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Published: 01 December 2004
Fig. 18 Sn-30Pb alloy (soft solder). Dendrites of tin-rich solid solution (light) in a matrix of tin-lead eutectic. Figure 19 shows the structure of the eutectic. Etchant 2, Table 1 . 150× More
Image
Published: 01 December 2004
Fig. 20 Sn-37Pb alloy (eutectic soft solder). Structure shows globules of lead-rich solid solution (dark), some of which exhibit a slightly dendritic structure, in a matrix of tin. Etchant 7, Table 1 . 375× More
Image
Published: 01 December 2004
Fig. 22 Sn-40Pb alloy (soft solder). Structure consists of small dendrites of lead-rich solid solution (dark) in a fine matrix of globular tin-lead eutectic. Etchant 7, Table 1 . 150× More
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003818
EISBN: 978-1-62708-183-2
... behavior on soft solders, pewter, bearing alloys, tin-copper alloys, and tin-silver alloys. It reviews the influence of corrosion on immersion tin coating, tin-cadmium alloy coatings, tin-cobalt coatings, tin-copper coatings, tin-lead coatings, tin-nickel coatings, and tin-zinc coatings. The general...
Image
Published: 01 December 2004
Fig. 1 Very soft metals; alloys of lead and tin. (a) and (b) A near-eutectic soft solder (63% Sn, 37% Pb; hardness, 9 HV). A globular eutectic of tin phase (light) and lead phase (dark). (c) and (d) A linotype metal (4% Sn, 12% Sb, 84% Pb; hardness, 26 HV). Primary lead dendrite in a ternary More
Image
Published: 01 December 1998
Fig. 19 Effect of cooling rate on the microstructure of Sn-37Pb alloy (eutectic soft solder). (a) Slowly cooled sample shows a lamellar structure consisting of dark platelets of lead-rich solid solution and light platelets of tin. 375×. (b) More rapidly cooled sample shows globules of lead More
Image
Published: 01 December 2004
Fig. 9 Effect of cooling rate on the microstructure of Sn-37Pb alloy (eutectic soft solder). (a) Slowly cooled sample shows a lamellar structure consisting of dark platelets of lead-rich solid solution and light platelets of tin. (b) More rapidly cooled sample shows globules of lead-rich solid More
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003145
EISBN: 978-1-62708-199-3
... of tin solders tin chemicals tin-base alloys tinplate TIN is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating for steel, that is, tinplate. In the molten state, it reacts with and readily wets most of the common metals and their alloys...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001076
EISBN: 978-1-62708-162-7
... Ag 245 473 221 430 Soldering of components for electrical and high-temperature service Tin-silver eutectic alloy B 32, Grade Sn96 QQ-S-571, Grade Sn96 … … 96 Sn, 3.5 Ag 221 430 221 430 Popular choice with properties similar to those of ASTM B 32, Grade Sn95 Soft solder (70-30...
Series: ASM Handbook
Volume: 9
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.hb.v09.a0003778
EISBN: 978-1-62708-177-1
... the basic procedure, are shown in Fig. 1(c) to (f) . Fig. 1 Very soft metals; alloys of lead and tin. (a) and (b) A near-eutectic soft solder (63% Sn, 37% Pb; hardness, 9 HV). A globular eutectic of tin phase (light) and lead phase (dark). (c) and (d) A linotype metal (4% Sn, 12% Sb, 84% Pb...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005444
EISBN: 978-1-62708-196-2
... 0.062 “K” Monel 0.045 Inconel 0.036 Hastelloy B 0.027 Hastelloy C 0.03 Hastelloy D 0.05 Illium G 0.029 Illium R 0.031 60Ni-24Fe-16Cr 0.032 35Ni-45Fe-20Cr 0.031 Constantan 0.051 Tin and tin alloys Pure tin 0.15 Soft solder (63Sn-37Pb) 0.12 Tin foil...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001077
EISBN: 978-1-62708-162-7
... Organization Fabrication Characteristics Joining Mechanical fasteners, adhesives, tungsten inert-gas (TIG) or metal inert-gas (MIG) welding. Solder with lead-tin solder over nickel-plated surface; acidulated zinc chloride flux. Oxyacetylene weld with alloy No. 3, no flux, soft flame. Resistance...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005442
EISBN: 978-1-62708-196-2
... 8.4 0.30 60Ni-24Fe-16Cr 8.247 0.298 35Ni-45Fe-20Cr 7.95 0.287 Constantan 8.9 0.32 Tin and tin alloys Pure tin 7.3 0.264 Soft solder (30% Pb) 8.32 0.301 Soft solder (37% Pb) 8.42 0.304 Tin Babbitt  Alloy 1 7.34 0.265  Alloy 2 7.39 0.267  Alloy 3 7.46...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003146
EISBN: 978-1-62708-199-3
..., hollow stars, rectangular ducts, and so forth. Commercially available extrusions are available from 305 mm (12 in.) pipe down to 0.25 mm (0.010 in.) diam solder wire. Lead is extruded around steel bars, as well as soft materials such as rubber- or plastic-covered power cables. Common flux-cored solders...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... Abstract Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001078
EISBN: 978-1-62708-162-7
... (0.06% Cu, 0.045–0.055% Te, 99.82–99.85% Pb min) L51123, L51124 Copperized soft lead (0.06% Cu, 99.9% Pb min) L51125 Copper-bearing alloy (51% Pb, 3.0% Sn, other 0.8% max, bal Cu) (alloy 485 in SAE J460) L51180 Lead-indium alloys (UNS L51500–L51599) Lead-indium-silver solder alloys...
Series: ASM Handbook
Volume: 2B
Publisher: ASM International
Published: 15 June 2019
DOI: 10.31399/asm.hb.v02b.a0006561
EISBN: 978-1-62708-210-5
..., a welding rod of the parent alloy should be used. In general, 5–6 mm (0.2–0.25 in.) rods are satisfactory for most average-size weldments. Rivet compositions: 2117-T4, 2017-T4. Soft solder with Alcoa No. 802. Braze with Alcoa No. 717; Alcoa No. 33 flux; flame either reducing oxyacetylene or reducing...
Series: ASM Handbook
Volume: 2B
Publisher: ASM International
Published: 15 June 2019
DOI: 10.31399/asm.hb.v02b.a0006556
EISBN: 978-1-62708-210-5
... and reverse polarity (work negative). No flux is required in the inert-gas shielded-tungsten-arc AC welding process. Soft soldering can be done successfully if the proper wire and flux are used (consult manufacturers). Brazing is not recommended. Corrosion Resistance The corrosion resistance...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... … 23.0 22 100In 157 315 157 315 (a) 3.5 0.52 41 24.0 29 50In-50Pb 180 356 209 408 9.60 32.1 0.47 55 6.0 27 (a) Too soft to measure. Source: Indium Corporation of America Indium is frequently added to tin-lead solders as a ternary addition in order to depress...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006543
EISBN: 978-1-62708-183-2
... 80Ni-20Cr … 8.4 0.30 60Ni-24Fe-16Cr … 8.247 0.298 35Ni-45Fe-20Cr … 7.95 0.287 Constantan … 8.9 0.32 Tin and tin alloys Pure tin L13002 7.3 0.264 Soft solder  30% Pb … 8.32 0.301  37% Pb … 8.42 0.304 Tin babbitt  Alloy 1 … 7.34 0.265  Alloy 2...