This article describes the test techniques that are available for monitoring crack initiation and crack growth and for obtaining information on fatigue damage in test specimens. These techniques include optical methods, the compliance method, electric potential measurement, and gel electrode imaging methods. The article discusses the magnetic techniques that are primarily used as inspection techniques for detecting fatigue cracks in structural components. It details the principles and operation procedures of the liquid penetrant methods, positron annihilation techniques, acoustic emission techniques, ultrasonic methods, eddy current techniques, infrared techniques, exoelectron methods, and gamma radiography. The article explains the microscopy methods used to determine fatigue crack initiation and propagation. These include electron microscopy, scanning tunneling microscopy, atomic force microscopy, and scanning acoustic microscopy. The article also reviews the X-ray diffraction technique used for determining the compositional changes, strain changes, and residual stress evaluation during the fatigue process.

This article describes the analytical methods for analyzing surfaces for corrosion and corrosion inhibition processes as well as failure analysis based on surface structure and chemical identity and composition. The principles and applications of the surface-structure analysis techniques, namely, optical microscopy, scanning electron microscopy, scanning tunneling microscopy, and atomic force microscopy, are reviewed. The article discusses the principles and applications of chemical identity and composition analysis techniques. These techniques include the energy dispersive X-ray spectroscopy, Auger electron spectroscopy, X-ray photoelectron spectroscopy, ion scattering spectroscopy, reflectance Fourier transform infrared absorption spectroscopy, Raman and surface enhanced Raman spectroscopy, and extended X-ray absorption fine structure analysis.

Nanotechnology and smart-coating technologies have been reported to show great promise for improved performance in critical areas such as corrosion resistance, durability, and conductivity. This article exemplifies nanofilms and nanomaterials used in coatings applications, including carbon nanotubes, silica, metals/metal oxides, ceramics, clays, buckyballs, graphene, polymers, titanium dioxide, and waxes. These can be produced by a variety of methods, including chemical vapor deposition, plasma arcing, electrodeposition, sol-gel synthesis, and ball milling. The application of nanotechnology and the development of smart coatings have been dependent largely on the availability of analytical and imaging techniques such as Raman spectroscopy, scanning and transmission electron microscopy, atomic force microscopy, and scanning tunneling microscopy.

This article provides an overview of scanning probe microscopes (scanning tunneling microscope and atomic force microscope (AFM)), covering the various operating modes and probes used in these instruments and providing information on AFM instrumentation, applications, and analyses.

Fatigue damage in metals is caused by the simultaneous action of cyclic stress, tensile stress, and plastic strain. This article details the fundamental aspects of the stages of the fatigue failure process. These include cyclic plastic deformation prior to fatigue crack initiation, initiation of one or more microcracks, propagation or coalescence of microcracks to form one or more microcracks, and propagation of one or more macrocracks.

Solid-state welding (SSW) processes are those that produce coalescence of the faying surfaces at temperatures below the melting point of the base metal being joined without the addition of brazing or solder filler metal. This article discusses the fundamentals of welding and joining materials via the application of a nonmelting process. The specific processes usually associated with the nonmelting process are discussed.

This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A quick reference summary of surface-analysis methods is presented in this article.

This article reviews quantifying adhesion, bonding, and interfacial characterization and strength in a solid-state welding process. It discusses metal-metal configurations and provides information on experimental work carried out in measuring the mechanical properties of interfaces based on theoretical analysis. A discussion on the properties affecting adhesion is also provided.

This article is a brief account of low-energy ion-scattering spectroscopy (LEIS) for determining the atomic structure of solid surfaces. It begins with a description of the general principles of LEIS. This is followed by a section providing information on the equipment used for LEIS. Various steps involved in the sample preparation, calibration, and data analysis are then discussed. The article concludes with a section on the applications and interpretation of LEIS in material analysis, including discussion on surface structural analysis, layer-by-layer (Frank-van der Merwe) growth, and low-energy atom-scattering spectroscopy.

This article is a compilation of abbreviations, symbols, and tradenames for terms related to the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials.

This article focuses on laboratory atomic force microscopes (AFMs) used in ambient air and liquid environments. It begins with a discussion on the origin of AFM and development trends occurring in AFM. This is followed by a section on the general principles of AFM and a comprehensive list of AFM scanning modes. There is a brief description of how each mode works and what types of applications can be made with each mode. Some of the processes involved in preparation of samples (bulk materials and those placed on a substrate) scanned in an AFM are then presented. The article provides information on the factors applicable to the accuracy and precision of AFM measurements. It ends by discussing the applications for AFMs in the fields of science, technology, and engineering.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.