Search Results for plating solutions

Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.

Electrodeposition of tin alloys is used to protect steel against corrosion or wear, to impart resistance to etching, and to facilitate soldering. This article focuses on the compositions, operating conditions, advantages, and limitations of methane sulfonic acid plating solutions and fluoborate plating solutions for tin-lead. It briefly describes the solution compositions and operating conditions of tin-bismuth, tin-nickel, and tin-zinc.

Hard chromium plating is produced by electrodeposition from a solution containing chromic acid and a catalytic anion in proper proportion. This article presents the major uses of hard chromium plating, and focuses on the selection factors, plating solutions, solution and process control, equipment, surface preparation, and crack patterns and other characteristics of hard chromium plating. It offers recommendations for the design and use of plating racks, describes the problems encountered in hard chromium plating, and their corrective procedures. The article provides information on the removal of chromium plate from coated metals, recovery and disposal of wastes, and stopoff media for selective plating.

Copper alloys are widely used as electroplated coatings. They can also be used with practically any substrate material that is suitable for electroplating. This article focuses on the solution composition and operating conditions for brass and bronze plating solutions. It describes the decorative and engineering applications of brass and bronze plating. The article also provides information on the treatment of waste water from brass and bronze plating operations.

Chromium alloys yield alloy coatings with properties that range from completely satisfactory to marginally acceptable, depending on the end use. This article provides a detailed description of plating solutions and deposition conditions and rates of chromium-iron, chromium-nickel, and chromium-iron-nickel alloys.

This article discusses the process considerations and deposit properties of nickel plating. It describes the Watts solution and the anode materials used. The article focuses on the nickel plating processes used for decorative, engineering, and electroforming purposes. It provides information on the quality control of nickel plating. It concludes with a review of the environmental, health, and safety considerations associated with nickel plating.

Electroless nickel plating is used to deposit nickel without the use of an electric current. This article provides an overview of the solution composition and characteristics of the electroless nickel bath. It focuses on the metallurgical, mechanical and physical properties of electroless nickel-phosphorus coatings and electroless nickel-boron coatings. The effect of electroless nickel coatings on the fatigue strength of steel is also described. The article includes information on the recommended pretreatment procedures for different ferrous alloys, aluminum alloys, and copper alloys. It presents a detailed account of the equipment and various processes—including bulk and barrel plating—involved in electroless nickel plating, and discusses hydrogen relief methods. The article includes a comprehensive table on nickel plating applications, and concludes with information on electroless nickel coatings on composites and plastics.

This article reviews the classical models for the pseudo-steady-state temperature distribution of the thermal field around moving point and line sources. These include thick- and thin-plate models and the medium-thick-plate model. The analytical solutions to the differential heat flow equation under conditions applicable to fusion welding are provided. The article also provides an overview of the factors affecting heat flow in a real welding situation using the analytical modeling approach because this makes it possible to derive relatively simple equations that provide the required background for an understanding of the temperature-time pattern.

Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

Electroplated silver is used in both decorative and functional applications, such as engineering and electrical/electronic applications. This article explains the solution formulations and specifications of electrolytes used in silver plating.

This article discusses the fundamentals of electroplating processes, including pre-electroplating and surface-preparation processes. It illustrates the four layers of a plating system, namely, top or finish coat, undercoat, strike or flash, and base material layers. The article describes various plating methods, such as pulse electroplating, electroless plating, brush plating, and jet plating. It reviews the types of electrodeposited coatings, including hard coatings and soft coatings. The article also details the materials available for electroplating, including electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion on the common issues encountered with electroplating.

This article provides a detailed account of the various alkaline and acid plating baths used for electrolytic copper plating. Dilute cyanide and Rochelle cyanide baths, high-efficiency sodium and potassium cyanide baths, alkaline noncyanide copper plating baths, and alkaline copper pyrophosphate baths, are discussed. The article reviews acid plating baths such as copper sulfate bath and copper fluoborate bath. It also presents information on the surface preparation considerations, bath composition, and operating variables of copper plating as well as the equipment used.

This article describes the steps, bath composition and characteristics, equipment, plating rate, deposit thickness, and applications for different types of nonelectrolytic deposition processes, including electroless nickel plating, electroless copper plating and mechanical plating.

The electroplating of platinum-group metals (PGMs) from aqueous electrolytes for engineering applications is limited principally to palladium and, to a lesser extent, to platinum, rhodium, and thin layers of ruthenium. This article provides a discussion on the plating operations of these PGMs along with the types of anodes used in the process.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.