Copper and copper alloys are used extensively in structural applications in which they are subject to moderately elevated temperatures. At relatively low operating temperatures, these alloys can undergo thermal softening or stress relaxation, which can lead to service failures. This article is a collection of curves and tables that present data on thermal softening and stress-relaxation in copper and copper alloys. Thermal softening occurs over extended periods at temperatures lower than those inducing recrystallization in commercial heat treatments. Stress relaxation occurs because of the transformation of elastic strain in the material to plastic, or permanent strain.

This article provides the theoretical background for understanding many of the physical processes relevant to mechanical testing methods, experimental results, and analytical approaches described in this volume.

This article discusses stress relaxation testing on metallic materials, as covered by ASTM E 328. It reviews the two types of stress relaxation tests performed in tension, long-term and accelerated testing. The article illustrates load characteristics and data representation for stress relaxation testing used for the most convenient and common uniaxial tensile test. It concludes with information on compression testing, bend testing, torsion testing, and tests on springs.

This article describes the general aspects of creep, stress relaxation, and yielding for homogeneous polymers. It then presents creep failure mechanisms in polymers. The article discusses extrapolative methods for the prediction of long-term creep failure in polymer materials. Then, the widely used models to simulate the service life of polymers are highlighted. These include the Burgers power-law model, the Findley power-law model, the time-temperature superposition (or equivalence) principle (TTSP), and the time-stress superposition principle (TSSP). The Larson-Miller parametric method, one of the most common to describe the material deformation and rupture time, is also discussed.