contains a table that lists the thermal conductivity of selected metals and alloys near room temperature. These include aluminum and aluminum alloys; copper and copper alloys; iron and iron alloys; lead and lead alloys; magnesium and magnesium alloys; nickel and nickel alloys; tin and tin alloys; titanium and titanium alloys; zinc and zinc alloys; and pure metals.

This article reviews the melt processing and casting of non-ferrous alloys, such as nickel alloys, titanium alloys, and lead alloys. It describes the lead refining steps, namely, copper drossing, softening, desilvering, zinc removal, bismuth removal, and final refining.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

This article discusses the various heat treating processes, namely, solid-solution hardening, solution treating, solution aging and dispersion hardening, for low-melting-point alloys such as lead alloys, tin-rich alloys, and zinc alloys. Heat treating of tin-rich alloys has been practiced for bearing alloys, pewterware, and organ pipe alloys. The article reviews the principles underlying these applications.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

This article is a compilation of binary alloy phase diagrams for which tin (Sn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article is a compilation of binary alloy phase diagrams for which antimony (Sb) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article presents a table that lists the linear thermal expansion of selected metals and alloys. These include aluminum, copper, iron, lead, magnesium, nickel, tin, titanium, and zinc and their alloys. Thermal expansion is presented for specific temperature ranges.

This article is a compilation of binary alloy phase diagrams for which strontium (Sr) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article contains a table that lists the density of metals and alloys. It presents information on aluminum, copper, iron, lead, magnesium, nickel, tin, titanium, and zinc, an their respective alloys. Information on wrought alloys, permanent magnet materials, precious metals, and rare earth metals is also listed.

This article is a compilation of binary alloy phase diagrams for which zinc (Zn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.