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Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... (manufacturing) of the semiconductor devices and IC chips, such as diffusion or sputtering Temperatures required for packaging (assembly) of the electronic equipment, for example, solder Environmental temperatures encountered during the product life, for example, transportation in an unheated compartment...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... resulted in a need for materials with high thermal conductivities. In addition, to minimize thermal stresses that can cause component or solder-joint failure, packaging materials must have CTEs matching those of the materials to which they are attached, especially ceramic substrates and semiconductors...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
...) is a process (an integral part of the assembly) using a series of corrosive chemicals for etching, plating, and neutralization. If residues are left on the package (plastic body and leadframes), the reliability of the device can be potentially affected. Fig. 2 Generic process flow of a semiconductor...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003136
EISBN: 978-1-62708-199-3
..., and those used in semiconductor packaging operations. Thermal and electrical conductivities and room-temperature mechanical properties are unaffected by small additions of these elements. However, cadmium-copper and zirconium-copper work harden at higher rates than either silver-bearing copper...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... Abstract This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
... devices are required. To accommodate the active portion of the printed circuits, packaged or bare die semiconductor components are used. There are a variety of final packages for printed circuits, and these differ vastly in application, size, shape, and features. Next-generation wearables are emerging...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... for the Electronics Industry Substrates For high-reliability electronic circuitry, ceramics historically have been the choice for both substrates and semiconductor packages. Traditionally, alumina ceramics dominate this area of application because of their outstanding thermal and corrosion stability...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... Abstract This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... Abstract This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005544
EISBN: 978-1-62708-197-9
... Abstract This article demonstrates the depth and breadth of commercial and third-party software packages available to simulate metals processes. It provides a representation of the spectrum of applications from simulation of atomic-level effects to manufacturing optimization. The article...
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005607
EISBN: 978-1-62708-174-0
... kHz and higher removes surface contaminants, induces material flow, and permits a solid-state weld between the wire and metalized bond pad or leads on semiconductor packages. A combination of ultrasonic and thermocompression bonding, known as thermosonic bonding, is also a popular technique...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003049
EISBN: 978-1-62708-200-6
... Hydrogenated amorphous silicon ( Ref 4 ) is an important emerging glass material. It has spawned rapid developments in the amorphous semiconductor area because it is a versatile material that can be tailored to specified electronic properties. Among its applications are photoreceptors for electrophotographic...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006641
EISBN: 978-1-62708-213-6
.... Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas. inductively coupled plasma mass spectrometry mass analyzer Overview Introduction Inductively coupled plasma mass spectrometry (ICP-MS...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... generally been relegated to flat, planar surfaces. Aerosol jetting and microdispensing have been the dominant processes used to selectively deposit inks onto a variety of surfaces. These inks can have functions including behaving as conductors, dielectrics, or even semiconductors ( Ref 2 , 3...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... that the electrical connection can be understood in the simulator. Alternately, if the design information is to be used for board or chip layout, then the symbol information has to be associated with geometrical information about packages and the physical placement of pins, or (in the case of an integrated circuit...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005838
EISBN: 978-1-62708-167-2
... shows MOSFETS and IGBTs. Fig. 6 Metal-oxide semiconductor field-effect transistors (MOSFETs) and insulated-gate bipolar transistors (IGBTs). Courtesy of Radyne Corporation Integrated Power Modules Integrated power modules take many forms but generally are packaged increments of function...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... corrosion metal whiskers organic-acid-induced corrosion resistors sensors switches silver tarnish wound components relays connectors printed circuit boards hardware THE BROAD SPECTRUM OF ELECTRICAL AND ELECTRONIC COMPONENTS can be divided into two classes: semiconductor devices (i.e., active...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
... and their cost advantage also have attracted the attention of the thin-film (PVD and CVD) community toward thermal spray technology. In recent years, thermal spray processing increasingly has been used to support thin-film processes involved in the fabrication of semiconductor electronics and other related...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001091
EISBN: 978-1-62708-162-7
... in defense applications, because they can send information about five times faster, withstand more radiation, and operate at higher temperatures than comparable silicon-base integrated circuits. Optoelectronic Devices An LED is a semiconductor that emits light when an electric current is passed...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001384
EISBN: 978-1-62708-173-3
... to 0.050 mm (0.001 to 0.002 in.) diameter range. Vibratory action at high frequency (typically, 60 kHz) removes surface contaminants, induces material flow, and permits a solid-state weld between the wire and either the metallized bond pad or the leads on the semiconductor package. A combination...