1-20 of 196 Search Results for

solder joint reliability

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test. References 1. Zubelewicz A. et al. , Mechanical Deflection System—An Innovative Test Method for SMT Assemblies , INTERPAC-95 (Lahaina...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... Electric CRD , 1986 32. Engelmaier W. , Performance Considerations: Thermal-Mechanical Effects , Packaging , Vol 1 , Electronic Materials Handbook , ASM , 1989 33. Kinser D. et al. , Reliability of Soldered Joints in Thermal Cycling Environments , Proc. NEPCON , May...
Book Chapter

By Mark Cowell
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001393
EISBN: 978-1-62708-173-3
... temperature of the tip. After several solder joints have been completed, the tool may be unable to form reliable joints. A properly selected soldering iron will stabilize the tip at a temperature that does not damage components, while providing a working temperature sufficient for soldering successive joints...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001399
EISBN: 978-1-62708-173-3
... with a discussion on reliability concerns and processing concerns when using hot gas soldering in electronics assembly. gas flow rates hot gas soldering reliability soldering HOT GAS SOLDERING is a process that is commonly used in applications where the workpiece thermal mass is small and the melting...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001344
EISBN: 978-1-62708-173-3
... skills to produce joints of satisfactory quality and reliability. Brazing employs higher temperatures than soldering, but the fundamental concepts are similar, particularly with respect to metallurgy and surface chemistry ( Table 1 ). However, joint design, materials to be joined, filler metal and flux...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005856
EISBN: 978-1-62708-167-2
... consistent solderability Source: Ref 1 Table 2 Visual method of grading defects Classification Appearance of joint Type of defect Bare—no solder Connection not soldered Major (a) Cold solder Connection displays a chalky or crystallized appearance caused by lack...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... required solders having the following properties: Compatibility with copper (especially with respect to alloying behavior and melting temperatures) Good electrical conductivity Workability to enable factory workers to rapidly form low-cost, reliable solder joints Engineers now had formal...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001398
EISBN: 978-1-62708-173-3
...) laser continues to gain acceptance as a process for a number of operations requiring high-temperature injection with speed and precision. For example, in the electronics field, component soldering can be carried out one joint at a time with highly reliable results. Laser soldering uses the well-focused...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... between metal terminal and encapsulant at terminal entry of thick-film-hybrid resistor network Fig. 24 Copper migration and corrosion on surface of failed printed circuit board Fig. 23 Tin dendrites growing between two adjacent solder joints on failed printed circuit board Fig...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... , June 20 , 1958 4. Ross S.H. and Dougherty F.J. Jr. , “Fungus Resistance of Vinyl Polymer Insulating Cable Coverings,” U.S. Army Frankford Arsenal Memorandum Report M68-12-1, Nov 1967 5. Foster F.G. , How to Avoid Embrittlement of Gold-Plated Solder Joints...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001478
EISBN: 978-1-62708-173-3
... and the best techniques for dealing with them. These recommended practices describe those procedures that should be followed in the design, manufacture, and inspection of brazed joints for critical components in order to ensure their reliability in service. The recommended procedures represent the best current...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001479
EISBN: 978-1-62708-173-3
... and unintentional, can affect the wetting behavior and reliability of soldered joints. Contamination is a particular problem in wave soldering and tinning operations in which a molten solder comes into continuous contact with a variety of materials. Gold, copper, aluminum, nickel, iron, and other elements can cause...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001450
EISBN: 978-1-62708-173-3
... as at the joint interfaces. Intermetallic phases with low plasticity play a dual role: on one hand, they improve soldered joint strength; on the other hand, they lessen the long-term fatigue life expectancy. The latter is of paramount importance for the reliable service of electronic devices, particularly surface...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... joints in a matter of minutes. Fig. 1 Schematic of the wave soldering process. The three important process control regions are the entry (A), the interior (B), and the peel-back region (C). The implementation of wave soldering for surface-mount technology requires that the devices be glued...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003205
EISBN: 978-1-62708-199-3
... considerations for welding, brazing, and soldering. It also describes joint design considerations such as selection of weld joints and welds. adhesive bonding brazing fusion welding joining mechanical fastening soldering solid-state welding weld joint design weld preparation welding Joining...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003205
EISBN: 978-1-62708-199-3
... for making high-quality, reliable connections for many decades. Correctly controlled, soldering is one of the least expensive methods for fabricating electrical connections. Advantages of brazing and soldering include: The joint forms itself by the nature of the flow, wetting, and subsequent...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... for postassembly cleaning procedures must be addressed when the corrosivity of the flux residues jeopardizes the reliability required of the workpiece during service. Combined substrate, solder, and flux properties. The combination of properties must be considered in order to establish the joint design...
Book Chapter

By K. Sampath
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002488
EISBN: 978-1-62708-194-8
... cost. It provides several examples of selected parts and joining processes to illustrate the advantages of a specific design practice in improving manufacturability. References References 1. Blodgett O.W. , Joint Design and Preparation , Welding, Brazing, and Soldering , Vol 6 , 9th...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005552
EISBN: 978-1-62708-174-0
... for at least solid-state deposition processes. It is also possible to produce joints between metals and even between metals and ceramics using two subtypes of welding known as brazing and soldering. In both, fillers that melt are used to create material continuity with base materials that do not melt, even...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003145
EISBN: 978-1-62708-199-3
.... The electronics and electrical industries employ solders containing 40 to 70% Sn that provide strong and reliable joints under a variety of environmental conditions. High-tin solders are used for joining parts of electrical apparatuses because their electrical conductivity is higher than that of high-lead solders...