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sputter deposition

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Book Chapter

By S.L. Rohde
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001288
EISBN: 978-1-62708-170-2
... on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005434
EISBN: 978-1-62708-196-2
..., combining a macroscale finite-element model (FEM) and a ballistic transport and reaction model at the feature scale. A third FEM mesoscale model is used to link both scales. Source: Ref 186 . (c) Monte Carlo simulation of sputtered-aluminum deposition on a 0.025 mm trench. Source: Ref 159 . (d) Molecular...
Book Chapter

Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003685
EISBN: 978-1-62708-182-5
...Abstract Abstract Vapor-deposition processes fall into two major categories, namely, physical vapor deposition (PVD) and chemical vapor deposition (CVD). This article describes major deposition processes such as sputtering, evaporation, ion plating, and CVD. The list of materials that can...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001290
EISBN: 978-1-62708-170-2
... information on deposition and synthesis of inorganic compounds by IBAD and concludes with a discussion on the improved coating properties, advantages, limitations, and applications of IBAD. coating properties dual-ion-beam sputtering energy utilization film formation modes film-vacuum interface...
Series: ASM Handbook
Volume: 4A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v04a.a0005808
EISBN: 978-1-62708-165-8
... with operating systems. This article provides a brief discussion on the various conventional surface-modification techniques to enhance the surface and mechanical properties of ferrous and nonferrous alloys. The techniques are physical vapor deposition, chemical vapor deposition, sputtering, ion plating...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001352
EISBN: 978-1-62708-173-3
... ), and planar-magnetron (PM) sputtering ( Ref 30 , 31 , 32 , 33 ). Prior to deposition, the surface oxide layer may require removal from the base metal in order to achieve adequate adhesion of the silver. The surface oxide layer is usually removed by chemical- or sputter-etching methods. One advantage...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005556
EISBN: 978-1-62708-174-0
... interlayers fabricated using planar-magnetron sputter deposition and electrodeposition, compared with Ag-4Pd brazed interlayers Fig. 3 Finite-element method analysis of the effect of t / d on the radial stress distribution at the center plane for silver interlayer welds between non-plastically...
Book Chapter

By Donald M. Mattox
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001289
EISBN: 978-1-62708-170-2
... particles leaving a source ( Ref 5 , 6 ). This differentiation is important when using sputtering as a source for deposition because reflected high-energy neutrals from the target can have an important effect on the growing film. Figure 1 shows the distance traveled by particles of differing masses (12...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... deposition (PVD) film can be understood by understanding the film formation process. The formation of a useful and commercially attractive engineered surface using any PVD process (vacuum deposition, sputter deposition, or ion plating) involves several stages: Choice of the substrate (“real surface...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006436
EISBN: 978-1-62708-192-4
... properties of titanium alloys. These include physical vapor deposition and thermochemical conversion treatments. The physical vapor deposition includes ion implantation, sputtering, evaporation, and ion plating surface modification treatments. The thermochemical conversion surface treatments include...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005707
EISBN: 978-1-62708-171-9
... to gas turbine blades and vanes. The materials deposited by evaporation include pure metals and alloys from single or multiple sources and inorganic compounds either directly or by reaction, including the following: The advantages of sputter coating include: Some of the many applications...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003749
EISBN: 978-1-62708-177-1
...× Fig. 22 Titanium alloy brazed with an aluminum-silicon brazing alloy. As-polished and vapor deposited with zirconium dioxide. 500×. (R. Crouse) Fig. 24 Interference-layer micrograph of a cast Sn-18Ag-15Cu alloy. Polished specimen coated with a platinum oxide layer by reactive sputtering...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001113
EISBN: 978-1-62708-162-7
... and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003022
EISBN: 978-1-62708-200-6
... deposition processes ( Fig. 7 ) include vacuum evaporation, where thermally vaporized material reaches the substrate without collision in the gas phase; sputter deposition, where physically removed particles may or may not experience gas phase collisions before they reach the substrate surface; ion...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003219
EISBN: 978-1-62708-199-3
...Abstract Abstract Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003219
EISBN: 978-1-62708-199-3
... Abstract Physical vapor deposition (PVD) coatings are harder than any metal and are used in applications that cannot tolerate even microscopic wear losses. This article describes the three most common PVD processes: thermal evaporation, sputtering, and ion plating. It also discusses ion...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006377
EISBN: 978-1-62708-192-4
... 0.055 161.8 323.2 0.076 MoS 2 /Ni (95wt% MoS 2 /5wt%Ni) −66.0 −86.8 0.100 2.6 7.4 × 10 −6 1.1 × 10 −6 −30.2 −22.4 0.087 26.8 80.2 0.084 176.0 348.8 0.047 Note: Five ~2 μm thick co-sputtered or pulsed-laser-deposited coatings containing primarily MoS 2 : friction...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006360
EISBN: 978-1-62708-192-4
... structure (e.g., WC/a-C:H) Common industrial coating material due to ability to sputter deposit adherent interlayers in situ, moderate to high hardness, low elastic modulus, consistent low friction, good wear resistance 160–200 320–390 1–4 39–158 10–20 1.5–2.9 100–200 14.5–29.0 0.1–0.3 a-C:H:X...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003836
EISBN: 978-1-62708-183-2
... ·6H 2 O at 30±1 °C (85 ±2 °F). The corrosion rate was estimated from weight loss during immersion for 168 h. Source: Ref 79 Fig. 6 Sputter-deposited chromium-niobium and chromium-tantalum alloys. (a) Corrosion rates of alloys compared to pure chromium, niobium, and tantalum. (b...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001287
EISBN: 978-1-62708-170-2
...: The Relationship of Structure to Properties Symposium , Aita C.R. and Sreeharsha K.S. , Ed., MRS Symp. Proc. , Vol 47 , MRS Publications , 1985 , p 41 13. Pergellis A.N. , Evaporation and Sputtering Substrate Heating Dependence on Deposition Rate , J. Vac. Sci. Technol. A , Vol 7...