This article describes the corrosion resistance and ion release from main transition metallic bearings used as medical devices. It discusses the main issues associated with the in vivo presence of ions and their biocompatibility during the exposure of patients to different aspects of ion toxicity. These include ion concentration and accumulation in organisms, reactive oxygen species and oxidative stress, and carcinogenicity stimulated by the corrosion process and toxic ions release.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

In secondary ion mass spectroscopy (SIMS), an energetic beam of focused ions is directed at the sample surface in a high or ultrahigh vacuum (UHV) environment. The transfer of momentum from the impinging primary ions to the sample surface causes sputtering of surface atoms and molecules. This article focuses on the principles and applications of high sputter rate dynamic SIMS for depth profiling and bulk impurity analysis. It provides information on broad-beam instruments, ion microprobes, and ion microscopes, detailing their system components with illustrations. The article graphically illustrates the SIMS spectra and depth profiles of various materials. The quantitative analysis of ion-implantation profiles, instrumental features required for secondary ion imaging, the analysis of nonmetallic samples, detection sensitivity, and the applications of SIMS are also discussed.

This article focuses on the principles and applications of high-sputter-rate dynamic secondary ion mass spectroscopy (SIMS) for depth profiling and bulk impurity analysis. It begins with an overview of various factors pertinent to sputtering. This is followed by a discussion on the effects of ion implantation and electronic excitation on the charge of the sputtered species. The design and operation of the various instrumental components of SIMS is then reviewed. Details on a depth-profiling analysis of SIMS, the quantitative analysis of SIMS data, and the static mode of operation of time-of-flight SIMS are covered. Instrumental features required for secondary ion imaging are presented and the differences between quadrupole and high-resolution magnetic mass filters are described. The article also reviews the optimum method for analysis of nonmetallic samples and high detection sensitivity of SIMS. It ends with a discussion on a variety of examples of SIMS applications.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

Ores, which consist of the primary valuable mineral, predominant gangue content, valuable by-products, and detrimental impurities, are extracted and directed to mineral processing. This article describes the mineral processing facilities, such as crushers, grinders, concentrators, separators, and flotation devices that are used for particle size reduction, separation of particles according to their settling rates in fluids and dewatering of concentrate particles. It explains the basic principles, flow diagrams, ore concentrate preparation methods, and equipment of major types of metallurgical processes, including pyrometallurgical, hydrometallurgical, and electrometallurgical processes.

This article provides an overview of plasma surface treatments for plastics. It covers the equipment and methods used in plasma processing, providing detailed explanations of the plasma discharge reactions and how they affect surface state and topography. It also provides information on contamination removal, plasma surface modification, plasma-induced grafting, and plasma film deposition.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

Gas analysis by mass spectrometry, or gas mass spectrometry, is a general technique using a family of instrumentation that creates a charged ion from a gas phase chemical species and measures the mass-to-charge ratio. This article covers gas analysis applications that do not use chromatographic separation to physically isolate components of the sample prior to analysis. It is intended to provide an understanding of gas analysis instrumentation and terminology that will help make informed decisions in choosing an instrument and methodology appropriate for the data needed. Mass-analyzer technologies for gas mass spectrometry, namely quadrupole mass filters, magnetic sector mass filters, and time-of-flight mass analyzers are covered. Common factors to consider in choosing an analyzer for static or continuous gas measurement are also described. In addition, the article presents some examples of applications of gas mass spectrometry.

This article provides a background of the complex relationship between titanium and its alloys with aqueous environments, which is dictated by the presence of a passivating oxide film. It describes the corrosion vulnerability of titanium and titanium oxides by the classification of oxide failure mechanisms. The mechanisms are spatially localized oxide film breakdown by the ingress of aggressive anions; spatially local or homogenous chemical dissolution of the oxide in a strong reducing-acid environment; and mechanical disruptions or depassivation such as scratching, abrading, or fretting. Titanium alloys can be classified into three primary groups such as titanium alloys with hexagonal close-packed crystallographic structure; beta titanium alloys with body-centered cubic crystallographic structures; and alpha + beta titanium alloys including near-alpha and near-beta titanium alloys. The article also illustrates the effects of alloying on active anodic corrosion of titanium and repassivation behavior of titanium and titanium-base alloys.

Electrochemical, or electrode, reactions occur with charge transfer between neutral or ionic reactants and a conducting material called the electrode. This article discusses cathodic reactions that result in reduction and anodic reactions that result in oxidation. It reviews the effects of an electric field near an electrode and illustrates the solvation of ions in metal-aqueous solution.

A potential pH diagram is a graphical representation of the relations, derived from the Nernst equation, between the pH and the equilibrium potentials (E) of the most probable electrochemical reactions occurring in a solution containing a specific element. This article describes three types of reactions for calculation and construction of E-pH diagrams: electrochemical reactions of pure charge (electron) transfer; reactions involving both electron and solvated proton transfer; and acid-base reactions of pure solvated proton transfer. It illustrates the practical use of E-pH diagrams for temperature aqueous solutions and adsorbed species and in prediction of corrosion of nickel and copper.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article provides an overview of exogenous and indigenous inclusions. It discusses the general concepts of phase diagrams, thermochemical relationships, and reaction rates, along with their practical significance. The article describes the most common techniques for controlling the occurrence of inclusions in any cast metal. It presents a discussion on the inclusions in ferrous and nonferrous alloys, including steels, cast irons, aluminum alloys, copper alloys, and magnesium alloys.

This article reviews the corrosion behavior of intermetallics for the modeling of the corrosion processes and for devising a strategy to create corrosion protective systems through alloy and coating design. Thermodynamic principles in the context of high-temperature corrosion and information on oxidation; sulfidation; hot corrosion of NiAl-, FeAl-, and TiAl-based intermetallics; and silicides are included. The article explores the thermodynamic consideration, ordering influencing kinetics, stress-cracking corrosion, and hydrogen embrittlement of aqueous corrosion. It also explains the practical issues dealing with the corrosion problems.

This article provides an overview of curing techniques, adhesive chemistries, surface preparation, adhesive selection, and medical applications of adhesives. The curing techniques are classified into moisture, irradiation, heat, and anaerobic. The article highlights the common types of curable adhesives used for medical device assemblies, including acrylics, cyanoacrylates, epoxies, urethanes, and silicones. Other forms of adhesives, such as hot melts, bioadhesives, and pressure-sensitive adhesives, are also discussed. The typical characteristics and applications of biocompatible medical device adhesives are listed in a table. The article concludes with a section on the selection of materials for medical adhesives.

This article describes the processes involved in photochemical aging and weathering of polymeric materials. It explains how solar radiation, especially in the UV range, combines with atmospheric oxygen, driving photooxidation and the development of unstable photoproducts that cause various types of damage when they decompose, including the scission of carbon bonds and polymer chains. The article illustrates some of the degradation reactions that occur in different polymers and presents an overview of the strategies used to prevent such reactions or otherwise mitigate their effects.