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1-4 of 4 Search Results for
postsintering heat treatment
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Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003166
EISBN: 978-1-62708-199-3
... determines which, if any, postsinter heat treatments will be needed. Nickel-iron ratios in the range of 2 to 4 are most common, as material in this range can be safely processed without concern for intermetallic precipitation in the binder and consequent embrittlement. Below a nickel-iron ratio of...
Abstract
Very high density materials are used for such applications as counterweights and radiation shields. This article focuses on the metallurgy, processing, properties, fabrication, design considerations, health and safety considerations, and applications of the most commonly used very high density materials: depleted uranium and tungsten and their alloys.
Series: ASM Handbook
Volume: 4E
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.hb.v04e.a0006255
EISBN: 978-1-62708-169-6
... the furnace. Oxygen in solution can segregate to grain boundaries and cause brittle behavior. Hydrogen also prevents loss of material due to oxide evaporation. Material annealed in hydrogen does not require postanneal chemical cleaning or other treatment to remove stains or traces of oxidation...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
..., and good thermal shock resistance. Alumina is currently the most widely used ceramic substrate material, because it satisfies most requirements. Beryllia, because of its high thermal conductivity, is used where heat dissipation is critical. Aluminum nitride combines high thermal conductivity with an...
Abstract
Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.9781627082907
EISBN: 978-1-62708-290-7