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soldered joints

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Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003831
EISBN: 978-1-62708-183-2
... Abstract Corrosion is often thought of as rusting, the process of deterioration undergone by a metal when it is exposed to air or water. This article provides the fundamentals of joints corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered joints and...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001479
EISBN: 978-1-62708-173-3
... Abstract Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
..., including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing. capacitors electronic applications packaged integrated circuits resistors solder joint...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001492
EISBN: 978-1-62708-173-3
... Abstract This article describes the factors considered in the analysis of brazeability and solderability of engineering materials. These are the wetting and spreading behavior, joint mechanical properties, corrosion resistance, metallurgical considerations, and residual stress levels. It...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... 0.48876 13,898 0.33654 HASL, Hot air solder leveled; OCC, organic coating on copper Fig. 25 Multiple-sample log normal probability plots of solder joints in MDS test of ceramic quad flat package. (a) Pad I; solder volumes 1 and 2. (b) Pad II; solder volumes 2 and 3. (c) Pad III, solder...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001478
EISBN: 978-1-62708-173-3
... Soldering Manual 008 R.J. Klein Wassink, Soldering in Electronics , 2nd ed., 1989 B2.2 Standard for Brazing Procedure and Performance Qualification ANSI/AWS C3.2 Standard Method for Evaluating the Strength of Brazed Joints in Shear ANSI/AWS C3.3 Recommended Practices for Design...
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003324
EISBN: 978-1-62708-176-4
.... Despite this extensive research and study, there is still much to be done, and adhesive joint design is still as much art as it is science. Brazing and soldering are methods of joining that have similarities to adhesives and welding. These methods might be viewed as falling between welding and adhesive...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001457
EISBN: 978-1-62708-173-3
... Abstract This article is intended to assist the development of procedures for the brazing of ceramic-to-ceramic or ceramic-to-metal joints for service under elevated temperatures, mechanical or thermal stresses, or corrosive atmospheres. It describes the factors considered in preparing a...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001473
EISBN: 978-1-62708-173-3
... selection for respective applications. eddy current testing inspection magnetic-particle testing nondestructive test methods penetrant testing radiographic testing ultrasonic testing welded joints WELDED JOINTS in any component or structure require thorough inspection. The role of...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... Abstract Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001398
EISBN: 978-1-62708-173-3
... continues to gain acceptance as a process for a number of operations requiring high-temperature injection with speed and precision. For example, in the electronics field, component soldering can be carried out one joint at a time with highly reliable results. Laser soldering uses the well-focused, highly...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005856
EISBN: 978-1-62708-167-2
... consistent solderability Source: Ref 1 Table 2 Visual method of grading defects Classification Appearance of joint Type of defect Bareā€”no solder Connection not soldered Major (a) Cold solder Connection displays a chalky or crystallized appearance caused by lack of...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003205
EISBN: 978-1-62708-199-3
... for welding, brazing, and soldering. It also describes joint design considerations such as selection of weld joints and welds. adhesive bonding brazing fusion welding joining mechanical fastening soldering solid-state welding weld joint design weld preparation welding Selected...
Series: ASM Handbook
Volume: 1A
Publisher: ASM International
Published: 31 August 2017
DOI: 10.31399/asm.hb.v01a.a0006302
EISBN: 978-1-62708-179-5
... Abstract Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common...
Book Chapter

By Mark Cowell
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001393
EISBN: 978-1-62708-173-3
... used in this process continues to be popular. It is the most cost-effective tool for: Prototype and short production jobs Rework of defective solder joints and/or components Soldering of components that are too delicate or specialized to solder using mass-production techniques...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001450
EISBN: 978-1-62708-173-3
... Abstract This article focuses on the various criteria considered in the selection of product forms, joint types, solders, and filler metals for brazing and soldering of base material components. brazing brazing filler metals joints material selection soldering solders THE...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001399
EISBN: 978-1-62708-173-3
... are used in electronics assembly. There is a potential for solder joint fracture when melting or reflowing a portion of a multi-leaded component. Fractures in solder joints occur when the joints are thermally cycled in use because of the induced stress caused by partially reflowing the component. If...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001395
EISBN: 978-1-62708-173-3
... solder and interconnection must be exposed to for proper joint formation and is a parameter of the reflow schedule. It is affected by factors such as solder paste alloy, metal content, particle size, flux, surface tension, and fluidity of the solder. As noted earlier, this value will vary among different...