Electroplated silver is used in both decorative and functional applications, such as engineering and electrical/electronic applications. This article explains the solution formulations and specifications of electrolytes used in silver plating.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.

This article provides information on single-shot and scanning, the two types of induction heat treating processes that are based on whether the induction coil is moving relative to the part during the heating process. It describes the effect of the frequency of induction heating current on the induction coil and process design, and the control of heating in different areas of the inductor part. The article reviews three main tools for adjustment of coil design and fabrication: coupling gap, coil copper profile, and magnetic flux controllers. It examines the method of holding a part and presenting it to the inductor during the initial inductor design. The article provides information on coil leads/busswork and contacts that mechanically and electrically connect the induction coil head to the power supply. It concludes with a discussion on flux and oxide removal, leak and flow checking, silver plating, and electrical parameter measurement.

This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.

This guide rates the compatibility of dissimilar structural materials joined together for service in seawater, marine atmosphere, or industrial atmosphere. It contains a table that indicates the material code and most generally effective surface treatment typically used to reduce corrosion of bare metals.

Shot peening is a method of cold working in which compressive stresses are induced in the exposed surface layers of metallic parts by the impingement of a stream of shot, directed at the metal surface at high velocity under controlled conditions. This article focuses on the major variables, applications, and limitations of shot peening and provides information on peening action, surface coverage, and peening intensity. It discusses the equipment used for shot recycling and shot propelling as well as the types and sizes of media used for peening. The article describes the problems in shot peening of production parts. It concludes with information on the SAE standard J442 that describes the test strips, strip holder, and gage used in measuring shot peening intensity.

The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.

Aluminum components are often plated with other metals to mitigate the effects of corrosion and wear, improve application performance, and extend service life. This article discusses some of the more common aluminum plating processes, including electroplating, immersion plating, and electroless plating, and describes various plating materials and the types of applications in which they are used. It provides critical processing details such as temperatures, ratios, ranges, times, and rates. The article explains how to prepare aluminum components for electroplating, discussing surface roughening, anodizing, and immersion procedures along with expected results.

Ultrasonic welding (USW) is effectively used to join both similar and dissimilar metals with lap-joint welds. This article describes procedure considerations for the ultrasonic welding of specific material types. It reviews difficult-to-weld alloys, such as carbon and low-alloy steels, high-strength steels, and stainless steel, and provides information on the applications of weldable alloys such as aluminum alloys and copper alloys. The article concludes with a discussion on welding of dissimilar metal (nonferrous-to-nonferrous) combinations and its applications.

This article discusses corrosion resistance of titanium and titanium alloys to different types of corrosion, including galvanic corrosion, crevice corrosion, stress-corrosion cracking (SCC), erosion-corrosion, cavitation, hot salt corrosion, accelerated crack propagation, and solid and liquid metal embrittlement. A short section discusses the addition of alloys that can improve the corrosion resistance of titanium.

Electrical contacts are metal devices that make and break electrical circuits. This article provides information on materials selection criteria and failure modes of make-break contacts. It describes the property requirements for make-break arcing contacts, namely, electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties. The article presents a brief note on brush contact materials and their interdependence factors for sliding contacts. It also describes the type of commercial contact materials for electrical contacts, namely, copper metals, silver metals, gold metals, metals of the platinum group, precious metal overlays, tungsten and molybdenum, aluminum, and composite materials. Finally, the article provides information on composite manufacturing methods, and tabulates the physical, and mechanical properties of electrical contact materials, including copper, silver, gold, platinum, palladium, and composites.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

This article describes low-temperature solid-state welding processes in relation to the interlayer fabrication method, welding method, and welding parameters. The interlayer fabrication method is used to produce vacuum coated interlayers, electrodeposited interlayers, and foil interlayers. The article discusses welding methods, including uniaxial compression and hot isostatic pressing. The article provides information on the effect of base-metal surface finish on the tensile strength of joints solid-state welded using silver interlayers in tabular form and addresses the surface cleaning steps of base-metals.