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printed wiring boards

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Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
...Abstract Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
... of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001395
EISBN: 978-1-62708-173-3
... technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... WAVE SOLDERING is one of the primary techniques for mass assembly of printed wiring boards involving through holes, surface mount devices, or a combination of these two technologies. A schematic of the wave soldering process is shown in Fig. 1 . A solder “fountain” or “wave” is created by a pump...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003216
EISBN: 978-1-62708-199-3
... chelate system. These deposits are typically fine grain and exhibit good deposit integrity. They are suitable for applications such as subtractive printed wiring boards, where an electrolytic plateup process follows immediately after copper deposition. High (Heavy) Build High (heavy) build deposits...
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002158
EISBN: 978-1-62708-188-7
... lower strength materials are involved. Applications include the following: Cutting of printed circuit boards Cutting of board materials Cutting of lightweight fiber-reinforced plastics Integration into robotic systems Wire stripping Crosscutting Cutting foods Cutting web...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
..., and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware. capacitors corrosion passive electrical components electrochemical metal migration fretting halide...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... thick, 100 μm wide 10 cm 2.86 40-gage copper wire 80 μm diameter 10 cm 0.33 36-gage copper wire 120 μm diameter 10 cm 0.15 32-gage copper wire 200 μm diameter 10 cm 0.05 Laser direct structuring bulk copper 37 μm thick, 100 μm wide 10 cm 0.45 PCB, printed circuit board...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
..., materials such as aluminum, alloy-42, copper alloys, tin and tin-lead alloys, nickel, gold, palladium, and palladium-silver are employed in lead frame materials, pad metallurgies, lead finishes, etc. At the second level assembly where the packages are assembled onto the printed wiring board...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... applications have many design similarities but the manufacturing techniques are very different. Large electrical/electronic systems often consist of printed circuit boards interconnected by more or less organized wiring within a cabinet, vehicle, building, or larger complex. The process of using...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0005586
EISBN: 978-1-62708-170-2
...) in pounds per square inch PSII plasma-source ion implantation PSZ partially stabilized zirconia PTFE polytetrafluoroethylene PTH plated-through-hole (printed wiring board) PVC polyvinyl chloride PVD physical vapor deposition PWB printed wiring board...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... between the bulk soldering area and printed circuit board (PCB) Conductive layer on the PCB Nonconductive part at the PCB Figure 5 shows a schematic diagram and failure modes for the solder joint system defined by the Interconnection and Packaging Circuits (IPC) 9708 standard. Fig. 5...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
... to bare die and eliminating wire bonds; however, this approach requires an extra print of an insulator around the component. This insulator increases the ruggedness and serves as a ramp for the printed conductive line, which eliminates the inductance issue ( Fig. 11 ). The printed lines and insulator must...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001344
EISBN: 978-1-62708-173-3
... the precursors of printed wiring boards (PWBs). By the late 1950s, wave soldering had been developed in England and soon thereafter reached the United States. This development was necessitated by the introduction of PWBs. Wave soldering continued to be the method of choice through the 1980s and is still widely...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005743
EISBN: 978-1-62708-171-9
..., with applications in printing (newspapers, magazines, catalogues, books, artwork, currency, posters, and signs), hygiene paper products (tissue, napkins, and towels), packaging (board, liners, and wrapping), and as specialty papers (cigarette, wall/decorative paper, and thermopapers). Key properties of paper...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006565
EISBN: 978-1-62708-290-7
... (a) a pocket is laser micromachined into a circuit board, (b) the bare die is transferred into the pocket via laser-induced forward transfer, and (c) interconnects are laser printed for electrical connections (not to scale) Fig. 10 (a) Scanning electron micrograph of embedded light-emitting diode...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... on an assembled printed wiring board at isothermal conditions with the temperature usually set above the ambient condition ( Ref 1 ). A portion of the applied deformation is transferred to the solder joints and causes the joints to fail. Proper selection of the deformation, test temperature, and cyclic frequency...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
... (which is the metallic portion of an assembled IC package and is used to complete the electrical connection path from the die to defined circuit elements of a printed board assembly), or a patterned laminate (also known as a plastic interposer, commonly with plated copper traces). The terminations...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001346
EISBN: 978-1-62708-173-3
... form, with the components already attached. Attachment is normally accomplished through the soldering process. The most common form of this substrate is the printed wiring board (PWB). A substrate can actually have numerous forms: Circuitry can be laid on one side of the substrate or on both...