Film radiography requires the development of the exposed film so that the latent image becomes visible for viewing. It describes the general characteristics of film, including speed, gradient, and graininess, and the factors affecting film selection and exposure time. The article discusses the three major inspection techniques for tubular sections, namely, the double-wall, double-image technique; the double-wall, single-image technique; and the single-wall, single-image technique. It illustrates the arrangements of penetrameters and identification markers for the radiography of plates, cylinders, and flanges. The article discusses various control methods, including the use of lead screens; protection against backscatter and scatter from external objects; and the use of masks, diaphragms, collimators, and filtration. The radiographic appearance of specific types of flaws is also discussed. The article concludes with a discussion on two methods of radiographic film processing: manual and automatic processing.

This article reviews photographic principles, namely, visual examination, field photographic documentation, and laboratory photographic documentation, as applied to failure analysis and the specific techniques employed in both the field and laboratory. It provides information on the photographic equipment used in failure analysis and on film and digital photography. The article describes the basics of photography and the uses of different types of lighting in photography of a fractured surface. The article also addresses the techniques involved in macrophotography and microscopic photography as well as other special techniques.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

X-ray topography is the general term for a family of x-ray diffraction imaging techniques capable of providing information on the nature and distribution of imperfections. This article provides a detailed account of x-ray topography techniques, providing information on the historical background and development trends in x-ray diffraction topography. The discussion covers the general principles, components of systems, and applications of x-ray topography techniques, namely conventional X-ray topographic techniques and synchrotron x-ray topographic techniques.

This article considers the two primary methods used for ultrasonic inspection: pulse-echo and the transmission methods. Pulse-echo inspection can be accomplished with longitudinal, shear, surface (Rayleigh), or Lamb (plate) waves using a diverse range of transducers. The article discusses the principles of each of these inspection methods. It describes the applications and the basic data formats for single-element transducer-based systems, including A-scans, B-scans, and C-scans. The article provides information on electronic equipment used for ultrasonic inspection. It also describes how specific material conditions produce and modify A-scan indications. The article provides information on the controls and their functions for the display unit of the electronic equipment. It describes the techniques used for the identification and characterization of flaws, namely, surface (Rayleigh) wave and ultrasonic polar scan techniques.

Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.

This article describes the fundamental aspects of three nondestructive evaluation (NDE) methods of solid-state welds in terms of operation principles. These methods are radiography, ultrasound, and eddy current methods. The article provides examples of these NDE techniques performed on various types of flaws resulting from solid-state welding processes.

A number of nondestructive evaluation (NDE) methods, such as radiography, ultrasound, and eddy current, are available to detect flaws in solid materials. This article describes the fundamental aspects of these NDE methods in terms of operation principles. It presents some examples of the methods performed on various types of flaws resulting from solid-state welding processes.

This article reviews the characterization methods for producing 3-D microstructural data sets. The methods include serial sectioning by mechanical material removal method and focused ion beam tomography method. The article describes how these data sets are used in realistic 3-D simulations of microstructural evolution during materials processing and materials response. It also explains how the 3-D experimental data are actually input and used in the simulations using phase-field modeling and finite-element modeling.

This article briefly discusses popular techniques for metals characterization. It begins with a description of the most common techniques for determining chemical composition of metals, namely X-ray fluorescence, optical emission spectroscopy, inductively coupled plasma optical emission spectroscopy, high-temperature combustion, and inert gas fusion. This is followed by a section on techniques for determining the atomic structure of crystals, namely X-ray diffraction, neutron diffraction, and electron diffraction. Types of electron microscopies most commonly used for microstructural analysis of metals, such as scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy, are then reviewed. The article contains tables listing analytical methods used for characterization of metals and alloys and surface analysis techniques. It ends by discussing the objective of metallography.

X-ray topography is a technique that comprises topography and x-ray diffraction. This article provides a description of the kinematical theory and the dynamical theory of diffraction. It provides useful information on the configurations of reflection and transmission topography. The article explains various topographic methods, namely, divergent beam method, polycrystal rocking curve analysis, line broadening analysis, microbeam method, and polycrystal scattering topography, as well as their instrumentation. It also describes the applications of x-ray topography.

Failure analysis is an investigative process in which the visual observations of features present on a failed component and the surrounding environment are essential in determining the root cause of a failure. This article reviews the basic photographic principles and techniques that are applied to failure analysis, both in the field and in the laboratory. It discusses the processes involved in visual examination, field photographic documentation, and laboratory photographic documentation of failed components. The article describes the operating principles of each part of a professional digital camera. It covers basic photographic principles and manipulation of settings that assist in producing high-quality images. The need for accurate photographic documentation in failure analysis is also presented.

Nondestructive inspection (NDI) methods for cast iron are used to ensure that the parts supplied perform as required by the purchaser. This article focuses on the principal nondestructive methods used to inspect for anomalies in cast irons and to determine if the volume, shape, size, or number of these anomalies exceeds the maximum allowed by the purchaser. The nondestructive methods include visual inspection, dimensional inspection, liquid penetrant inspection, magnetic-particle inspection, eddy-current inspection, radiographic inspection, ultrasonic inspection, resonant testing, and leak testing. The technique, strengths, and weaknesses of each of the nondestructive methods are also discussed.

X-ray diffraction techniques are useful for characterizing crystalline materials, such as metals, intermetallics, ceramics, minerals, polymers, plastics, and other inorganic or organic compounds. This article discusses the theory of x-rays and how they are generated and detected. It also describes the crystalline nature of certain materials and how the geometry of a unit cell, and hence crystal lattice, affects the direction and intensity of diffracted x-ray beams. The article concludes with several application examples involving measurements on single and polycrystalline materials.

Three-dimensional microscopy can be used to reveal the shape, distribution, and connectivity of three-dimensional (3D) features that lie buried within an opaque material. This article discusses several experimental techniques that can be used to generate 3D images. These include serial sectioning, focused ion beam tomography, atom probe tomography, and X-ray microtomography. Nine case studies are presented that represent the work of the various research groups currently working on 3D microscopy using serial sectioning and illustrate the variants of the basic experimental techniques. The article also discusses the techniques for reconstruction and visualization of 3D microstructures with advanced computer software and hardware.

Computed tomography (CT) is an imaging technique that generates a three-dimensional (3-D) volumetric image of a test piece. This article illustrates the basic principles of CT and provides information on the types, applications, and capabilities of CT systems. A comparison of performance characteristics for film radiography, real-time radiography, and X-ray computed tomography is presented in a table. A functional block diagram of a typical computed tomography system is provided. The article discusses CT scanning geometry that is used to acquire the necessary transmission data. It also provides information on digital radiography, image processing and analysis, dual-energy imaging, and partial angle imaging, of a CT system.