Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use requirements and joint configurations required for the formation of a good soldered joint. It focuses on the visual, automatic, and destructive inspection techniques for determining overall joint quality.

Corrosion is often thought of as rusting, the process of deterioration undergone by a metal when it is exposed to air or water. This article provides the fundamentals of joints corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered joints and their causes. It describes the role of proper brazing procedures in controlling corrosion. The article concludes with information on the corrosion resistance of various brazing alloy systems.

Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications. This article introduces major fractography techniques to demonstrate typical solder joint failure and background failure mechanisms. These techniques may be helpful to readers in recognizing failure modes and in preventing further failures during product development and process implementation.