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Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003818
EISBN: 978-1-62708-183-2
... Abstract This article describes the allotropic modification and atmospheric corrosion of pure tin. Corrosion of pure tin due to oxidation reaction, and reaction with the other gases, water, acids, bases, and other liquid media, is discussed. The article provides information on corrosion...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... Abstract This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003145
EISBN: 978-1-62708-199-3
... Abstract Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001076
EISBN: 978-1-62708-162-7
...Physical, thermal, electrical, and optical properties of commercially pure tin Table 1 Physical, thermal, electrical, and optical properties of commercially pure tin Property Value Physical properties Atomic number 50 Atomic weight 118.69 Crystal structure α phase or β...
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006207
EISBN: 978-1-62708-163-4
... Abstract This article is a compilation of binary alloy phase diagrams for which tin (Sn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... Abstract Electrodeposition of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. This article focuses on the compositions, operating conditions, advantages, and limitations of methane sulfonic acid plating solutions...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001250
EISBN: 978-1-62708-170-2
... Abstract A tin deposit provides sacrificial protection to copper, nickel, and many other nonferrous metals and alloys. Tin also provides good protection to steel. Tin can be deposited from either alkaline or acid electrolytes. This article explains the compositions and operating conditions...
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Published: 01 December 1998
Fig. 6 Effect of density on the strength of copper-tin and copper-tin-graphite compacts More
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Published: 30 August 2021
Fig. 4 Copper-tin (Cu 6 Sn 5 ) and silver-tin (Ag 3 Sn) intermetallic compound morphology in a solder ball More
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Published: 01 January 2005
Fig. 1 Gray tin transformation on pure tin. Both samples were stored at −20 °C (−4 °F), but the sample on the left was bent at this temperature, and the other was left undisturbed. More
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Published: 01 January 1986
Fig. 104 Dark-field micrograph of TiN precipitates in Ti-6Al-4V implanted with 2 × 10 17 N/cm 2 at 75 keV. Source: Ref 102 More
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Published: 01 January 1986
Fig. 23 As-polished copper-tin diffusion couple sample. (a) Secondary electron detector image. (b) Backscattered electron detector image taken with a solid-state wide angle detector, 20 keV, and original magnification of 1190× More
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Published: 01 January 1986
Fig. 33 Electropolished section of a lead-tin eutectic alloy. Secondary electron detector image. 630 × More
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Published: 01 January 1986
Fig. 34 Location of the crystallographic growth axes of tin plates (small circles) and the plate interface plane traces (line through small circles) from large grains of several experiments. More
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Published: 01 January 1986
Fig. 13 Dept profiles of the oxidized surface of the tin-lead alloy. (a) Sample was oxidized at 10 −5 torr of oxygen. (b) Sample was oxidized in air. More
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Published: 01 January 1986
Fig. 15 Depth profile of a nickel-tin alloy showing that the surface does not contain nickel. More
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Published: 01 January 2002
Fig. 9 X-ray elemental dot maps for copper and tin taken at three typical areas exhibiting penetration of the bearing elements. The three regions shown in the specimen current images (left) were quantitatively analyzed for copper and tin; results are given under the concentration maps. All 320× More
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Published: 01 January 2002
Fig. 9 Morphology of cracks leading to rolling-contact fatigue failure of PVD (TiN) coatings. (a) Crack parallel to the interface leading to spalled area for hard substrate (60 HRC) TiN coating. (b) Cracks parallel to the coating-substrate interface for hard substrate (60 HRC) TiN coating. (c More
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Published: 31 October 2011
Fig. 14 Effect of peak temperature and precipitate (TiN) coarsening on austenite grain growth in the heat-affected zone of a titanium-microalloyed steel. The points in the diagram are experimental data, whereas the curves are calculated. Source: Ref 4 More
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Published: 01 December 2008
Fig. 3 Copper-tin phase diagram More