Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. This article provides an overview of dip soldering, its applications, and the equipment used. The article also provides information on the safety measures to be taken by production personnel when operating solder pots.

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Soldering involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 deg C (840 deg F). Beginning with an overview of the specification and standards and applications, this article discusses the principal levels and effects of the most common impurity elements in tin-lead solders. It describes the various processes involved in the successful soldering of joints, including shaping the parts to fit closely together; cleaning and preparing the surfaces to be joined; applying a flux; assembling the parts; and applying the heat and solder.

Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end-use requirements and joint configurations required for the formation of a good soldered joint. It focuses on the visual, automatic, and destructive inspection techniques for determining overall joint quality.

This article presents an introduction to brazing, including information on its mechanics, advantages, and limitations. It reviews soldering with emphasis on chronology, solder metals, and flux technology. The article also provides useful information on mass, wave, and drag soldering. It presents a table which contains information on the comparison of soldering, brazing, and welding.

This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.

This article describes the melting process of casting metals used in hot chamber die casting. It discusses the design and capabilities of injection components, such as gooseneck, plunger, and cylinder. The article reviews the distinctions between hot and cold chamber processes. An example of a typical runner, gate and overflow configuration for faucet fixture casting is shown. Temperature control for die casting is also discussed. The article explains some ejection and post-processing techniques used for the hot chamber die casting: robotics, recycling, and fluxing.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

Tin is produced from both primary and secondary sources. This article discusses the chemical compositions, production, properties, microstructure and applications of tin and tin alloys. The major tin alloys discussed here are tin-antimony-copper alloy (pewter), bearing alloy, solder alloy and other alloys containing traces of tin. Data on tin consumption in the United States is presented graphically.

Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings. It presents a short note on pure (unalloyed) tin and uses of tin in chemicals. The article also covers the compositions and uses of tin alloys which include solders, pewter, bearing alloys, alloys for organ pipes, and fusible alloys. It goes on to discuss the other alloys containing tin including battery grid alloys, type metals, copper alloys, dental alloys, cast irons, titanium alloys, and zirconium alloys. Finally, it presents a short note on the applications of tin powder and corrosion resistance of tin.

Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common advantages of both brazing and soldering. It describes the brazing and soldering of cast irons, as well as the selection of brazing filler material. The article discusses various brazing methods: torch brazing, induction brazing, salt-bath brazing, and furnace brazing. It concludes with information on the application examples of brazing of cast iron.

This article describes the allotropic modification and atmospheric corrosion of pure tin. Corrosion of pure tin due to oxidation reaction, and reaction with the other gases, water, acids, bases, and other liquid media, is discussed. The article provides information on corrosion behavior on soft solders, pewter, bearing alloys, tin-copper alloys, and tin-silver alloys. It reviews the influence of corrosion on immersion tin coating, tin-cadmium alloy coatings, tin-cobalt coatings, tin-copper coatings, tin-lead coatings, tin-nickel coatings, and tin-zinc coatings. The general properties and corrosion resistance of tinplate are summarized. The article also describes the methods of corrosion testing of coatings; these include an analysis of coating thickness measurements, porosity and rust resistance testing, solderability test, and specific special tests.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

This article discusses different types of joining processes, including welding, brazing, soldering, mechanical fastening, and adhesive bonding. It examines two broad classes of welding: fusion welding and solid-state welding. The article discusses the process selection considerations for welding, brazing, and soldering. It also describes joint design considerations such as selection of weld joints and welds.

This article describes the control of alloy composition and impurity levels in die casting of zinc alloys based on agitation, use of foundry scrap, and melt temperature and fluxing. It reviews the process considerations for the melt processing of the zinc alloys. The process considerations include the usage of furnaces and launder system, scrap return, inclusions in zinc alloys, fluxing of zinc alloys, and galvanizing fluxes. The article discusses the materials and lubricant selection, casting and die temperature control, and trimming process used in hot chamber die casting for zinc alloys. It also reviews other casting processes for zinc alloys, such as sand casting, permanent mold casting, plaster mold casting, squeeze casting, and semisolid casting.

A tin deposit provides sacrificial protection to copper, nickel, and many other nonferrous metals and alloys. Tin also provides good protection to steel. Tin can be deposited from either alkaline or acid electrolytes. This article explains the compositions and operating conditions of these electrolytes.

This article discusses the processing, properties, and applications of various grades of lead and lead-base alloys with the aid of several tables and illustrations. It lists the Unified Numbering System (UNS) designations for various pure lead grades and lead-base alloys grouped according to nominal chemical composition. The properties of lead that make it useful in a wide variety of applications are also discussed. The largest usage of lead is in the lead acid storage batteries (in the grid plates, posts, and connector straps). Other applications include ammunition; cable sheathing; cast products such as type metals, terneplates, and foils; and building construction materials. Lead is also used as an alloying element in steel and in copper alloys to improve machinability and other characteristics. In many applications, lead is combined with stronger materials to make structures that have the best qualities of both materials such as the plumbum series.

This article overviews the classification of welding processes and the key process embodiments for joining by various fusion welding processes: fusion welding with chemical sources for heating; fusion welding with electrical energy sources, such as arc welding or resistance welding; and fusion welding with directed energy sources, such as laser welding, electron beam welding. The article reviews the different types of nonfusion welding processes, regardless of the particular energy source, which is usually mechanical but can be chemical, and related subprocesses of brazing and soldering.