This article describes the historical background, uncertainties in structural parameters, classifications, and application areas of probabilistic analysis. It provides a discussion on the basic definition of random variables, some common distribution functions used in engineering, selection of a probability distribution, the failure model definition, and a definition of the probability of failure. The article also explains the solution techniques for special cases and general solution techniques, such as first-second-order reliability methods, the advanced mean value method, the response surface method, and Monte Carlo sampling. A brief introduction to importance sampling, time-variant reliability, system reliability, and risk analysis and target reliabilities is also provided. The article examines the various application problems for which probabilistic analysis is an essential element. Examples of the use of probabilistic analysis are presented. The article concludes with an overview of some of the commercially available software programs for performing probabilistic analysis.

Various powder production processes allow precise control of the chemical composition and physical characteristics of powders and allow tailoring of specific attributes for targeted applications. Metal powders are produced by either mechanical methods or chemical methods. The commonly used mechanical methods include water and gas atomization, milling, mechanical alloying, and electrolysis. Some chemical methods include reduction of oxides. This article provides information on the reliable techniques for powder characterization and testing to evaluate the chemical and physical properties of metal powders, both as individual particles and in bulk forms.

Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering. It discusses the function of the blind laser soldering and provides a brief description on key attributes of the blind laser soldering, including repeatability, speed, quality, safety, and flexibility. The article explores the function of the intelligent laser soldering and concludes with a section on key attributes of the intelligent laser soldering. The key attributes of the intelligent laser soldering include repeatability, speed, quality, safety, cost, and flexibility.

There are two parts to deal with uncertainty in fatigue design: determining the distributions of possible values for all uncertain inputs and calculating the probability of failure due to all the uncertain inputs. This article discusses the sources of uncertainty in a fatigue analysis, such as the material properties, distribution of applied stress levels within a given environment, environments or loading intensities, and modeling or prediction. It presents a probabilistic approach for analyzing the uncertainties and determining the level of reliability (probability of failure).

This article addresses problems, such as “in spec” dilemma and on-target key, associated with traditional approaches to quality. It discusses major robust design techniques, tools, and concepts, such as quality loss function, parameter design, tolerance design, signal-to-noise ratio, technology development, and orthogonal arrays.

Temperature control in heat treating is of paramount importance in maintaining the quality and achieving the desired metallurgical results. This article provides a detailed account of the factors affecting temperature control in heat treating furnaces, with information on temperature control systems, including contact sensors, noncontact sensors, controllers, energy-flow regulators, measurement instruments, and set-point programmers. Common contact sensors include temperature scales, thermocouples, and resistance temperature detectors, whereas optical pyrometers and on-line radiation thermometers fall under the noncontact type. The article describes two types of instrumentation used in heat treating: field test instruments for temperature-uniformity surveys and system-accuracy tests; and controlling, monitoring, and recording instruments for digital instrumentation.

This article is a brief account of low-energy ion-scattering spectroscopy (LEIS) for determining the atomic structure of solid surfaces. It begins with a description of the general principles of LEIS. This is followed by a section providing information on the equipment used for LEIS. Various steps involved in the sample preparation, calibration, and data analysis are then discussed. The article concludes with a section on the applications and interpretation of LEIS in material analysis, including discussion on surface structural analysis, layer-by-layer (Frank-van der Merwe) growth, and low-energy atom-scattering spectroscopy.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.

This article provides the theoretical background for understanding many of the physical processes relevant to mechanical testing methods, experimental results, and analytical approaches described in this volume.

This article provides a detailed account of particle-induced x-ray emission (PIXE), covering the basic principles of PIXE analysis and calibration and quality-assurance protocols employed. A comparative study on PIXE and x-ray fluorescence is then presented. The article also discusses the applications of PIXE in atmospheric physics and chemistry, external proton milliprobes and historical analysis, and PIXE microprobes.

This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.

Particle-induced x-ray emission (PIXE) is one of several quantitative analyses based on characteristic x-rays. This article provides a detailed account on the principles of PIXE, discussing the data-reduction codes used to identify, integrate, and reduce x-ray peaks into elemental concentrations. It provides information on the calibration of PIXE analysis, which is mostly performed using gravimetric standards to avoid serious absorption, refluorescence, or ion energy change corrections. A comparative study on PIXE and x-ray fluorescence is also included. Finally, the article discusses the applications of PIXE in three areas, namely, atmospheric physics and chemistry, external proton milliprobes and historical analysis, and PIXE microprobes.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

This article provides an introduction to x-ray spectrometry, and discusses the role of electromagnetic radiation, x-ray emission, and x-ray absorption. It focuses on the instrumentation of wavelength-dispersive x-ray spectrometers, and energy dispersive x-ray spectrometers (EDS) that comprise x-ray tubes, the analyzing system, and detectors. The fundamentals of EDS operation are described. The article also provides useful information on preparation of various samples, explaining the qualitative and quantitative analyses of EDS. It reviews the applications of the x-ray spectrometry.

Reliability-centered maintenance (RCM) is a systematic methodology for preventing failures. This article begins by discussing the history of RCM and uses Society of Automotive Engineers (SAE) all-industry standard JA1011 as its model to describe the key characteristics of an RCM process. It then expands on questions involved in RCM process, offering definitions when necessary. Next, the article describes the approach of RCM to failure modes and effects analysis (FMEA), the failure management policies available under RCM, and the criteria of RCM for deciding when a specific failure management policy is technically feasible. Then, after discussing the ways that RCM classifies failure effects in terms of consequences, it describes how RCM uses failure consequences to identify the best failure management policy for each failure mode. Next, the building blocks of RCM are put together to create a failure management program. The article ends with a discussion on some practical issues pertaining to RCM that lie outside the scope of SAE JA1011.

Impact tests are used to study dynamic deformation and failure modes of materials. This article discusses low-velocity impact experiments in single-stage gas guns. It describes surface velocity measurements with laser interferometric techniques. The article details plate impact soft-recovery experiments, pressure-shear friction experiments, and low-velocity penetration experiments. It reviews two types of plate impact soft-recovery experiments: normal plate impact and pressure-shear plate impact experiments. The article provides information on low-velocity penetration experiments, which include the setup for direct penetration experiment (rod-on-plate) and the reverse penetration experiment (plate-on-rod). It also considers high-temperature plate impact testing and impact techniques with in-material stress and velocity measurements.

The success of a reliable non-destructive evaluation (NDE) application depends greatly on the expertise and thoroughness of the NDE engineering that is performed. This article discusses the general considerations of NDE in terms of NDE response and NDE system management and schedule. It describes the NDE engineering and NDE process control, along with some case studies related to the applications of NDE. The article reviews various models for predicting NDE reliability, such as ultrasonic inspection model, eddy current inspection model, and radiographic inspection model. It concludes with an example that illustrates the integration of an ultrasonic reliability model with a CAD system.

This article endeavors to familiarize the reader with a selection of different ionization designs and instrument components to provide knowledge for sorting the various analytical strategies in the field of solid analysis by mass spectrometry (MS). It begins with a description of the general principles of MS. This is followed by sections providing a basic understanding of instrumentation and discussing the operating requirements as well as practical considerations related to solid sample analysis by MS. Instrumentation discussed include the triple quadrupole mass spectrometer and the time-of-flight mass spectrometer. Inductively coupled plasma and thermal ionization MS provide atomic information, and direct analysis in real-time and matrix-assisted laser-desorption ionization MS are used to analyze molecular compositions. The article describes various factors pertinent to ionization methods, namely glow discharge mass spectrometry and secondary ion mass spectrometry. It concludes with a section on various examples of applications and interpretation of MS for various materials.

Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.

Reliability-centered maintenance (RCM) is a systematic methodology for preventing failures. This article discusses the history of RCM and describes the key characteristics of an RCM process, which involves asking seven questions. The first four questions comprise a form of failure modes and effects analysis (FMEA), and therefore, the article explains the approach of RCM to FMEA and the failure management policies available under RCM. It reviews the ways that RCM classifies failure effects in terms of consequences and details how RCM uses failure consequences to identify the best failure management policy for each failure mode. The article concludes with a discussion on some practical issues pertaining to RCM that lie outside the scope of SAE JA1011.