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soldering
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Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... Abstract Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure...
Abstract
Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).
Series: ASM Handbook
Volume: 1A
Publisher: ASM International
Published: 31 August 2017
DOI: 10.31399/asm.hb.v01a.a0006302
EISBN: 978-1-62708-179-5
... Abstract Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common...
Abstract
Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common advantages of both brazing and soldering. It describes the brazing and soldering of cast irons, as well as the selection of brazing filler material. The article discusses various brazing methods: torch brazing, induction brazing, salt-bath brazing, and furnace brazing. It concludes with information on the application examples of brazing of cast iron.
Book: Powder Metallurgy
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006079
EISBN: 978-1-62708-175-7
... Abstract Metals and alloy powders are used in welding, hardfacing, brazing, and soldering applications, which include hardface coatings, the manufacturing of welding stick electrodes and flux-cored wires, and additives in brazing pastes or creams. This article reviews these applications...
Abstract
Metals and alloy powders are used in welding, hardfacing, brazing, and soldering applications, which include hardface coatings, the manufacturing of welding stick electrodes and flux-cored wires, and additives in brazing pastes or creams. This article reviews these applications and the specific powder properties and characteristics they require.
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005856
EISBN: 978-1-62708-167-2
... Abstract This article focuses on the process design set-up procedure for brazing and soldering. It provides a detailed account of the types of base metals that can be joined by these processes, and reviews the factors to be considered to enhance the joint design. Criteria for selection...
Abstract
This article focuses on the process design set-up procedure for brazing and soldering. It provides a detailed account of the types of base metals that can be joined by these processes, and reviews the factors to be considered to enhance the joint design. Criteria for selection of the right induction heating equipment to carry out the brazing or soldering operation are also provided. The article describes the types of brazing filler metals and joint designs. It also presents the types of inspection methods, namely, mechanical and visual, used to determine the quality of the brazed joint. Important considerations for the automation of induction-heated brazing applications are also discussed. The article concludes by emphasizing the need for documenting an in-control process which is a vitally important reference for questions or problems arising in the machine settings or part quality.
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005841
EISBN: 978-1-62708-167-2
..., channel (slot), pancake, hairpin, butterfly, split-return, or internal coils. It discusses the variables pertinent to the design of inductors for brazing, soldering, or heat treating. The article presents various considerations for designing inductors for brazing of dissimilar materials that present...
Abstract
Inductors used for brazing can be machined from solid copper shapes or fabricated out of copper tubing, depending on the size and complexity of the braze joint geometry to be heated. This article provides information on inductors (coils) that are generally classified as solenoid, channel (slot), pancake, hairpin, butterfly, split-return, or internal coils. It discusses the variables pertinent to the design of inductors for brazing, soldering, or heat treating. The article presents various considerations for designing inductors for brazing of dissimilar materials that present a unique challenge in the field of induction brazing.
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005838
EISBN: 978-1-62708-167-2
... Abstract This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers, and various...
Abstract
This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers, and various switching devices, namely, silicon-controlled rectifiers, insulated-gate bipolar transistors, and metal-oxide semiconductor field-effect transistors. The article also provides information on frequency-multiplication harmonic-induction power supplies, namely, push-pull and half-bridge inverters and full-bridge inverters. Series resonant and parallel resonant circuits and their tuning calculations associated with output networks are also discussed. The article describes the frequency range of simultaneous dual-frequency induction heating power supply, and discusses the advantages, applications, and technical background of independently controlled frequency and power (IFP) induction heating power supply. It concludes with a description of the developments in control systems for modern induction power supplies.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... Abstract Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most...
Abstract
Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... Abstract Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters...
Abstract
Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001344
EISBN: 978-1-62708-173-3
... Abstract This article presents an introduction to brazing, including information on its mechanics, advantages, and limitations. It reviews soldering with emphasis on chronology, solder metals, and flux technology. The article also provides useful information on mass, wave, and drag soldering...
Abstract
This article presents an introduction to brazing, including information on its mechanics, advantages, and limitations. It reviews soldering with emphasis on chronology, solder metals, and flux technology. The article also provides useful information on mass, wave, and drag soldering. It presents a table which contains information on the comparison of soldering, brazing, and welding.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... Abstract Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base...
Abstract
Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001396
EISBN: 978-1-62708-173-3
... Abstract Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. This article provides an overview of dip soldering, its applications, and the equipment used. The article also provides information on the safety measures to be taken by production personnel when...
Abstract
Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. This article provides an overview of dip soldering, its applications, and the equipment used. The article also provides information on the safety measures to be taken by production personnel when operating solder pots.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001397
EISBN: 978-1-62708-173-3
... Abstract Resistance soldering (RS) can be applied to electrically conductive materials that allow the passage of electric current. The process can be used for selective spot soldering of small components, for the soldering of closely placed parts on an assembly, or for heat restriction when...
Abstract
Resistance soldering (RS) can be applied to electrically conductive materials that allow the passage of electric current. The process can be used for selective spot soldering of small components, for the soldering of closely placed parts on an assembly, or for heat restriction when necessary. This article explains that the RS process can be used in all soldering operations and with all solderable metals. It provides information on the applications, preassembly practices, the equipment used and the training required for soldering personnel.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001398
EISBN: 978-1-62708-173-3
... Abstract Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering. It discusses...
Abstract
Laser soldering uses a well-focused, highly controlled beam to deliver energy to a desired location for a precisely measured length of time. This article focuses on two types of laser soldering operations, namely, blind laser soldering and intelligent laser soldering. It discusses the function of the blind laser soldering and provides a brief description on key attributes of the blind laser soldering, including repeatability, speed, quality, safety, and flexibility. The article explores the function of the intelligent laser soldering and concludes with a section on key attributes of the intelligent laser soldering. The key attributes of the intelligent laser soldering include repeatability, speed, quality, safety, cost, and flexibility.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001399
EISBN: 978-1-62708-173-3
... Abstract Hot gas soldering is a process that is commonly used in applications where the workpiece thermal mass is small and the melting temperature of the solder is relatively low. This article describes the characteristics of hot gas heating that are critical to its effectiveness in soldering...
Abstract
Hot gas soldering is a process that is commonly used in applications where the workpiece thermal mass is small and the melting temperature of the solder is relatively low. This article describes the characteristics of hot gas heating that are critical to its effectiveness in soldering. These characteristics include the focus of gas flow, gas flow rates (velocity and volume), gas temperature, and typical gas media. The article explains the thermal profile of a component being soldered and the temperature across adjacent components, which helps to understand time-temperature relationship. It concludes with a discussion on reliability concerns and processing concerns when using hot gas soldering in electronics assembly.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001400
EISBN: 978-1-62708-173-3
... Abstract This article describes resistivity effects and Curie temperature effects on coupling efficiency during induction heating in the soldering operation. It discusses the effects of workpiece geometry during the induction heating. The practices associated with the use of preplaced solder...
Abstract
This article describes resistivity effects and Curie temperature effects on coupling efficiency during induction heating in the soldering operation. It discusses the effects of workpiece geometry during the induction heating. The practices associated with the use of preplaced solder are reviewed. The article provides useful information on setup parameters and safety concerns for the use of induction heating.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... Abstract This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information...
Abstract
This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001402
EISBN: 978-1-62708-173-3
... Abstract Vapor-phase soldering is a process of condensation heating in which the product prepared for soldering is passed through or into a layer of saturated vapor. This article provides an overview of the soldering process with emphasis on its applications and the equipment used...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article...
Abstract
Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001393
EISBN: 978-1-62708-173-3
... Abstract This article provides information on soldering iron and the most common soldering iron tip. It describes the classifications of hand soldering equipment based on its temperature control method. These are constant-voltage, variable temperature, and tip-temperature-controlled soldering...
Abstract
This article provides information on soldering iron and the most common soldering iron tip. It describes the classifications of hand soldering equipment based on its temperature control method. These are constant-voltage, variable temperature, and tip-temperature-controlled soldering irons. The article also reviews the selection criteria of the soldering iron.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001394
EISBN: 978-1-62708-173-3
... Abstract Torch soldering utilizes a fuel gas flame as the heat source in the soldering process to produce a leak-tight assembly with some degree of mechanical strength. This article describes the advantages, limitations, and applications of torch soldering. It reviews the equipment used...
Abstract
Torch soldering utilizes a fuel gas flame as the heat source in the soldering process to produce a leak-tight assembly with some degree of mechanical strength. This article describes the advantages, limitations, and applications of torch soldering. It reviews the equipment used and the basic heating techniques required for the soldering.
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