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semiconductor industry

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Published: 30 June 2023
Fig. 6 Three designs of a manifold in the semiconductor industry. (a) Conventional design made of polyetheretherketone with hoses (110 g). (b) Monolithic design milled in TiGr5 (200 g). (c) Optimized design printed in TiGr5 (100 g). Adapted from Ref 26 More
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003600
EISBN: 978-1-62708-182-5
... of CMP through a schematic illustration of CMP process equipment. The applications of CMP to tungsten and copper alloys are of prime interest in the semiconductor industry. The article discusses copper CMP and tungsten CMP in detail and analyzes polishing mechanism during CMP by application of direct...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006641
EISBN: 978-1-62708-213-6
...) wafer production. ICP-MS analysis has greatly benefited the semiconductor and PV industries, which require low production costs and high manufacturing yield. The technique enables both industries to maintain a competitive edge. Chemicals The semiconductor industry has some of the most demanding...
Book Chapter

Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003685
EISBN: 978-1-62708-182-5
... of material dislodgement. Sputtering developed very rapidly in the 1970s in the semiconductor industry, in which the technique is essential for mass production. Sputtering is used in corrosion-abatement applications such as high-chromium and nickel-chromium alloy coatings, MCrAlY (where M stands...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
... Corrosion and Oxidation , John Wiley & Sons , 1980 5. Tan A.C. , Chapter 7 (Corrosion) , Tin and Solder Plating in the Semiconductor Industry, a Technical Guide , Chapman and Hall , 1993 6. Camizzoli R.B. , Materials Developments in Microelectronics Packaging Conference...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005746
EISBN: 978-1-62708-171-9
... Ceramic Coatings against Process Plasma in Semiconductor Production Equipment J. Kitamura, H. Ibe, H. Mizuno, and I. Aoki Thermal Spray 2007—Global Coating Solutions 2007 Thermal Spraying Technology and Its Applications in the Iron and Steel Industry in China R.L. Hao Thermal Spray 2007—Global...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... of the microelectronics industry. This section also considers germanium, gallium arsenide (GaAs), and the various epitaxial thin film semiconductors that can be grown on single-crystal wafer substrates. These materials are characterized first by their single-crystal nature and lack of transverse phase domains or grain...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001292
EISBN: 978-1-62708-170-2
... to be produced at room temperature. These include substitutional solid solutions of normally immiscible or low-solubility elements. Such highly metastable and amorphous alloys often possess unique physical and chemical properties. Ion implantation has been used extensively in the semiconductor industry since...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003577
EISBN: 978-1-62708-182-5
... industry; these advances are described in the article “Chemical- Mechanical Planarization for Semiconductors” in this Section. The combination of mechanical abrasion with dissolution of the surface allows the fast planarization of complex structures (e.g., with narrow copper interconnects...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
.... The nonelectromagnetic parameters fall into two distinctly different categories: those involved in fabrication (melting solder, making thermocompression bond, sputtering or evaporating film, diffusing impurities into semiconductors, sintering ceramics), and those involved in operation of the equipment, such as the wire...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001091
EISBN: 978-1-62708-162-7
... in defense applications, because they can send information about five times faster, withstand more radiation, and operate at higher temperatures than comparable silicon-base integrated circuits. Optoelectronic Devices An LED is a semiconductor that emits light when an electric current is passed...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005834
EISBN: 978-1-62708-167-2
..., adhesive bonding, and zone refining of semiconductors, are also amenable to induction heating methods. These applications are briefly discussed as follows. Preheating Prior to Metalworking Induction heating prior to metalworking is well accepted in the forging, rolling, and extrusion industries...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... concentrations in smog Strong oxidant to produce acids that attack most metals Mineral acids (H 2 SO 4 , HCl, HF, HNO 3 ) Pickling industry, chemical industry, metals production, semiconductor industry Most metals, glass, ceramics Organic acids Wood, packing material, animals, preservatives Long-term...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006658
EISBN: 978-1-62708-213-6
... AFMs used in ambient air and liquid environments. It does not include discussion of AFMs used in ultra-high-vacuum environments or specialized AFMs used for manufacturing in the semiconductor and data-storage industries. In addition, there are several types of force sensors that are used in AFMs...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005836
EISBN: 978-1-62708-167-2
... Abstract This article reviews the performance of power electronics components, namely, power rectifiers, insulated-gate bipolar transistors, metal-oxide semiconductor field-effect transistors, diodes, and silicon-controlled rectifiers. It provides information on induction heating power supplies...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006666
EISBN: 978-1-62708-213-6
.... Materials Science in the Semiconductor Industry This area was considered intensively in the first few years of the development of PIXE. An important advantage is that many of the laboratories conducting these analyses possess a particle accelerator for the Rutherford backscattering spectrometry...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... for composites in other aspects of the electronics industry, such as high-speed assembly machine materials of construction, are also examined. Application Requirements and Candidate Materials In the Electronic Materials Handbook , Volume 1 ( Ref 1 ), published in 1989, an overview of composites developed...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004144
EISBN: 978-1-62708-184-9
... detected. Therefore, when corrosion failure occurs, it is often dismissed as just a failure, and the part or component is replaced. This Section discusses corrosion in passive electronic and semiconductor integrated circuits and components. Corrosion in the Chemical Process Industry Before building...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001734
EISBN: 978-1-62708-178-8
... and materials science in the semiconductor industry. Additional information on the applications of PIXE is cited in Ref 10 , 11 , and 12 . Atmospheric Physics and Chemistry One of the earliest uses of PIXE, involving analysis of atmospheric particles for elemental content ( Ref 13 ), is also its most...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
... took place, the semiconductor industry developed a need for high-purity golds at increased thicknesses. This led to a series of formulations by Ehrheart that plated gold from mild acid solutions. Raising the pH resulted in better covering power and higher current efficiency. At first the hardness...