This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article describes the characteristics of continuous cathodic arc sources and filtering process for removing macroparticles from a cathodic arc. It provides information on the types of arc sources and the properties of deposited materials. The advantages, limitations, and applications of arc deposition are also discussed.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article provides an overview of plasma surface treatments for plastics. It covers the equipment and methods used in plasma processing, providing detailed explanations of the plasma discharge reactions and how they affect surface state and topography. It also provides information on contamination removal, plasma surface modification, plasma-induced grafting, and plasma film deposition.

This article describes two variations of carbon-base coatings: diamondlike carbon (DLC) coatings and polycrystalline diamond (PCD) coatings. It discusses the basics of a few deposition methods as they apply to industrially relevant coatings. The methods include deposition of tungsten-containing hydrogenated amorphous carbon films, deposition of tetrahedral amorphous carbon films, and deposition of silicon-incorporated hydrogenated amorphous carbon films. The most common deposition technologies for diamond films are also discussed. The article provides information on surface preparation for DLC and diamond deposition. It also provides a discussion on the coating composition and structure, mechanical and tribological properties, and applications of DLC and diamond coatings. The quality control techniques for DLC and diamond coatings are specified to meet customer requirements and ensure repeatable quality.

This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

Metallographic contrasting methods include various electrochemical, optical, and physical etching techniques, which in turn are enhanced by the formation of a thin transparent film on the specimen surface. This article primarily discusses etching in conjunction with light microscopy and describes several methods for film formation, namely, heat tinting, color etching, anodizing, potentiostatic etching, vapor deposition, and film deposition by sputtering. It provides information on the general procedures and precautions for etchants and reagents used in metallographic microetching, macroetching, electropolishing, chemical polishing, and other similar operations.

This article describes the four major conditions that can cause beryllium to corrode in air. These include beryllium carbide particles exposed at the surface; surface contaminated with halide, sulfate, or nitrate ions; surface contaminated with other electrolyte fluids; and atmosphere that contains halide, sulfate, or nitrate ions. The article provides information on the behavior of beryllium under the combined effects of high-purity water environment, stress and chemical environment, and high-temperature environment. The compositions of the structural grades for intentionally controlled elements and major impurities are tabulated. The article discusses the in-process problems and procedures that are common but avoidable when processing beryllium and aluminum-beryllium composites. It also describes the types of coatings used on beryllium and aluminum-beryllium. These include chemical conversion coatings, anodized coatings, plated coatings, organic coatings, and plasma-sprayed coatings.

Identification of alloys using quantitative chemical analysis is an essential step during a metallurgical failure analysis process. There are several methods available for quantitative analysis of metal alloys, and the analyst should carefully approach selection of the method used. The choice of appropriate analytical techniques is determined by the specific chemical information required, the condition of the sample, and any limitations imposed by interested parties. This article discusses some of the commonly used quantitative chemical analysis techniques for metals. The discussion covers the operating principles, applications, advantages, and disadvantages of optical emission spectroscopy (OES), inductively coupled plasma optical emission spectroscopy (ICP-OES), X-ray spectroscopy, and ion chromatography (IC). In addition, information on combustion analysis and inert gas fusion analysis is provided.

This article focuses on transport phenomena and modeling approaches that are specific to vapor-phase processes (VPP). It discusses the VPP for the synthesis of materials. The article reviews the basic notions of molecular collisions and gas flows, and presents transport equations. It describes the modeling of vapor-surface interactions and kinetics of hetereogeneous processes as well as the modeling and kinetics of homogenous reactions in chemical vapor deposition (CVD). The article provides information on the various stages of developing models for numerical simulation of the transport phenomena in continuous media and transition regime flows of VPP. It explains the methods used for molecular modeling in computational materials science. The article also presents examples that illustrate multiscale simulations of CVD or PVD processes and examples that focus on sputtering deposition and reactive or ion beam etching.

This article describes the nitriding methods of titanium alloys such as plasma nitriding and gas nitriding. It focuses on the interaction of titanium alloys, interaction of titanium with nitrogen, and the interaction of titanium with oxygen, carbon, and hydrogen. The article provides information on the wear and fatigue properties and corrosion resistance of nitrided titanium alloys, as well as the effect of nitriding on the biocompatibility of titanium. It also compares plasma-nitrided titanium alloys with alloy steels. It concludes with a short discussion on the effect of nitriding on the surface properties of titanium and two-phase α + β alloys.

This article discusses the capabilities and limitations of various material characterization methods that assist in the selection of a proper analytical tool for analyzing particulate materials. Commonly used methods are microanalysis, surface analysis, and bulk analysis. The techniques used for performing microanalysis include scanning electron microscopy and electron probe X-ray microanalysis. The article describes surface analysis techniques, including Auger electron spectroscopy, X-ray photoelectron spectroscopy, and ion-scattering spectroscopy. Bulk analysis techniques, such as X-ray powder diffraction, inductively coupled plasma atomic emission spectroscopy, atomic absorption spectroscopy, and atomic fluorescence spectrometry, are also discussed.

Chemical-mechanical planarization (CMP) of metals is described as mechanically accelerated corrosion, erosion corrosion, or metallic corrosion enhanced by wear. This article reviews the history, process, chemistry, electrochemistry, and defect issues for CMP. It provides an overview of CMP through a schematic illustration of CMP process equipment. The applications of CMP to tungsten and copper alloys are of prime interest in the semiconductor industry. The article discusses copper CMP and tungsten CMP in detail and analyzes polishing mechanism during CMP by application of direct current potentiodynamic polarization and alternating current impedance measurements. It concludes with information on chemically induced defects such as pitting corrosion, galvanic corrosion, and chemical etching.

This article presents general design principles for different types of surface-finishing processes, such as cleaning, organic coatings, and inorganic coatings applied by a variety of techniques. It discusses the factors that influence the selection of surface-finishing processes. These include fabrication processes, size, weight, functional requirements, and design features. The article discusses the design as an integral part of manufacturing. It contains tables that summarize the design limitations for selected surface-preparation, organic finishing, and inorganic finishing processes.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

This article provides an overview of curing techniques, adhesive chemistries, surface preparation, adhesive selection, and medical applications of adhesives. The curing techniques are classified into moisture, irradiation, heat, and anaerobic. The article highlights the common types of curable adhesives used for medical device assemblies, including acrylics, cyanoacrylates, epoxies, urethanes, and silicones. Other forms of adhesives, such as hot melts, bioadhesives, and pressure-sensitive adhesives, are also discussed. The typical characteristics and applications of biocompatible medical device adhesives are listed in a table. The article concludes with a section on the selection of materials for medical adhesives.

This article reviews cleaning and finishing operations that have proven to be effective on titanium, its alloys, and semi-fabricated titanium products. It explains how to remove scale, tarnish films, grease, and other soils and how to achieve required finishes and/or improve wear and oxidation resistance through the use of polishing, buffing, and wire brushing operations. The article also covers a wide range of surface modification and coating processes, including ion implantation, diffusion, chemical and physical vapor deposition, plating, anodizing, and chemical conversion coatings as well as sprayed and sol-gel coatings and laser and electron-beam treatments.