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soldered joints

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Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001479
EISBN: 978-1-62708-173-3
... Abstract Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003831
EISBN: 978-1-62708-183-2
... Abstract Corrosion is often thought of as rusting, the process of deterioration undergone by a metal when it is exposed to air or water. This article provides the fundamentals of joints corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered joints...
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Published: 01 January 1993
Fig. 6 X-ray laminography image of soldered joints and a leadless ceramic SMD More
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Published: 01 January 1993
Fig. 7 Soldered joint between a SMD copper lead and a copper pad, as-soldered condition More
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Published: 09 June 2014
Fig. 5 Typical solder joint design. Source: Ref 2 More
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Published: 01 January 2006
Fig. 2 Tin dendrites growing between two adjacent solder joints on failed printed circuit board. See the article “Corrosion in Passive Electrical Components” in this Volume. More
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Published: 01 January 1993
Fig. 6 Shear strength of copper/56Sn-44Pb/copper solder joints as a function of joint thickness. Source: Ref 12 More
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Published: 01 January 1993
Fig. 15 Common structural solder joints More
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Published: 01 January 1993
Fig. 8 Single-sided, double-sided, and multilayer solder joint configurations for through-hole technology More
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Published: 01 January 1993
Fig. 10 Progression of fatigue damage in a through-hole solder joint (optical microscopy and SEM). Source: Ref 7 More
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Published: 01 January 1993
Fig. 13 Fatigue cracks in surface-mount solder joints. (a) Leadless capacitor. (b) Leadless ceramic chip carrier. (c) J-leaded package. (d) Gullwing leaded package (SEM). (e) Cracking in a leadless ceramic chip resistor solder fillet. Source: Ref 7 More
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Published: 01 January 1993
Fig. 2 Preferred solder joint for a surface-mount assembly. Source: IPC-A-610 More
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Published: 01 January 1993
Fig. 5 Solder joint image from a structured-light, three-dimensional vision system More
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Published: 01 January 1993
Fig. 8 Soldered joint between a SMD copper lead and a copper pad. Aged for 12 weeks at 125 °C (255 °F) More
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Published: 01 January 1993
Fig. 8 Methods that can be used to make solder joints self-jigging. Source: Ref 5 More
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Published: 01 January 1993
Fig. 2 Theoretical signature of a typical good solder joint More
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Published: 01 January 1996
Fig. 25 Multiple-sample log normal probability plots of solder joints in MDS test of ceramic quad flat package. (a) Pad I; solder volumes 1 and 2. (b) Pad II; solder volumes 2 and 3. (c) Pad III, solder volumes 3 and 4. Source: Ref 1 More
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Published: 01 January 2006
Fig. 36 SEM micrograph of a corroded stainless steel-silver soldered joint after immersion in a 1% H 2 O 2 solution. Source: Ref 194 More
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Published: 01 January 2006
Fig. 23 Tin dendrites growing between two adjacent solder joints on failed printed circuit board More
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Published: 01 June 2012
Fig. 48 SEM image of broken coil wire at catheter solder joint More