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semiconductor chips

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Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... and contributed to the volumetric improvements beyond those that would have been possible with just the magnetic core and semiconductor chip technologies which are basically planar, two dimensional. Fig. 4 Memory density trends. Source: Ref 5 At the same time, the trend is often toward increasing...
Image
Published: 31 October 2011
Fig. 2 Solid-state microelectronic devices, beginning at the silicon chip level, involve assembly, including by chemical (e.g., deposition and reaction), welding (e.g., die bonding and soldering), and mechanical (e.g., pressure contact) means. Here an assembled electrically erasable More
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
... Abstract In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article...
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001091
EISBN: 978-1-62708-162-7
... in defense applications, because they can send information about five times faster, withstand more radiation, and operate at higher temperatures than comparable silicon-base integrated circuits. Optoelectronic Devices An LED is a semiconductor that emits light when an electric current is passed...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... Abstract This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... multilayer cofired packages may take different forms, such as dual-in-line packages, chip carriers, or pin-grid arrays, but all allow the housing of the semiconductor devices in a strong, thermally stable, and hermetic environment. Composition Formulations for alumina multilayer packages have...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006641
EISBN: 978-1-62708-213-6
.... Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas. inductively coupled plasma mass spectrometry mass analyzer Overview Introduction Inductively coupled plasma mass spectrometry (ICP-MS...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... of Semiconductor Materials” in this Volume). However, the deposition temperatures in a thermally driven CVD process can be quite high (e.g., 700 to 900 °C, or 1300 to 1650 °F, for LPCVD silicon nitride deposition) ( Ref 1 , 9 ) and thus are detrimental to modern silicon devices. Plasma enhancement of the CVD...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... than that of silicon. Coefficients of thermal expansion range between 12 and 18 ppm/K. This can give rise to warpage and high thermal stresses in solder joints when integrated circuits (ICs, or chips) made from silicon and other semiconductors are directly attached to PCBs. To reduce stresses...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006681
EISBN: 978-1-62708-213-6
... for TEM imaging, is based on complementary metal oxide semiconductor technology. Different from the CCD cameras for TEM, DDD cameras do not require a scintillator and optical coupling above the DDD chip, and the DDD chip itself is very thin ( Fig. 15b ). Therefore, signal blurring within the DDD cameras...
Series: ASM Handbook
Volume: 4C
Publisher: ASM International
Published: 09 June 2014
DOI: 10.31399/asm.hb.v04c.a0005836
EISBN: 978-1-62708-167-2
... Abstract This article reviews the performance of power electronics components, namely, power rectifiers, insulated-gate bipolar transistors, metal-oxide semiconductor field-effect transistors, diodes, and silicon-controlled rectifiers. It provides information on induction heating power supplies...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... corrosion metal whiskers organic-acid-induced corrosion resistors sensors switches silver tarnish wound components relays connectors printed circuit boards hardware THE BROAD SPECTRUM OF ELECTRICAL AND ELECTRONIC COMPONENTS can be divided into two classes: semiconductor devices (i.e., active...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006658
EISBN: 978-1-62708-213-6
... AFMs used in ambient air and liquid environments. It does not include discussion of AFMs used in ultra-high-vacuum environments or specialized AFMs used for manufacturing in the semiconductor and data-storage industries. In addition, there are several types of force sensors that are used in AFMs...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... of conductors (e.g., wires, circuit board traces, silicon metallization), functional elements (e.g., motors, integrated circuit chips, registers), and appropriate physical/geometrical relationships. Many details of the process, the design tools, and the analysis depend on the physical scale (e.g. chip...
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003282
EISBN: 978-1-62708-176-4
... the soft portion, and a fine chip is produced during sliding. This behavior changes rather abruptly at a critical value of hardness, where the friction quickly drops to a low value ( Fig. 2 ) and there is little material removal or surface damage. In terms of Fig. 2 it is seen that a point of Vickers...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006770
EISBN: 978-1-62708-295-2
... to the energy of the incoming x-ray. Placing a voltage across the chip makes it function as an intrinsic semiconductor, and the electrons move to one side of the chip while the holes move to the opposite side, producing a charge pulse from the device. Because the charge pulse is proportional to the number...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006657
EISBN: 978-1-62708-213-6
... the surface chemistry and interactions of solid surfaces of metals, semiconductors, ceramics, organic materials, and biomaterials. The techniques use electrons, x-rays, and ions as the probing sources, and the surface chemical information is derived from analysis of electrons and ions emitted from the surface...
Book Chapter

By K. Subramanian
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002152
EISBN: 978-1-62708-188-7
..., kiln furniture Plastics and composites Fiber-reinforced plastics, friction materials, optical lenses Electronic ceramics Integrated circuit chip fabrication, magnetic heads, sensors, optical fibers Engineering ceramics Internal combustion engine parts, wear-resistant parts and bearings...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003600
EISBN: 978-1-62708-182-5
... of CMP through a schematic illustration of CMP process equipment. The applications of CMP to tungsten and copper alloys are of prime interest in the semiconductor industry. The article discusses copper CMP and tungsten CMP in detail and analyzes polishing mechanism during CMP by application of direct...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003834
EISBN: 978-1-62708-183-2
...) strip that matches the coefficient of expansion of ceramics for leadless semiconductor chip carriers. Different expansion rates can be obtained by varying the cladding ratio in the wire or strip materials. Self-brazing materials, such as copper-clad stainless steel (Cu/SS/Cu) and copper-clad steel...