Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article focuses on transport phenomena and modeling approaches that are specific to vapor-phase processes (VPP). It discusses the VPP for the synthesis of materials. The article reviews the basic notions of molecular collisions and gas flows, and presents transport equations. It describes the modeling of vapor-surface interactions and kinetics of hetereogeneous processes as well as the modeling and kinetics of homogenous reactions in chemical vapor deposition (CVD). The article provides information on the various stages of developing models for numerical simulation of the transport phenomena in continuous media and transition regime flows of VPP. It explains the methods used for molecular modeling in computational materials science. The article also presents examples that illustrate multiscale simulations of CVD or PVD processes and examples that focus on sputtering deposition and reactive or ion beam etching.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

Soft-interlayer solid-state welds that join stronger base metals have unique mechanical properties that are of fundamental interest and may be of critical importance to designers. This article discusses the mechanical properties of soft-interlayer solid-state welds and the implications of these behaviors to service stress states and environments. It describes the tensile loading of soft-Interlayer welds in terms of the effect of interlayer thickness on stress, interlayer strain, time-dependent failure, effect of base-metal properties, and effect of interlayer fabrication method. The article concludes with a discussion on multiaxial loading.

This article discusses the mechanical properties of soft-interlayer solid-state welds and the implications of these behaviors to service stress states and environments. It illustrates the microstructure of as-deposited coatings and solid-state-welded interlayers. The article reviews factors that affect the tensile loading of strength of soft-interlayer welds: the interlayer thickness, the interlayer strain, and the interlayer fabrication method. It also provides information on stress-corrosion cracking of interlayers and stress behavior of these interlayers during shear and multiaxial loading.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.