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solder pots

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Book Chapter

By Roy E. Beal
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001396
EISBN: 978-1-62708-173-3
... personnel when operating solder pots. dip soldering molten solder bath personnel safety solder pots soldering equipment DIP SOLDERING (DS) is accomplished by submerging parts to be joined into a molten solder bath. The molten bath can be any suitable filler metal, but the selection is usually...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... located at the bottom of the solder pot; suitable baffles are mounted in the pot to direct the flow of solder into the desired configuration. The printed wiring board is placed onto a conveyor, which brings it into contact with the wave surface. Note from Fig. 1 that the circuit boards travel along...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
..., MIL-STD-883D, Method 2003.7) assesses the uniformity of the solder film that remains on a lead or termination after immersion in a solder pot. Shown in Fig. 18 are optical micrographs of samples demonstrating the three primary categories of wettability. Fig. 18 Optical micrographs of 60Sn...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... or refinery. Impurities can be inadvertently picked up during normal usage of the alloys, especially when solder pots with recirculation systems and passage of components through the molten materials are used. The purity of solders supplied by reputable manufacturers usually is adequate for most applications...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... impurities in alloys as provided by the supplier or refinery. Impurities can be inadvertently picked up during normal usage of the alloys, especially when solder pots with recirculation systems and passage of components through the molten materials are used. The purity of solders supplied by reputable...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001344
EISBN: 978-1-62708-173-3
... high that the matching horns used to energize the pot were quickly eroded away. With the advent of the semiconductor, ulrasonics were found to cause occasional damage to the devices. Today the main use for ultrasonics in the soldering industry is to be found in the pots used for tinning components...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001479
EISBN: 978-1-62708-173-3
... or appearance. Non-wetting can be due to an unsolderable surface; insufficient, improper, or inactive flux; insufficient temperature; insufficient solder; or some combination of these. In Fig. 3 , the substrate is Kovar, plated with 95 wt% Sn and 5 wt% Pb and dipped into a pot of molten eutectic tin-lead...
Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005267
EISBN: 978-1-62708-187-0
..., has traditionally been gas fired and constructed of cast iron. In recent years, great improvements in energy efficiency have been realized by constructing these pots from ceramic material and using either gas or electric immersion heaters to supply heat to the bath. If a central melting facility...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... that maintenance operations may entail. The corrosivity of solder flux residues and etching solutions, and the cleanliness testing of printed circuit boards (PCBs) prior to conformal coating, became issues in the manufacturing process to lessen corrosion problems. Potting, hermetic sealing, conformal coating...
Book Chapter

Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005307
EISBN: 978-1-62708-187-0
..., nickel, and chromium levels and should therefore be avoided. Castings that have had chemical surface treatments can generally be remelted as clean scrap. Under no circumstances should cadmium-plated, tin-plated, or soldered die castings be remelted. Caution should also be exercised when remelting...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003818
EISBN: 978-1-62708-183-2
... Insulated copper wire; pistons and other lubricated machine components Mild (exposure to relatively clean indoor atmospheres) 2.5–5.0 0.1–0.2 Connectors, wires, etc., plated primarily for immediate solderability or where storage periods are short Moderate (exposure to average shop and warehouse...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... unit comprising any number of joints can be soldered in one operation after proper cleaning and fluxing. Fixtures are required to contain the unit and maintain proper joint clearances during solder solidification. The soldering pot should be large enough so that, at a given rate of production...
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006529
EISBN: 978-1-62708-207-5
... the domains of both brazing and soldering. An aluminum brazing process implies a host of physical, chemical, metallurgical, and other phenomena, which can differ from process to process, depending on the materials (e.g., substrates to be bonded, filler metal types and compositions), background atmosphere...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003065
EISBN: 978-1-62708-200-6
... be periodic or continuous. Pot furnaces and day tanks are filled with a fixed amount of material. The temperature is then varied to melt, fine, homogenize, and cool the melt. Continuous melters are filled steadily to maintain a constant melt level as glass is withdrawn continuously for forming...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001118
EISBN: 978-1-62708-162-7
...: Technologies to Reduce U.S. Import Vulnerability,” Assessment OTA-1TE-248, U.S. Congress, Office of Technology , May 1985 68. Dunning B.W. Jr. , “Precious Metals Recovery From Electronic Scrap and Solder Used in Electronics Manufacture,” Bureau of Mines Information , Circular 9059, 1986...
Series: ASM Handbook
Volume: 1A
Publisher: ASM International
Published: 31 August 2017
DOI: 10.31399/asm.hb.v01a.a0006302
EISBN: 978-1-62708-179-5
... Abstract Abstract Brazing and soldering are done at temperatures below the solidus temperature of the base material but high enough to melt the filler metal and allow the liquid filler metal to wet the surface and spread into the joint gap by capillary action. This article discusses the common...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001076
EISBN: 978-1-62708-162-7
..., solder alloy and other alloys containing traces of tin. Data on tin consumption in the United States is presented graphically. bearing alloy chemical compositions chemical properties mechanical properties pewter physical properties pure tin solder alloy TIN was one of the first metals...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001250
EISBN: 978-1-62708-170-2
..., and it forms many useful inorganic and organic chemical compounds because it is amphoteric. It has the largest melting point to boiling point range (from 232 to 2370 °C, or 450 to 4300 °F) of any metal. In conventional metallurgical applications, evaporation from a pot of liquid tin does not occur. Tin is used...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001273
EISBN: 978-1-62708-170-2
... Static Casting Bond Quality Metal-Spray Babbitting Cleaning by Degreasing or Pickling Fluxing Single-Pot Tinning Mechanical Bonding Equipment Procedure Degreasing Pickling of Steel Abrasive Blast Cleaning Fluxing facilitates and speeds the reaction of molten tin...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001270
EISBN: 978-1-62708-170-2
... steel >400 Zinc 275 Zinc-iron 225 Zn-55Al 375 Aluminum >400 Fig. 8 Corrosion losses of hot dip coatings in the industrial environment of Bethlehem, PA. Source: Ref 18 Fig. 4 Coated sheet exiting pot at a galvanizing line Fig. 5 Schematic diagram...