This article discusses the capabilities and limitations of various material characterization methods that assist in the selection of a proper analytical tool for analyzing particulate materials. Commonly used methods are microanalysis, surface analysis, and bulk analysis. The techniques used for performing microanalysis include scanning electron microscopy and electron probe X-ray microanalysis. The article describes surface analysis techniques, including Auger electron spectroscopy, X-ray photoelectron spectroscopy, and ion-scattering spectroscopy. Bulk analysis techniques, such as X-ray powder diffraction, inductively coupled plasma atomic emission spectroscopy, atomic absorption spectroscopy, and atomic fluorescence spectrometry, are also discussed.

This article focuses on the modes of operation, physical basis, sample requirements, properties characterized, advantages, and limitations of the characterization methods used to evaluate the physical morphology and chemical properties of component surfaces for medical devices. These methods include light microscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, Auger electron spectroscopy, secondary ion mass spectrometry, X-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and Raman spectroscopy.

As additive manufacturing (AM) gains maturity as a manufacturing technique for production in many industrial sectors, inspection as a tool for quality control gains importance. This article is focused on the field of dimensional metrology, which is typically concerned with the verification of size, location, form, and surface topography of geometric features. This is split into two categories: geometric (size, location, form) and surface measurement (topography). The article also focuses on applicable inspection technologies, and it discusses the context within digital thread manufacturing. A case study on the Digital Inspection Requirements Enhancing Coverage and Traceability (DIRECT) is also presented.

This article provides information on the chemical characterization of surfaces by Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). It describes the basic theory behind each of these techniques, the types of data produced from each, and some typical applications. The article explains the strengths of AES, XPS, and TOF-SIMS based on data obtained from the surface of a slightly corroded stainless steel sheet.

This article covers the three most popular techniques used to characterize the very outermost layers of solid surfaces: Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Some of the more important attributes are listed for preliminary insight into the strengths and limitations of these techniques for chemical characterization of surfaces. The article describes the basic theory behind each of the different techniques, the types of data produced from each, and some typical applications. Also discussed are the different types of samples that can be analyzed and the special sample-handling procedures that must be implemented when preparing to do failure analysis using these surface-sensitive techniques. Data obtained from different material defects are presented for each of the techniques. The examples presented highlight the typical data sets and strengths of each technique.

This article provides a general introduction of materials characterization and describes the principles and applications of a limited number of techniques that are most commonly used to characterize the composition and structure of metals used in engineering systems. It briefly describes the classification of materials characterization methods including, bulk elemental characterization, bulk structural characterization, microstructural characterization, and surface characterization. Further, the article reviews the selection of materials characterization methods most commonly used with metals.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article uses metal and alloy powders as examples to briefly discuss how to perform the characterization of powders. It begins by reviewing some of the techniques involved in the sampling of powders to ensure accurate characterization. This is followed by a discussion on the important properties to characterize powders, namely the particle size, surface area, density, porosity, particle hardness, compressibility, green strength, and flowability. For characterization of powders, both individual particles and bulk powders are used to evaluate their physical and chemical properties. The article also discusses the important characteristics and compositions of powder as well as impurities that directly affect powder properties. It ends with a description of the ignition and dust-explosion characteristics of organic and metal powders.

Ultraviolet/visible (UV/VIS) absorption spectroscopy is a powerful yet cost-effective tool that is widely used to identify organic compounds and to measure the concentration of principal and trace constituents in liquid, gas, and solid test samples. This article emphasizes the quantitative analysis of elements in metals and metal-bearing ores. The instrumentation required for such applications consists of a light source, a filter or wavelength selector, and some type of visual or automated sensing mechanism. The article examines common sensing options and provides helpful information on how to set up and run a variety of UV/VIS absorption tests.

This article introduces the principles of Raman spectroscopy and the representative materials characterization applications to which Raman spectroscopy has been applied. It includes a discussion of light-scattering fundamentals and a description of the experimental aspects of the technique. Emphasis has been placed on the different instrument approaches that have been developed for performing Raman analyses on various materials. The applications presented in the article reflect the breadth of materials characterization uses for Raman spectroscopy and highlight the analysis of bulk material and of surface and near-surface species.

This article introduces the principles of Raman spectroscopy and the representative materials characterization applications to which Raman spectroscopy has been applied. A discussion on light-scattering fundamentals and a description of the experimental aspects of the technique are included. Emphasis is placed on the different instrument approaches that have been developed for performing Raman analyses on various materials. The applications presented reflect the breadth of materials characterization uses for Raman spectroscopy and highlight the analysis of bulk material and of surface and near-surface species.

This article discusses several purposes and types of materials characterization techniques. Some of the factors to be considered when selecting appropriate characterization methods are described. The article also presents the scope and organization of this volume.

This article describes the characterization of welds as a sequence of procedures, where each procedure is concerned with a finer scale of detail. The first level of characterization involves information that may be obtained by direct visual inspection and measurement of the weld. The article discusses nondestructive evaluation of welds by encompassing techniques that are used to characterize the locations and structure of internal and surface defects, including radiography, ultrasonic testing, and liquid penetrant inspection. It reviews the macrostructural characterization of a sectioned weld, including features such as number of passes; weld bead size, shape, and homogeneity; and the orientation of beads in a multipass weld. The article provides examples that describe how welds are characterized according to the procedures.

Optical metallography, one of the most common materials characterization techniques, uses visible light to magnify structural features of interest. This article discusses the use of optical methods to evaluate micro and macrostructure and relate it to process conditions and material behavior. It covers the steps involved in sample preparation, including sectioning, mounting, grinding, polishing, and etching, and presents several examples of macro and microanalysis on various metals and alloys.

This article describes testing and characterization methods of ceramics for chemical analysis, phase analysis, microstructural analysis, macroscopic property characterization, strength and proof testing, thermophysical property testing, and nondestructive evaluation techniques. Chemical analysis is carried out by X-ray fluorescence spectrometry, atomic absorption spectrophotometry, and plasma-emission spectrophotometry. Phase analysis is done by X-ray diffraction, spectroscopic methods, thermal analysis, and quantitative analysis. Techniques used for microstructural analysis include reflected light microscopy using polarized light, scanning electron microscopy, transmission electron microscopy, energy dispersive analysis of X-rays, and wavelength dispersive analysis of X-rays. Macroscopic property characterization involves measurement of porosity, density, and surface area. The article describes testing methods such as room and high-temperature strength test methods, proof testing, fracture toughness measurement, and hardness and wear testing. It also explains methods for determining thermal expansion, thermal conductivity, heat capacity, and emissivity of ceramics and glass and measurement of these properties as a function of temperature.