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Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... 10. Menke J.T. , “Military Electronics—A History and Projection,” Paper 328, Corrosion/89 (New Orleans, LA), National Association of Corrosion Engineers , 1989 11. Duffek E. and Armstrong E. , Printed Circuit Board Etch Characteristics , Met. Finish. , Oct 1968 , p...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... between metal terminal and encapsulant at terminal entry of thick-film-hybrid resistor network Fig. 24 Copper migration and corrosion on surface of failed printed circuit board Fig. 23 Tin dendrites growing between two adjacent solder joints on failed printed circuit board Fig...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
...Abstract Abstract This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003367
EISBN: 978-1-62708-195-5
... °F, cure) Bisphenol A dicyanate Crystal powder, viscous liquids, solid flake, solution 9–14 20–30 Radomes, multilayer high-speed printed circuit boards, solvent for thermoplastics Ortho methyl dicyanate Crystal powder, semisolid, amorphous solid 11–14 25–30 Radomes, primary...
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002158
EISBN: 978-1-62708-188-7
... of printed circuit boards Cutting of board materials Cutting of lightweight fiber-reinforced plastics Integration into robotic systems Wire stripping Crosscutting Cutting foods Cutting web materials Cutting of Printed Circuit Boards Cutting of Board Materials Robotics Wire...
Book Chapter

By Mark Cowell
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001393
EISBN: 978-1-62708-173-3
...-Voltage Variable-Temperature Temperature-Controlled When selecting a soldering iron, potential damage to the printed circuit board and its components must be considered. Damage can result from excessive joint temperatures or electrical overstress. Thermal damage can result from an iron...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... (EIA 618-1994), and EDIF 400 (EIA 682-1996), Electronic Industries Association , Arlington, VA Standards Schematic Capture Simulation and Testing Other Analysis Printed Circuit Board Layout Test Design Functional Phase Electrical Phase Physical Phase Functional Phase...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
...Abstract Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly...
Book Chapter

Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003364
EISBN: 978-1-62708-195-5
... solvents such as N-methylpyrrolidone, dimethylformamide, and the like, and therefore can be processed via solution techniques to prepreg. Kerimide 601 was mainly used in glass fabric laminates for electrical applications and became the industry standard for polyimide-based printed circuit boards. Recently...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001261
EISBN: 978-1-62708-170-2
... Force activities have generated instructions for selective plating of specific hardware or components at specific military facilities. In the electronics field, the repair of printed circuit boards for military applications is authorized by MIL-STD-865C. For commercial applications, the Institute...
Book Chapter

Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004221
EISBN: 978-1-62708-184-9
... Fig. 1 Copper migration and copper corrosion by-products on surface of failed printed circuit board. See the article “Corrosion in Passive Electrical Components” in this Volume. Fig. 2 Tin dendrites growing between two adjacent solder joints on failed printed circuit board. See...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001226
EISBN: 978-1-62708-170-2
..., specially inhibited to prevent etching of metal, or neutral synthetic (usually in liquid form) Copper and brass (also silver, gold, tin, lead, and solder) Printed circuit boards, waveguides, switch components, instrument connector pins, jewelry (before and after plating), ring bearings Chips, shop dirt...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
... thick, 100 μm wide 10 cm 0.45 PCB, printed circuit board Fig. 7 High-voltage propulsion with embedded wires. Source: Ref 37 Fig. 8 Capacitive sensing for clean water versus saltwater. Source: Ref 45 Fig. 4 1U/3U CubeSat mechanical structures with embedded...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006770
EISBN: 978-1-62708-295-2
... composition variations at areas of interest on a sample surface or prepared specimen. Figure 13 shows a line scan on a metallographically prepared section of a printed circuit board with multiple failed solder connections. The line scans indicate a phosphorus-rich zone along the solder interface...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... are plated with tin-lead or tin-lead-copper alloys containing 7 to 10% Sn, whereas an alloy containing 55 to 65% Sn is plated onto printed circuit boards. Tin-lead plating on circuit boards acts as an etch-resistant coating and facilitates soldering of board components after they have been inserted...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003161
EISBN: 978-1-62708-199-3
... of very thick multilayer printed circuit boards. Assembly operations, such as surface mounting, where the integrated circuit packages would be vulnerable to thermal damage at the temperatures required for conventional tin-lead soldering Assembly operations using injection-molded circuit boards where...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003680
EISBN: 978-1-62708-182-5
... support Electromagnetic Insulating properties Printed circuit board, integrated circuit board, electric cable Dielectric properties Electrolytic capacitor, humidity sensor, gas sensor, printing roller Magnetism Magnetic recording device, rotary encoder Optical Luminescence...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003353
EISBN: 978-1-62708-195-5
...-glasses by end use. Compositions containing 5 to 10 wt% by weight of boron oxide are certified for printed circuit board and aerospace applications. Compositions containing 0 to 10 wt% by weight of boron oxide are certified for general applications. According to these standards, E-glass compositions...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... 3. Raffalovich A.J. , Corrosive Effects of Solder Fluxes on Printed Circuit Boards , IEEE Trans. Components, Hybrids, Mfg. Technol. , Vol 7 ( No. 4 ), 1971 , p 155 – 162 4. Yasuda K. , Umemura S. , and Aoki T. , Degradation Mechanisms in Tin and Gold Plated...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001242
EISBN: 978-1-62708-170-2
... in the plating solution. Normal bath composition is restored by discarding a portion of the bath and adding water and sulfuric acid. To improve the throwing power of some bright copper sulfate baths used for plating printed circuit boards, a low copper sulfate and high sulfuric acid electrolyte is used...