This article describes the eight chemical cleaning methods, namely, circulation, fill and soak, cascade, foam, vapor-phase organic, steam-injected, on-line chemical, and mechanical cleaning. It presents information on deposit types, solvents used to remove them, and construction material incompatibilities in a table. The article summarizes the uses of chemical cleaning solutions, including hydrochloric acid, phosphoric acid, and sulfamic acid, as well as the additives used to neutralize their impact on corrosion. It discusses the chemical cleaning procedures, including selection of cleaning method and solvent, documentation of cleaning, and corrosion monitoring in chemical cleaning.

Lead has been deposited from a variety of electrolytes, including fluoborates, fluosilicates, sulfamates, and methane sulfonic acid baths. This article provides a discussion on these electrolytic baths and includes information on the process sequence, equipment requirements, and applications of lead plating.

This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

The electroplating of platinum-group metals (PGMs) from aqueous electrolytes for engineering applications is limited principally to palladium and, to a lesser extent, to platinum, rhodium, and thin layers of ruthenium. This article provides a discussion on the plating operations of these PGMs along with the types of anodes used in the process.

This article is a compilation of color etchants that have been developed for a limited number of metals and alloys. It describes the optical methods for producing color, such as polarized light and differential interference contrast, with illustrations. The article discusses film formation and interference techniques such as anodizing, chemical etching, and tint etching. It provides a description of reagents that deposit sulfide films and molybdate films. The article concludes with a discussion on the thermal and vapor deposition methods to produce color.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.