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Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005838
EISBN: 978-1-62708-167-2
... Abstract This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers, and various...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005856
EISBN: 978-1-62708-167-2
... Abstract This article focuses on the process design set-up procedure for brazing and soldering. It provides a detailed account of the types of base metals that can be joined by these processes, and reviews the factors to be considered to enhance the joint design. Criteria for selection...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005841
EISBN: 978-1-62708-167-2
..., channel (slot), pancake, hairpin, butterfly, split-return, or internal coils. It discusses the variables pertinent to the design of inductors for brazing, soldering, or heat treating. The article presents various considerations for designing inductors for brazing of dissimilar materials that present...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... Abstract Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most...
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006079
EISBN: 978-1-62708-175-7
... Abstract Metals and alloy powders are used in welding, hardfacing, brazing, and soldering applications, which include hardface coatings, the manufacturing of welding stick electrodes and flux-cored wires, and additives in brazing pastes or creams. This article reviews these applications...
Series: ASM Handbook
Volume: 1A
Publisher: ASM International
Published: 31 August 2017
DOI: 10.31399/asm.hb.v01a.a0006302
EISBN: 978-1-62708-179-5
... Abstract Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.9781627081733
EISBN: 978-1-62708-173-3
Book Chapter

By Roy E. Beal
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001396
EISBN: 978-1-62708-173-3
... Abstract Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. This article provides an overview of dip soldering, its applications, and the equipment used. The article also provides information on the safety measures to be taken by production personnel when...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001397
EISBN: 978-1-62708-173-3
... Abstract Resistance soldering (RS) can be applied to electrically conductive materials that allow the passage of electric current. The process can be used for selective spot soldering of small components, for the soldering of closely placed parts on an assembly, or for heat restriction when...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001398
EISBN: 978-1-62708-173-3
... Abstract Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering. It discusses...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001399
EISBN: 978-1-62708-173-3
... Abstract Hot gas soldering is a process that is commonly used in applications where the workpiece thermal mass is small and the melting temperature of the solder is relatively low. This article describes the characteristics of hot gas heating that are critical to its effectiveness in soldering...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001400
EISBN: 978-1-62708-173-3
... Abstract This article describes resistivity effects and Curie temperature effects on coupling efficiency during induction heating in the soldering operation. It discusses the effects of workpiece geometry during the induction heating. The practices associated with the use of preplaced solder...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... Abstract This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001402
EISBN: 978-1-62708-173-3
... Abstract Vapor-phase soldering is a process of condensation heating in which the product prepared for soldering is passed through or into a layer of saturated vapor. This article provides an overview of the soldering process with emphasis on its applications and the equipment used...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article...
Book Chapter

By Mark Cowell
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001393
EISBN: 978-1-62708-173-3
... Abstract This article provides information on soldering iron and the most common soldering iron tip. It describes the classifications of hand soldering equipment based on its temperature control method. These are constant-voltage, variable temperature, and tip-temperature-controlled soldering...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001394
EISBN: 978-1-62708-173-3
... Abstract Torch soldering utilizes a fuel gas flame as the heat source in the soldering process to produce a leak-tight assembly with some degree of mechanical strength. This article describes the advantages, limitations, and applications of torch soldering. It reviews the equipment used...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001395
EISBN: 978-1-62708-173-3
... Abstract Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001450
EISBN: 978-1-62708-173-3
... Abstract This article focuses on the various criteria considered in the selection of product forms, joint types, solders, and filler metals for brazing and soldering of base material components. brazing brazing filler metals joints material selection soldering solders...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... Abstract Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure...