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Image
Published: 30 August 2021
Fig. 24 Simplified daisy chain circuit. PCB, printed circuit board; NSMD, nonsolder mask defined; ENIG, electroless nickel and immersion gold
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Published: 01 January 2006
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Published: 01 December 2004
Fig. 13 Sn-40Pb alloy, section of a wave-soldered printed circuit board joint that was thermally cycled. Structure shows a thermal fatigue crack propagating through the tin-lead fillet. The tin-lead structure has coarsened in the highly stressed region near the crack. Etchant 7, Table 1 . 80×
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Image
Published: 01 June 2024
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Published: 01 June 2024
Fig. 26 Typical pad cratering failure modes on a printed circuit board. (a) Mode A: with fiber exposure. Original magnification: 140×. (b) Mode B: without fiber exposure. Original magnification: 160×. Source: Ref 17
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Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... Abstract This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information...
Abstract
This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects...
Abstract
This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware. capacitors corrosion passive electrical components electrochemical metal migration fretting halide-induced...
Abstract
This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.
Book: Composites
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003367
EISBN: 978-1-62708-195-5
.... It describes the processing procedures for the cyanate ester resins and provides information on properties for selected applications, such as space applications, radomes, and printed circuit boards. cyanate ester resins radomes high-temperature polyimides space applications printed circuit board...
Abstract
Cyanate ester resins are a family of high-temperature thermosetting resins that bridge the gap in thermal performance between engineering epoxy and high-temperature polyimides. This article discusses the chemistry, properties and characteristics of the cyanate ester resins. It describes the processing procedures for the cyanate ester resins and provides information on properties for selected applications, such as space applications, radomes, and printed circuit boards.
Image
Published: 15 January 2021
Fig. 13 Energy-dispersive spectrometer (EDS) line scan on a polished cross at the bond interface of a solder joint for a component on a printed circuit board. A high concentration of phosphorus indicates degradation of the electroless nickel plating during subsequent gold plating
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Published: 01 August 2018
Fig. 6 Different gray-scale images of an integrated circuit (IC) module on a printed circuit board. (a) Binary. (b) 8-level gray scale. (c) 64-level gray scale. Courtesy of Cognex Cooperation
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Image
Published: 01 December 2004
Fig. 12 Scanning electron micrograph of Sn-40Pb alloy wave-soldered printed circuit board joint that was thermally cycled. Micrograph shows a typical thermal fatigue crack in the joint. The crack is at a 45° angle to the circuit lead and totally encircles it. 50×
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Published: 30 August 2021
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Published: 30 August 2021
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Published: 01 January 2006
Fig. 23 Tin dendrites growing between two adjacent solder joints on failed printed circuit board
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Published: 30 August 2021
Fig. 5 Schematic diagram and failure modes of a solder joint. IMC, intermetallic compound; PCB, printed circuit board
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Published: 30 August 2021
Fig. 15 Solder mask defined and nonsolder mask defined pad opening configurations. PCB, printed circuit board
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Published: 30 August 2021
Fig. 11 Formation of a cold-soldered joint caused by warpage. PCB, printed circuit board; BGA, ball grid array
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Published: 01 June 2024
Fig. 12 Dominant solder joint failure modes. IMC, intermetallic compound; PCB, printed circuit board. Source: Ref 4
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Published: 30 August 2021
Fig. 20 Schematic representation of development of thermal-cycling-induced strains in a ceramic ball grid array package. PCB, printed circuit board
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