In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

This article provides a brief description of load conditions for single-shot heat treating, vertical scanning, and brazing and soldering. It discusses the various power components used in power supplies. These include capacitors, integrated power module, transformers, and various switching devices, namely, silicon-controlled rectifiers, insulated-gate bipolar transistors, and metal-oxide semiconductor field-effect transistors. The article also provides information on frequency-multiplication harmonic-induction power supplies, namely, push-pull and half-bridge inverters and full-bridge inverters. Series resonant and parallel resonant circuits and their tuning calculations associated with output networks are also discussed. The article describes the frequency range of simultaneous dual-frequency induction heating power supply, and discusses the advantages, applications, and technical background of independently controlled frequency and power (IFP) induction heating power supply. It concludes with a description of the developments in control systems for modern induction power supplies.

This article provides a summary of the concepts discussed in the Section “Corrosion in Specific Industries” in the ASM Handbook, Volume 13C:Corrosion: Environments and Industries. This Section applies the fundamental understanding of corrosion and knowledge of materials of construction to practical applications. The industries addressed are nuclear power, fossil and alternative fuel, land transportation, air transportation, microelectronics, chemical processing, pulp and paper, food and beverage, pharmaceutical and medical technology, petroleum and petrochemical, building, and mining and metal processing.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

Design and analysis of electrical/electronic systems and components tends to be different from the corresponding process for most mechanical and hydraulic systems. This article provides an overview of three overlapping phases followed in electrical design: functional, electrical, and physical. It also presents information on the simulation and testing carried out to evaluate the design behavior.

Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

This article reviews the performance of power electronics components, namely, power rectifiers, insulated-gate bipolar transistors, metal-oxide semiconductor field-effect transistors, diodes, and silicon-controlled rectifiers. It provides information on induction heating power supplies with multiple heat stations, such as switching units and multiple (zone) outputs. The article describes power supply operational control and power supply protection circuits. It details duty cycle, power factor, and harmonics of power supplies. The article also describes system parameters, software analysis-calculations, human analysis-decisions, multiple system arrangements, and zone control systems for power supply selection. It provides information on the maintenance of induction power supplies, detailing the safety precautions to be taken and the need for routine inspection and servicing.

This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article provides an overview of the implementation of wire embedding with ultrasonic energy and thermal embedding for polymer additive manufacturing, discussing the applications and advantages of the technique. The mechanical and electrical performance of the embedded wires is compared with that of other conductive ink processes in terms of electrical conductivity and mechanical strength.

This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

This article provides a discussion on transformers and reactors for induction heating. It presents information on the initial considerations in the selection process and the demands of power supply and load circuits. The article describes the types of transformers and reactors used in induction heating and maintenance operations. It also provides a discussion on load matching covering the following topics: initial considerations in the load-matching process, understanding the load circuit and the power supply circuit, selecting the desired operating point, adjusting the value of components, and testing the setup.

Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.

Induction heating system control is straightforward after the design and application of the coil and power supply required for the job. This article provides an overview of the basic components of an induction heating system, including a machine controller (computer or programmable logic controller), interface wiring, an operator interface, and safety controls. It also provides information on programming devices and temperature controllers, such as manual, auto, and auto-manual temperature controllers.

This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.

Chemical-mechanical planarization (CMP) of metals is described as mechanically accelerated corrosion, erosion corrosion, or metallic corrosion enhanced by wear. This article reviews the history, process, chemistry, electrochemistry, and defect issues for CMP. It provides an overview of CMP through a schematic illustration of CMP process equipment. The applications of CMP to tungsten and copper alloys are of prime interest in the semiconductor industry. The article discusses copper CMP and tungsten CMP in detail and analyzes polishing mechanism during CMP by application of direct current potentiodynamic polarization and alternating current impedance measurements. It concludes with information on chemically induced defects such as pitting corrosion, galvanic corrosion, and chemical etching.