Search Results for tarnish films removal

This article discusses the procedures used for pickling nickel and nickel alloys. Nickel alloys can be divided into four groups: high-nickel alloys, nickel-copper alloys, nickel-chromium alloys, and nickel-iron-chromium alloys. Alloys within each composition group that has similar surface conditions are pickled in the same solutions using the same procedures. The article discusses three different surface conditions for pickling these nickel alloys: bright annealed white surface requiring removal of tarnish by flash pickling; bright annealed oxidized surface requiring removal of a layer of reduced oxide, sometimes followed by a flash pickle to brighten; and black or dark-colored surface requiring removal of adherent oxide film or scale. The article also reviews specialized pickling operations of nickel alloys and various cleaning and finishing operations, including grinding, polishing, buffing, brushing, and blasting.

This article reviews cleaning and finishing operations that have proven to be effective on titanium, its alloys, and semi-fabricated titanium products. It explains how to remove scale, tarnish films, grease, and other soils and how to achieve required finishes and/or improve wear and oxidation resistance through the use of polishing, buffing, and wire brushing operations. The article also covers a wide range of surface modification and coating processes, including ion implantation, diffusion, chemical and physical vapor deposition, plating, anodizing, and chemical conversion coatings as well as sprayed and sol-gel coatings and laser and electron-beam treatments.

Although stainless steel is naturally passivated by exposure to air and other oxidizers, additional surface treatments are needed to prevent corrosion. Passivation, pickling, electropolishing, and mechanical cleaning are important surface treatments for the successful performance of stainless steel. This article describes the surface treatment of stainless steels including abrasive blast cleaning, acid pickling, salt bath descaling, passivation treatments, electropolishing, and the necessary coating processes involved. It also describes the surface treatment of heat-resistant alloys including metallic contaminant removal, tarnish removal, oxide and scale removal, finishing, and coating processes.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.

This article describes the methods for removing metallic contaminants, tarnish, and scale resulting from hot-working or heat-treating operations on nickel-, cobalt-, and iron-base heat-resistant alloys. It provides a brief description of applicable finishing and coating processes, including polishing, electroplating, ceramic coatings, diffusion coatings, and shot-peening. The article presents numerous examples that identify cleaning and finishing problems and the procedures used to solve them.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

This article describes dental alloy compositions and its properties. It discusses the safety and efficacy considerations of dental alloy devices. The article defines and compares interstitial fluid and oral fluid environments. Artificial solutions developed for the testing and evaluation of dental materials are summarized. The article examines the effects of restoration contact on electrochemical parameters and reviews the concentration cells developed by dental alloy-environment electrochemical reactions. The composition and characterization of biofilms, corrosion products, and other debris that deposit on dental material surfaces are discussed. The article evaluates the types of alloys available for dental applications, including direct filling alloys, crown and bridge alloys, partial denture alloys, porcelain fused to metal alloys, wrought wire alloys, soldering alloys, and implant alloys. The effects of composition and microstructure on the corrosion of each alloy group are also discussed. The article concludes with information on the tarnishing and corrosion behavior of these alloys.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article discusses surface engineering of nonferrous metals including aluminum and aluminum alloys, copper and copper alloys, magnesium alloys, nickel and nickel alloys, titanium and titanium alloys, zirconium and hafnium, zinc alloys, and refractory metals and alloys. It describes various techniques to improve functional surface properties and enhance the appearance of product forms. The article discusses various cleaning and finishing techniques such as abrasive blast cleaning, polishing and buffing, barrel burnishing, chemical cleaning, pickling, etching and bright dipping, electrochemical cleaning, mechanical cleaning, and mass finishing. It also examines coating processes such as plating, anodizing, chemical conversion coating, and thermal spray, and concludes with a discussion on oxidation-resistant coatings for refractory metals.

Electrical contacts are metal devices that make and break electrical circuits. This article describes the property requirements such as electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties of make-break arcing contacts. The article also focuses on brush contact materials and their interdependence factors for sliding contacts. In addition, the article discusses the properties, manufacturing methods, and applications of electrical contact materials, including wrought materials such as copper metals, silver metals, gold metals, precious metal overlays, tungsten, molybdenum, and aluminum, and composite materials. It concludes by discussing the composite manufacturing methods such as infiltration, press-sinter, press-sinter-repress process, press-sinter-extrude process, internal oxidation, and preoxidized-press-sinter-extrude process, and coprecipitation.

A tin deposit provides sacrificial protection to copper, nickel, and many other nonferrous metals and alloys. Tin also provides good protection to steel. Tin can be deposited from either alkaline or acid electrolytes. This article explains the compositions and operating conditions of these electrolytes.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.

This article describes several factors, which help in determining the compressibility of metal powders: particle shape, density, composition, hardness, particle size, lubrication, and compacting. It discusses the uses of annealing metal powders and describes compressibility testing of the powders. The article details green strength and its mechanism and the variables affecting the strength. It also discusses two test methods for determining the green strength: the Rattler test and the transverse bend test.

Electrical contacts are metal devices that make and break electrical circuits. This article provides information on materials selection criteria and failure modes of make-break contacts. It describes the property requirements for make-break arcing contacts, namely, electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties. The article presents a brief note on brush contact materials and their interdependence factors for sliding contacts. It also describes the type of commercial contact materials for electrical contacts, namely, copper metals, silver metals, gold metals, metals of the platinum group, precious metal overlays, tungsten and molybdenum, aluminum, and composite materials. Finally, the article provides information on composite manufacturing methods, and tabulates the physical, and mechanical properties of electrical contact materials, including copper, silver, gold, platinum, palladium, and composites.

Emulsion cleaning is an industrial cleaning process that uses an organic solvent as the main active agent. This article provides information on the applications, concerns and limitations, and process parameters of emulsion cleaning. It describes the processing variables and equipment for three main stages of emulsion cleaning: immersion cleaning, secondary cleaning, and spray cleaning. In addition, the classifications, composition, and selection criteria are also discussed.

Stress-corrosion cracking (SCC) is a phenomenon in which time-dependent crack growth occurs when the necessary electrochemical, mechanical, and metallurgical conditions exist. This article provides an overview of the environmental phenomenon, mechanisms, and controlling parameters of SCC. It describes the phenomenological and mechanistic aspects of the initiation and propagation of SCC. The article includes a phenomenological description of crack initiation and propagation that describes well-established experimental evidence and observations of stress corrosion. Discussions on mechanisms describe the physical process involved in crack initiation and propagation. The article also includes information on dissolution models and mechanical fracture models.

This article presents a general survey of corrosive agents and processes that exist within what are usually considered the protective environments of museums and historic collections. It reviews the corrosion influencing factors, such as humidity, temperature, and light. The article provides a list of pollutants and their sources in museums and collections. It discusses the sources of corrosion, including plastic and wood, sulfur, and carbonyl compounds. The article describes the preservation steps for materials in museum to eliminate the corrosive sources acting on the objects and to avoid other potentially damaging materials.