Search Results for quantitative image analysis

This article reviews the essential parts of the complex process of quantitative image analysis to assist automatic image analysis in laboratories. It describes the basic difference between the bias of classical manual stereological analysis and quantitative image analysis. The article concentrates on the basic properties of digital measurements that are the core of quantitative image analysis. It provides a brief description of the specimen and apparatus preparation as well as the image acquisition. The article explains how to evaluate stereological parameters and provides the general rules and guidelines for optimization of image processing algorithms from the viewpoint of shape quantification. It concludes with examples that demonstrate the usefulness of automatic image analysis in comparison to manual methods.

Quantitative image analysis has expanded the capabilities of surface analysis significantly with the use of computer technology. This article provides an overview of the quantitative image analysis and optical microscopy. It describes the various steps involved in surface preparation of samples prone to abrasion damage and artifacts for quantitative image analysis.

Particle size and size distribution have a significant effect on the behavior of metal powders during their processing. This article provides an overview of the sample preparation process for particle size measurement, which is a key step in the measurement of particle size distributions. Common particle size measuring techniques discussed in this article include sieve analysis, quantitative image analysis, laser diffraction, sedimentation methods, aerodynamic time-of-flight method, electrical zone sensing, and photon correlation spectroscopy. The advantages and disadvantages of these methods are reviewed.

This article reviews the main theoretical and practical aspects of sequence normally followed in digital image-acquisition, processing, analysis, and output for material characterization. It discusses the main methods of digital imaging, image processing, and analysis, as applied to microscopy of materials. The article describes the basic concepts of sampling and resolution and quantization of light microscopy, scanning electron microscopy, and transmission electron microscopy. It discusses the acquisition of a digital image that accurately represents the sample under observation and output of the image to a printer. The methods used to enhance the digital image and to extract quantitative information are also described. Different types of image segmentation, namely, adaptive segmentation and contour-based segmentation, are reviewed. The article also presents case studies on the application of image processing and analysis to materials characterization.

The development of quantitative fractography (QF) parameters basically requires topological data of a fracture surface that can be derived from the stereological analysis of multiple projected scanning electron microscope (SEM) images; the profilometry-based techniques that measure the fracture surface profile along x-y sections of a fracture surface from metallographic sections or nondestructive techniques; and the three-dimensional reconstruction of the fracture surface topology using imaging methods such as stereo SEM imaging and confocal scanning laser microscopy. These three general methods of assessing fracture surface topology are reviewed in this article.

This article focuses on the principles and applications of high-sputter-rate dynamic secondary ion mass spectroscopy (SIMS) for depth profiling and bulk impurity analysis. It begins with an overview of various factors pertinent to sputtering. This is followed by a discussion on the effects of ion implantation and electronic excitation on the charge of the sputtered species. The design and operation of the various instrumental components of SIMS is then reviewed. Details on a depth-profiling analysis of SIMS, the quantitative analysis of SIMS data, and the static mode of operation of time-of-flight SIMS are covered. Instrumental features required for secondary ion imaging are presented and the differences between quadrupole and high-resolution magnetic mass filters are described. The article also reviews the optimum method for analysis of nonmetallic samples and high detection sensitivity of SIMS. It ends with a discussion on a variety of examples of SIMS applications.

In secondary ion mass spectroscopy (SIMS), an energetic beam of focused ions is directed at the sample surface in a high or ultrahigh vacuum (UHV) environment. The transfer of momentum from the impinging primary ions to the sample surface causes sputtering of surface atoms and molecules. This article focuses on the principles and applications of high sputter rate dynamic SIMS for depth profiling and bulk impurity analysis. It provides information on broad-beam instruments, ion microprobes, and ion microscopes, detailing their system components with illustrations. The article graphically illustrates the SIMS spectra and depth profiles of various materials. The quantitative analysis of ion-implantation profiles, instrumental features required for secondary ion imaging, the analysis of nonmetallic samples, detection sensitivity, and the applications of SIMS are also discussed.

This article outlines the beam/sample interactions and the basic instrumental design of a scanning electron microscopy (SEM), which include the electron gun, probeforming column (consisting of magnetic electron lenses, apertures, and scanning coils), electron detectors, and vacuum system. It discusses the contrasts mechanisms used for imaging and analyzing materials in the SEM. These include the topographic contrast, compositional contrast, and electron channeling pattern and orientation contrast. Special instrumentation and accessory equipment used at elevated pressures and during the X-ray microanalysis are reviewed. The article also provides information on the sample preparation procedure and the materials applications of the SEM.

This article provides an overview of the general methods of metal powder production. It details the primary methods for particle sizing used in additive manufacturing: sieving, laser diffraction and scattering, and digital image analysis. Methods of interpreting and understanding particle size distribution (PSD) data are presented, with an emphasis on the differences between count- and volume-based PSDs. The article then outlines practices for both qualitative and quantitative assessment of particle morphology.

This article reviews many commonly used stereological counting measurements and the relationships based on these parameters. The discussion covers the processes involved in sampling and specimen preparation. Quantitative microstructural measurements are described including volume fraction, number per unit area, intersections and intercepts per unit length, grain size, and inclusion content.

Microstructural analysis is the combined characterization of the morphology, elemental composition, and crystallography of microstructural features through the use of a microscope. This article reviews three types of the most commonly used electron microscopies in metallurgical studies, namely scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy. It briefly describes the operating principles, instrumentation which includes energy dispersive X-ray detectors, spatial resolution, typical use of the techniques, elemental analysis detection threshold and precision, limitations, sample requirements, and the capabilities of related techniques.

This article describes the various steps involved in image analysis, including sample selection and preparation, image preprocessing, measurement, and data analysis and output. It reviews various types of image analyzers and explains how operator bias and poor sample selection and preparation practices can lead to measurement error. It also examines several applications, illustrating how microstructural measurements can be used to assess quality control and better understand how processing changes affect microstructure and, in turn, material properties and behavior.

X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.

Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.

The principal objective of quantitative fractography is to express the characteristics of features in the fracture surface in quantitative terms, such as the true area, length, size, spacing, orientation, and location. This article provides a detailed account of the development of more quantitative geometrical methods for characterizing nonplanar fracture surfaces. Prominent techniques for studying fracture surfaces are based on the projected images, stereoscopic viewing, and sectioning. The article provides information on various roughness and materials-related parameters for profiles and surfaces. The applications of quantitative fractography for striation spacings, precision matching, and crack path tortuosity are also discussed.

The quantitative characterization of fracture surface geometry, that is, quantitative fractography, can provide useful information regarding the microstructural features and failure mechanisms that govern material fracture. This article is devoted to the fractographic techniques that are based on fracture profilometry. This is followed by a section describing the methods based on scanning electron microscope fractography. The article also addresses procedures for three-dimensional fracture surface reconstruction. In each case, sufficient methodological details, governing equations, and practical examples are provided.

Electron probe microanalysis (EPMA) makes it possible to combine structural and compositional analysis in one operation. This article describes the basic concepts of microanalysis and the processing of EPMA that involves the measurement of the characteristic X-rays emitted from a microscopic part of a solid specimen bombarded by a beam of accelerated electrons. It provides information on the various aspects of energy-dispersive spectrometry (EDS) and wavelength-dispersive spectrometry (WDS), and elucidates the qualitative analysis of the major constituents of EDS and WDS. The article includes information on the analog and digital compositional mapping of elemental distribution, and describes the strengths and weaknesses of WDS and EDS spectrometers in X-ray mapping. It also outlines the application of EPMA for solving various problems in materials science.

This article discusses the capabilities and limitations of various material characterization methods that assist in the selection of a proper analytical tool for analyzing particulate materials. Commonly used methods are microanalysis, surface analysis, and bulk analysis. The techniques used for performing microanalysis include scanning electron microscopy and electron probe X-ray microanalysis. The article describes surface analysis techniques, including Auger electron spectroscopy, X-ray photoelectron spectroscopy, and ion-scattering spectroscopy. Bulk analysis techniques, such as X-ray powder diffraction, inductively coupled plasma atomic emission spectroscopy, atomic absorption spectroscopy, and atomic fluorescence spectrometry, are also discussed.

This article briefly discusses popular techniques for metals characterization. It begins with a description of the most common techniques for determining chemical composition of metals, namely X-ray fluorescence, optical emission spectroscopy, inductively coupled plasma optical emission spectroscopy, high-temperature combustion, and inert gas fusion. This is followed by a section on techniques for determining the atomic structure of crystals, namely X-ray diffraction, neutron diffraction, and electron diffraction. Types of electron microscopies most commonly used for microstructural analysis of metals, such as scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy, are then reviewed. The article contains tables listing analytical methods used for characterization of metals and alloys and surface analysis techniques. It ends by discussing the objective of metallography.