1-20 of 399 Search Results for

soldered joints

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003831
EISBN: 978-1-62708-183-2
... corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered joints and their causes. It describes the role of proper brazing procedures in controlling corrosion. The article concludes with information on the corrosion resistance of various brazing alloy systems...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001479
EISBN: 978-1-62708-173-3
...Abstract Abstract Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001492
EISBN: 978-1-62708-173-3
... composition. Source: Ref 1 Abstract Abstract This article describes the factors considered in the analysis of brazeability and solderability of engineering materials. These are the wetting and spreading behavior, joint mechanical properties, corrosion resistance, metallurgical considerations...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
.... This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing. capacitors electronic applications packaged integrated circuits resistors...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... 0.35195 14,338 0.38099 HASL CBGA 11,949 0.46592 15,491 0.3056 OCC PBGA 17,904 0.26247 14,057 0.43629 OCC CBGA 9,318 0.48876 13,898 0.33654 HASL, Hot air solder leveled; OCC, organic coating on copper Fig. 24 Log normal probability plots for TSOP joint failures. Test...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
...Abstract Abstract Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... Abstract Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005856
EISBN: 978-1-62708-167-2
...Visual method of grading defects Table 2 Visual method of grading defects Classification Appearance of joint Type of defect Bare—no solder Connection not soldered Major (a) Cold solder Connection displays a chalky or crystallized appearance caused by lack of sufficient heat...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
.... 2 Cooling curve for pure tin Fig. 4 Lead-tin phase diagram showing eutectic temperature at point B with 63Sn-37Pb Fig. 1 Plot of the heating and cooling curves of pure lead. See text for details. Fig. 6 Basic joint configurations used for soldering applications...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003205
EISBN: 978-1-62708-199-3
... considerations for welding, brazing, and soldering. It also describes joint design considerations such as selection of weld joints and welds. adhesive bonding brazing fusion welding joining mechanical fastening soldering solid-state welding weld joint design weld preparation welding Joining...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003205
EISBN: 978-1-62708-199-3
... for welding, brazing, and soldering. It also describes joint design considerations such as selection of weld joints and welds. adhesive bonding brazing fusion welding joining mechanical fastening soldering solid-state welding weld joint design weld preparation welding Selected...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001450
EISBN: 978-1-62708-173-3
...Abstract Abstract This article focuses on the various criteria considered in the selection of product forms, joint types, solders, and filler metals for brazing and soldering of base material components. brazing brazing filler metals joints material selection soldering solders...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001398
EISBN: 978-1-62708-173-3
... Laser Soldering Intelligent Laser Soldering Advantages of laser soldering are that it is a noncontact procedure; it avoids thermal stress by localizing heat input and confining it to the solder joint area; it reduces intermetallic compound formation, due to rapid joint formation which results...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001344
EISBN: 978-1-62708-173-3
...Comparison of soldering, brazing, and welding Table 1 Comparison of soldering, brazing, and welding Parameter Process Soldering Brazing Welding Joint formed Mechanical Metallurgical Metallurgical Filler metal melt temperature, °C (°F) <450 (<840) >450 (>840...
Book Chapter

By K. Sampath
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002488
EISBN: 978-1-62708-194-8
...Abstract Abstract This article explains how to design a joint or conduct a joining process so that components can be produced most efficiently and without defects. The joining processes include mechanical fastening, adhesive bonding, welding, brazing, and soldering. The article discusses...
Book Chapter

By Mark Cowell
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001393
EISBN: 978-1-62708-173-3
... soldering iron used in this process continues to be popular. It is the most cost-effective tool for: Prototype and short production jobs Rework of defective solder joints and/or components Soldering of components that are too delicate or specialized to solder using mass-production techniques...
Series: ASM Handbook
Volume: 1A
Publisher: ASM International
Published: 31 August 2017
DOI: 10.31399/asm.hb.v01a.a0006302
EISBN: 978-1-62708-179-5
... Abstract Abstract Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001402
EISBN: 978-1-62708-173-3
... joint heats faster than the other. Both a preheating capability, typically provided by infrared panels, and a cooldown stage have been incorporated in newer models. The cooldown stage brings the solder joint through the liquidus phase more quickly ( Fig. 4 ). This procedure reduces the time...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... thousand solder joints in a matter of minutes. Fig. 1 Schematic of the wave soldering process. The three important process control regions are the entry (A), the interior (B), and the peel-back region (C). The implementation of wave soldering for surface-mount technology requires...