Search Results for surface-mount technology

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.

Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article presents an introduction to brazing, including information on its mechanics, advantages, and limitations. It reviews soldering with emphasis on chronology, solder metals, and flux technology. The article also provides useful information on mass, wave, and drag soldering. It presents a table which contains information on the comparison of soldering, brazing, and welding.

Hot gas soldering is a process that is commonly used in applications where the workpiece thermal mass is small and the melting temperature of the solder is relatively low. This article describes the characteristics of hot gas heating that are critical to its effectiveness in soldering. These characteristics include the focus of gas flow, gas flow rates (velocity and volume), gas temperature, and typical gas media. The article explains the thermal profile of a component being soldered and the temperature across adjacent components, which helps to understand time-temperature relationship. It concludes with a discussion on reliability concerns and processing concerns when using hot gas soldering in electronics assembly.

Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

This article focuses on the sample preparation methods for titanium honeycomb composites, boron fiber composites, and titanium/polymeric composite hybrids. These include mounting, sectioning, grinding, and polishing. The article also provides information on the sample preparation of unstaged and staged prepreg materials for optical analysis.

This article reviews how process variations influence the characteristics of thermal spray coatings. It describes various specimen preparation techniques, which allow accurate microstructural analysis. These techniques include sectioning, cleaning, mounting, planar grinding, fine grinding, rough polishing, and etching. The article provides information on the problems associated with specimen preparation. It concludes with a discussion on the various methods of analysis for thermal spray coatings.

This article provides information on the microstructure of powder metal alloys and the special handling requirements of porous materials. It covers selection, sectioning, mounting, grinding, and polishing, and describes procedures, such as washing, liquid removal, and impregnation, meant to preserve pore structures and keep them open for analysis. The article compares and contrasts the microstructures of nearly 50 powder metal alloys, using them to illustrate the effect of consolidation and compaction methods as well as particle size, composition, and shape. It discusses imaging equipment and techniques and provides data on etchants and etching procedures.

Lightning damage in polymer composites is manifested by damage at both the macroscopic or visual level and within the material microstructure. This article illustrates the effects of the laboratory-generated lightning strikes on polymeric composites.

This article is dedicated to the fields of mechanical engineering and machine design. It also intends to give a nonexhaustive view of the preventive side of the failure analysis of rolling-element bearings (REBs) and of some of the developments in terms of materials and surface engineering. The article presents the nomenclature, numbering systems, and worldwide market of REBs as well as provides description of REBs as high-tech machine components. It discusses heat treatments, performance, and properties of bearing materials. The processes involved in the examination of failed bearings are also explained. Finally, the article discusses in detail the characteristics and prevention of the various types of failures of REBs: wear, fretting, corrosion, plastic flow, rolling-contact fatigue, and damage. The article includes an Appendix, which lists REB-related abbreviations, association websites, and ISO standards.

Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use requirements and joint configurations required for the formation of a good soldered joint. It focuses on the visual, automatic, and destructive inspection techniques for determining overall joint quality.

Archaeometallurgists use metallography to reveal and interpret the microstructures of objects, in conjunction with the results of their chemical analyses and microanalyses. This article describes a number of special problems that occur while performing metallographic analyses on archaeological materials. It also presents case studies, with examples that illustrate situations where metallography has contributed to archaeometallurgical studies.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

This article provides a discussion on the metallographic techniques used for failure analysis, and on fracture examination in materials, with illustrations. It discusses various metallographic specimen preparation techniques, namely, sectioning, mounting, grinding, polishing, and electrolytic polishing. The article also describes the microstructure examination of various materials, with emphasis on failure analysis, and concludes with information on the examination of replicas with light microscopy.

Ultrasonic cleaning involves the use of high-frequency sound waves that is above the upper range of human heating, or about 18 kHz, to remove a variety of contaminants from parts immersed in aqueous media. This article describes the process, design considerations and the equipment in ultrasonic cleaning. The components used in the generation of ultrasonic wave include piezoelectric and magnetostrictive transducers that are used in ultrasonic generators and tanks. The effects of solution type and its temperature on the effectiveness of ultrasonic cleaning are also discussed.

This article covers in-line process monitoring of the metal additive manufacturing (AM) methods of laser and electron beam (e-beam) powder-bed fusion (PBF) and directed-energy deposition (DED). It focuses on methods that monitor the component directly throughout the build process. This article is organized by the type of AM process and by the physics of the monitoring method. The discussion covers two types of monitoring possible with the PBF process: monitoring the area of the powder bed and component and monitoring the melt pool created by the laser or e-beam. Methods for layer monitoring include optical and thermal methods that monitor light reflected or emitted in the visible and infrared wavelengths, respectively. Monitoring methods for laser directed-energy deposition (DED) discussed are those that measure the size and shape of the melt pool, the temperature of the melt pool, and the plasma generated by the laser as it interacts with the molten metal.