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Image
Scanning laser acoustic microscopy 100 MHz transmission acoustic image of t...
Available to PurchasePublished: 01 August 2018
Fig. 22 Scanning laser acoustic microscopy 100 MHz transmission acoustic image of the sample shown in Fig. 21 . At this higher frequency, textured variations in the sample are evident that may be due to micro (subresolution) porosity segregations, which cause differential absorption. Field
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Image
Scanning laser acoustic microscopy image showing crack in vicinity of laser...
Available to PurchasePublished: 01 November 1995
Fig. 47 Scanning laser acoustic microscopy image showing crack in vicinity of laser-drilled hole in alumina substrate. Courtesy of Sonoscan, Inc.
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Image
Low-frequency 10 MHz scanning laser acoustic microscopy image of a 25 mm (1...
Available to PurchasePublished: 01 August 2018
Fig. 18 Low-frequency 10 MHz scanning laser acoustic microscopy image of a 25 mm (1 in.) diameter alumina test disk. The disk is very attenuating to ultrasound because of internal defects that cover approximately 75% of the area (dark zones). Field of view: 35 × 26 mm
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Scanning laser acoustic microscopy image at 30 MHz of an alumina test disk ...
Available to PurchasePublished: 01 August 2018
Fig. 21 Scanning laser acoustic microscopy image at 30 MHz of an alumina test disk similar in size to that shown in Fig. 18 . This sample was quite transparent to the ultrasound, as evidenced by the bright, relatively uniform appearance of the acoustic image. Field of view: 14 × 10.5 mm
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Schematic illustrating use of the scanning laser acoustic microscopy throug...
Available to PurchasePublished: 01 August 2018
Fig. 28 Schematic illustrating use of the scanning laser acoustic microscopy through-transmission technique to evaluate the die-attach bond between the silicon die and the ceramic package
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30 MHz transmission scanning laser acoustic microscopy image of a die-attac...
Available to PurchasePublished: 01 August 2018
Fig. 29 30 MHz transmission scanning laser acoustic microscopy image of a die-attach. The dark areas of the image correspond to little or no acoustic wave transmission due to the lack of bonding between the die and the ceramic. The white rectangle outlining the die is generated by an acoustic
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Image
Published: 01 August 2018
Fig. 30 Computer-analyzed scanning laser acoustic microscopy image of Fig. 29 in which the disbonds are clearly displayed as black
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Image
Scanning laser acoustic microscopy (SLAM) through-transmission image produc...
Available to PurchasePublished: 01 August 2018
Fig. 33 Scanning laser acoustic microscopy (SLAM) through-transmission image produced at 10 MHz of the sample shown in Fig. 32 . In this image, the disbonded zones are presented as dark. Careful analysis of Fig. 33 indicates that the disbonded areas in black and white are larger than those
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Image
Scanning laser acoustic microscopy image at 200 MHz of tape-automated-bonde...
Available to PurchasePublished: 01 August 2018
Fig. 35 Scanning laser acoustic microscopy image at 200 MHz of tape-automated-bonded leads on an integrated circuit. The bright areas at the tips of each lead indicate good-quality bonds. Field of view: 1.75 × 1.3 mm
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Scanning laser acoustic microscopy image at 200 MHz of tape-automated-bonde...
Available to PurchasePublished: 01 August 2018
Fig. 36 Scanning laser acoustic microscopy image at 200 MHz of tape-automated-bonded leads that are not of as uniform quality as those shown in Fig. 35 . The poor bonds are mechanically weak and are more likely to suffer from long-term reliability problems. Field of view: 1.75 × 1.3 mm
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Image
Scanning laser acoustic microscopy image at 30 MHz of a plastic-encapsulate...
Available to PurchasePublished: 01 August 2018
Fig. 42 Scanning laser acoustic microscopy image at 30 MHz of a plastic-encapsulated ceramic capacitor having a significant defect that can cause long-term reliability problems. This defect is not evident by electrical testing. Field of view: 14 × 10.5 mm
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Image
Published: 01 November 1995
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... Abstract This article discusses the fundamentals and operating principles of the following acoustic microscopy methods: scanning laser acoustic microscopy, C-mode scanning acoustic microscopy, and scanning acoustic microscopy. It describes the applications of acoustic microscopy for detecting...
Abstract
This article discusses the fundamentals and operating principles of the following acoustic microscopy methods: scanning laser acoustic microscopy, C-mode scanning acoustic microscopy, and scanning acoustic microscopy. It describes the applications of acoustic microscopy for detecting defects in metals, ceramics, glasses, polymers, and composites with examples.
Image
Simplified comparison of three acoustic microscopy techniques, particularly...
Available to PurchasePublished: 01 August 2018
Fig. 8 Simplified comparison of three acoustic microscopy techniques, particularly their zones of application (crosshatched area) within a sample. (a) Scanning laser acoustic microscopy. (b) Scanning acoustic microscopy. (c) C-mode scanning acoustic microscopy
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Image
Comparison of acoustic microscopy applications with C-scan applications, ba...
Available to PurchasePublished: 01 August 2018
Fig. 9 Comparison of acoustic microscopy applications with C-scan applications, based on transducer frequency and wavelength. C-SAM, C-mode scanning acoustic microscopy; SLAM, scanning laser acoustic microscopy; SAM, scanning acoustic microscopy; NDT, nondestructive testing; IC, integrated
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Image
Edge effect in (a) C-mode scanning acoustic microscopy (C-SAM) and (b) scan...
Available to PurchasePublished: 01 August 2018
Fig. 41 Edge effect in (a) C-mode scanning acoustic microscopy (C-SAM) and (b) scanning laser acoustic microscopy (SLAM). In the case of C-SAM, when the transducer is too close to the left edge of a sample having thickness t , the acoustic beam becomes cut off, and the echo signal does
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Image
Published: 01 August 2018
Fig. 43 Cross-sectional analysis of the capacitor shown in Fig. 42 revealing a delamination in the location indicated by scanning laser acoustic microscopy. The cut edge of the capacitor was polished and placed under a conventional microscope.
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Image
Plot of bond area percentage versus pin location to verify that scanning la...
Available to PurchasePublished: 01 August 2018
Fig. 37 Plot of bond area percentage versus pin location to verify that scanning laser acoustic microscopy (SLAM) bond strength analysis agrees with destructive pull tests. Graph shows the similarity between the relative strength of tape-automated-bonded leads, as determined by destructive
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Book Chapter
Testing and Characterization of Ceramics
Available to PurchaseSeries: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003057
EISBN: 978-1-62708-200-6
... include reflected light microscopy using polarized light, scanning electron microscopy, transmission electron microscopy, energy dispersive analysis of X-rays, and wavelength dispersive analysis of X-rays. Macroscopic property characterization involves measurement of porosity, density, and surface area...
Abstract
This article describes testing and characterization methods of ceramics for chemical analysis, phase analysis, microstructural analysis, macroscopic property characterization, strength and proof testing, thermophysical property testing, and nondestructive evaluation techniques. Chemical analysis is carried out by X-ray fluorescence spectrometry, atomic absorption spectrophotometry, and plasma-emission spectrophotometry. Phase analysis is done by X-ray diffraction, spectroscopic methods, thermal analysis, and quantitative analysis. Techniques used for microstructural analysis include reflected light microscopy using polarized light, scanning electron microscopy, transmission electron microscopy, energy dispersive analysis of X-rays, and wavelength dispersive analysis of X-rays. Macroscopic property characterization involves measurement of porosity, density, and surface area. The article describes testing methods such as room and high-temperature strength test methods, proof testing, fracture toughness measurement, and hardness and wear testing. It also explains methods for determining thermal expansion, thermal conductivity, heat capacity, and emissivity of ceramics and glass and measurement of these properties as a function of temperature.
Book Chapter
Rayleigh Wave Nondestructive Evaluation for Defect Detection and Materials Characterization
Available to PurchaseSeries: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006461
EISBN: 978-1-62708-190-0
... structures. air-coupled ultrasonics electromagnetic acoustic transducers lasers nondestructive evaluation nonlinear ultrasonic inspection piezoelectric transducers Rayleigh wave defect detection surface acoustic wave microscopy THIS ARTICLE OFFERS a brief overview of the characteristics...
Abstract
This article provides an overview of the characteristics of Rayleigh waves plus methods for generation and detection of waves, including using piezoelectric transducers or noncontact techniques such as lasers, electromagnetic acoustic transducers, or air-coupled ultrasonics. It reviews the methods for using Rayleigh waves for defect detection and materials characterization, alongside nonlinear ultrasonic inspection and surface acoustic wave (SAW) microscopy. The article concludes with information on the standards that use Rayleigh waves for nondestructive evaluation (NDE) of different structures.
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