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solder alloy

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Published: 30 August 2021
Fig. 1 Typical stress-strain curve of a solder alloy (SAC305) More
Image
Published: 30 August 2021
Fig. 2 Schematic demonstration of the viscoplasticity effect of a solder alloy (SAC305). Legend number is for strain rate changing from 10 −4 /s to 10/s. More
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Published: 30 August 2021
Fig. 3 Bingham-Maxwell expression for the mechanical properties of a solder alloy More
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Published: 01 December 2004
Fig. 18 Sn-30Pb alloy (soft solder). Dendrites of tin-rich solid solution (light) in a matrix of tin-lead eutectic. Figure 19 shows the structure of the eutectic. Etchant 2, Table 1 . 150× More
Image
Published: 01 December 2004
Fig. 20 Sn-37Pb alloy (eutectic soft solder). Structure shows globules of lead-rich solid solution (dark), some of which exhibit a slightly dendritic structure, in a matrix of tin. Etchant 7, Table 1 . 375× More
Image
Published: 01 December 2004
Fig. 22 Sn-40Pb alloy (soft solder). Structure consists of small dendrites of lead-rich solid solution (dark) in a fine matrix of globular tin-lead eutectic. Etchant 7, Table 1 . 150× More
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001076
EISBN: 978-1-62708-162-7
... Ag 245 473 221 430 Soldering of components for electrical and high-temperature service Tin-silver eutectic alloy B 32, Grade Sn96 QQ-S-571, Grade Sn96 … … 96 Sn, 3.5 Ag 221 430 221 430 Popular choice with properties similar to those of ASTM B 32, Grade Sn95 Soft solder (70-30...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003211
EISBN: 978-1-62708-199-3
... and solder. fluxing precleaning solder alloys soldered joints soldering surface preparation SOLDERING involves heating a joint to a suitable temperature and using a filler metal (solder) that melts below 450 °C (840 °F). The solder is distributed between the closely fitted surfaces...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004209
EISBN: 978-1-62708-184-9
..., and other debris that deposit on dental material surfaces are discussed. The article evaluates the types of alloys available for dental applications, including direct filling alloys, crown and bridge alloys, partial denture alloys, porcelain fused to metal alloys, wrought wire alloys, soldering alloys...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001397
EISBN: 978-1-62708-173-3
... solidifies. Process Applications The RS process can be used in all soldering operations and with all solderable metals. The only limitations are the thickness and the design of the parts to be soldered. Resistance soldering is used to join steels (for example, carbon, low alloy, and stainless...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001092
EISBN: 978-1-62708-162-7
...Abstract Abstract This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003146
EISBN: 978-1-62708-199-3
... and casts with little difficulty. The most significant applications of lead and lead alloys are lead-acid storage batteries, solders, cable sheathing, and building construction materials (such as sheet, pipe, and caulking). Other important applications include counterweights, bearings, ammunition, type...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001078
EISBN: 978-1-62708-162-7
... recycled lead. Considerable tonnages of scrap solder and bearing metals are recovered and used again. Lead recycling is discussed in more detail in the section “Recycling of Lead” in the article "Recycling of Nonferrous Alloys" in this Volume. Galena is generally associated with substantial amounts...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... The most commonly used solder alloys in electronics manufacturing are summarized in Table 1 . Typical soldering temperatures in manufacturing operations are from 30 to 50 °C (55 to 90 °F) above the liquidus temperature to ensure adequate flow of the solder and proper heating of the substrate. The solder...
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006079
EISBN: 978-1-62708-175-7
...Abstract Abstract Metals and alloy powders are used in welding, hardfacing, brazing, and soldering applications, which include hardface coatings, the manufacturing of welding stick electrodes and flux-cored wires, and additives in brazing pastes or creams. This article reviews...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005856
EISBN: 978-1-62708-167-2
.... The alloying of various metals to make solder filler metals produces some very interesting results that are useful to understand. Two examples of tin-lead compositions, and the tin-lead constitutional diagram in the accompanying graphs, will begin to show how solders work. One of the first things to note...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001450
EISBN: 978-1-62708-173-3
... THE ULTIMATE GOAL of brazing and soldering technologies is to join parts into an assembly through metallurgical bonding ( Ref 1 , 2 , 3 , 4 , 5 ). This can be achieved by placing a relatively low-melting-temperature alloy, or filler metal, in the clearance, or gap, between the base materials to be joined...
Image
Published: 01 December 2004
Fig. 12 Scanning electron micrograph of Sn-40Pb alloy wave-soldered printed circuit board joint that was thermally cycled. Micrograph shows a typical thermal fatigue crack in the joint. The crack is at a 45° angle to the circuit lead and totally encircles it. 50× More