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printed wiring boards

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
... electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003216
EISBN: 978-1-62708-199-3
... such as subtractive printed wiring boards, where an electrolytic plateup process follows immediately after copper deposition. High (heavy) build deposits 2 to 3 μm in about 20 min and typically operates at elevated temperature (35 to 55 °C, or 95 to 130 °F), but room-temperature formulations are...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0005586
EISBN: 978-1-62708-170-2
... relative to ambient pressure) in pounds per square inch PSII plasma-source ion implantation PSZ partially stabilized zirconia PTFE polytetrafluoroethylene PTH plated-through-hole (printed wiring board) PVC polyvinyl chloride PVD physical vapor deposition PWB...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.9781627081733
EISBN: 978-1-62708-173-3
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001250
EISBN: 978-1-62708-170-2
... resistance. These include radio and television chassis, computer frames, integrated circuit chip leads, tags, connectors, lead frames, printed wiring boards, and copper wire. Electrodeposited tin is also used on food handling equipment, such as steel baking pans, sieves, can openers, and fasteners. In...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003032
EISBN: 978-1-62708-200-6
... fiber types for improved composite designs. Table 10 and Figs. 105 , 106 , 107 , and 108 show properties data. Applications include aerospace wing skin ribs, helicopter firewalls, and printed wiring boards ( Ref 73 , 74 , 75 , 76 ). Table 10 Physical properties and service...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001242
EISBN: 978-1-62708-170-2
.... Pyrophosphate alkaline copper solutions are seldom used because they are difficult to control and have limited operating ranges. They are used primarily to produce thick deposits because they exhibit good plating rates. They also find some use in through-hole printed wiring board applications...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003048
EISBN: 978-1-62708-200-6
... for interior walls has created new needs for sealants. Wiring conduits are sealed into the metal frames, where the wires are tacked into place and sealed to prevent damage. Communications and security system wiring are also sealed in place. Sealant applications fall into three very broad categories...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.9781627082907
EISBN: 978-1-62708-290-7
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... character of the body. In some cases, the nonalumina additives may be melted to form a glass and then added to the alumina in that prereacted form. Whatever the formulations, they must be compatible with the printed metallization, usually either tungsten or molybdenum, which is cofired along with the...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003010
EISBN: 978-1-62708-200-6
... isolated for use as laminating and molding resins. Cyclotrimerization is resumed upon reheating, with development of cured-state properties identical to those obtained through uninterrupted heating of the monomer. Cure catalysts are normally added to accelerate conversion. Printed wiring boards...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003047
EISBN: 978-1-62708-200-6
... contact with either the adhesive or volatile substances that exude from it. Adhesives used with printed circuits and similar electrical applications must not corrode copper conductors or other associated components. Sometimes the adhesive mixing, application conditions, and curing conditions can influence...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001226
EISBN: 978-1-62708-170-2
... Moderately alkaline, specially inhibited to prevent etching of metal, or neutral synthetic (usually in liquid form) Copper and brass (also silver, gold, tin, lead, and solder) Printed circuit boards, waveguides, switch components, instrument connector pins, jewelry (before and after plating), ring...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006770
EISBN: 978-1-62708-295-2
... line scan on a metallographically prepared section of a printed circuit board with multiple failed solder connections. The line scans indicate a phosphorus-rich zone along the solder interface. The phosphorus-rich layer is typical of an undesirable condition on circuit boards called black pad, which is...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006657
EISBN: 978-1-62708-213-6
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... bearings are plated with tin-lead or tin-lead-copper alloys containing 7 to 10% Sn, whereas an alloy containing 55 to 65% Sn is plated onto printed circuit boards. Tin-lead plating on circuit boards acts as an etch-resistant coating and facilitates soldering of board components after they have been...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003150
EISBN: 978-1-62708-199-3
... susceptible to cracking when annealed after light working (“firecracking”). Gold is used to a considerable extent in electronic devices, particularly in printed circuit boards, connectors, keyboard contactors, and miniaturized circuitry. Because electronic devices employ low voltages and currents, it is...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001267
EISBN: 978-1-62708-170-2
... properties and applications Availability 0.1–1% B, bal Ni 520–620 Electronic applications, replacement for gold in microelectronic equipment and printed wire circuit boards Production 2–4.5% B, bal Ni 750–800 Aircraft engines, landing gear, valves, and pumps; resistance to galling, fretting...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
... addition of controlled amounts of metallic and nonmetallic additives. At virtually the same time, transistors required high-purity gold that could be doped with antimony or indium to give n- or p-type junctions. The printed circuit industry required gold electroplates that could be produced from...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003213
EISBN: 978-1-62708-199-3
... constraints (batch vs. continuous operations), as well as the thickness, composition, and physical nature (cracks) of the scale. Pickling is applicable for many types of forgings and castings, for merchant bar, blooms, billets, sheet, strip, wire, and for tubing. ABRASIVE BLAST CLEANING...