This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

Spark source mass spectrometry (SSMS) is an analytical technique used for determining the concentration of elements in a wide range of solid samples, including metals, semiconductors, ceramics, geological and biological materials, and air and water pollution samples. This article discusses the basic principles of spark source technique; SSMS instrumentation such as ion source, electric sector, and magnetic sector; sample preparation; and test procedures of SSMS. Some of the related techniques to SSMS are laser ionization mass spectrometry and laser-induced resonance ionization mass spectrometry. The ions produced in SSMS are detected by either the photometric method or electrical detection method and quantitatively measured by techniques such as internal standardization techniques, isotope dilution, multi element isotope dilution, and dry spike isotope dilution. The detected spark source spectrum contains all the elemental data of the tested sample. Finally, the article exemplifies the applications of SSMS.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

Most welding lasers fall into the category of fiber, disc, or direct diode, all of which can be delivered by fiber optic. This article provides a comparison of the energy consumptions and efficiencies of laser beam welding (LBW) with other major welding processes. It discusses the two modes of laser welding: conduction-mode welding and deep-penetration mode welding. The article reviews the factors of process selection and procedure development for laser welding. The factors include power density, interaction time, laser beam power, laser beam diameter, laser beam spatial distribution, absorptivity, traverse speed, laser welding efficiency, and plasma suppression and shielding gas. The article concludes with a discussion on laser cutting, laser roll welding, and hybrid laser welding.

This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.

Surface modification is the alteration of the surface composition or structure using energy or particle beams. This article discusses two different surface modification methods. The first, ion implantation, is the introduction of ionized species into the substrate using kilovolt to megavolt ion accelerating potentials. The second method, laser processing, is high-power laser melting with or without mixing of materials precoated on the substrate, followed by rapid melt quenching. The article also describes the advantages and disadvantages of the surface modification approach to promote corrosion resistance.

This article covers in-line process monitoring of the metal additive manufacturing (AM) methods of laser and electron beam (e-beam) powder-bed fusion (PBF) and directed-energy deposition (DED). It focuses on methods that monitor the component directly throughout the build process. This article is organized by the type of AM process and by the physics of the monitoring method. The discussion covers two types of monitoring possible with the PBF process: monitoring the area of the powder bed and component and monitoring the melt pool created by the laser or e-beam. Methods for layer monitoring include optical and thermal methods that monitor light reflected or emitted in the visible and infrared wavelengths, respectively. Monitoring methods for laser directed-energy deposition (DED) discussed are those that measure the size and shape of the melt pool, the temperature of the melt pool, and the plasma generated by the laser as it interacts with the molten metal.

This article presents a general description of pulsed-laser deposition. It describes the components of pulsed-laser deposition equipment. The article also discusses the effects of angular distribution of materials. Finally, the article reviews the characteristics of high-temperature superconductors and ferroelectric materials.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A quick reference summary of surface-analysis methods is presented in this article.

Hybrid laser arc welding (HLAW) is a metal joining process that combines laser beam welding (LBW) and arc welding in the same weld pool. This article provides a discussion on the major process variables for two modes of operation of HLAW, namely, stabilization mode and penetration mode. The major process variables for either mode of operation include three sets of welding parameters: the variables for the independent LBW and gas metal arc welding processes and welding variables that are specific to the HLAW process. The article discusses the advantages, limitations, and applications of the HLAW and describes the major components and consumables used for HLAW. The components include the laser source, gas metal arc welding source, hybrid welding head, and motion system. The article also describes the typical sources of defects and safety concerns of HLAW.

This article discusses the basic operating principles, industrial applications, and advantages as well as the parameters influencing the process of laser-induced forward transfer (LIFT) of solid materials, liquid materials, laser-absorbing layers, intact structures, and metallic 3D microstructures in additive manufacturing.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.

Laser beam machining removes, melts, or thermally modifies a material by focusing a coherent beam of monochromatic light on the workpiece. This article describes the principal lasers used in metal processing: neodymium-glass, carbon dioxide, and neodymium-doped yttrium aluminum garnet lasers. It discusses the operating parameters of concern in percussion drilling and trepanning. The process variables in surface treatment and laser cutting, as well as the operating parameters of concern in laser welding are reviewed. The article also explains the various categories of surface treatment: heat treating, cladding, surfacing, glazing, and marking.

This article focuses on a variety of laser beam machining (LBM) operations of aluminum and its alloys, namely, laser cutting, laser drilling, laser milling, laser turning, laser grooving, laser scribing, laser marking, and laser micromachining. It presents different approaches for carrying out machining operations, laser processing parameters, efficiency and accuracy of the process, and the effect of laser processing parameters on the quality of the machined surface. The article provides an overview of the various conventional (chip forming) and nonconventional machining techniques employed for aluminum-based materials. A comparison of the various aspects of LBM with other non-conventional techniques is also presented. The article also describes the features of LBM techniques employed for aluminum and its alloys for different types of machining.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

This article endeavors to familiarize the reader with a selection of different ionization designs and instrument components to provide knowledge for sorting the various analytical strategies in the field of solid analysis by mass spectrometry (MS). It begins with a description of the general principles of MS. This is followed by sections providing a basic understanding of instrumentation and discussing the operating requirements as well as practical considerations related to solid sample analysis by MS. Instrumentation discussed include the triple quadrupole mass spectrometer and the time-of-flight mass spectrometer. Inductively coupled plasma and thermal ionization MS provide atomic information, and direct analysis in real-time and matrix-assisted laser-desorption ionization MS are used to analyze molecular compositions. The article describes various factors pertinent to ionization methods, namely glow discharge mass spectrometry and secondary ion mass spectrometry. It concludes with a section on various examples of applications and interpretation of MS for various materials.